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| Part Number | Manufacturer | Description | |||||
| 1. |  RES-25 |
Cooper Bussmann | 25A:600V:SubMiniature Fuse | 247.51 Kb | 4 Pg. | ||
| 2. | RES-250 |
Cooper Bussmann | 250A:600V:Renewable | 247.51 Kb | 4 Pg. | ||
| 3. | RES-250-R |
Cooper Bussmann | 250A:600V:Renewable | 247.51 Kb | 4 Pg. | ||
| 4. | RES-25-R |
Cooper Bussmann | 25A:600V:SubMiniature Fuse | 247.51 Kb | 4 Pg. |
| « Previous 1 Next » |
| 1. |  247.51 Kb • 4 Pages |
Abstract: ... RES-3 RES-25 RES-90 RES-300. RES-4 RES-30 RES-100 RES-350. RES-5 RES-35 RES-110 RES-400. RES-6 RES-40 RES-125 RES-450. RES-8 RES-45 RES-150 RES-500. RES-10 RES-50 RES-175 RES-600. RES-12 RES-60 ... Labels: RES-25 |
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| 2. |  121.5 Kb • 14 Pages |
Abstract: ... R9, 10 RES 25.5 OHM 1/4 W 1% METAL FILM (TH) YAGEO 25K5 MF-1/4W-B 1% TP1-12 HEADER 1X1 (1 PIN) BERG 68000-240-1. T1 TRANSFORMER HALO TD75-1406K. SOCKET FOR T1 SOCKET, 16 PIN MACHINED LOW PROFILE AUGAT ... Labels: RES-25 |
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| 3. |  234.89 Kb • 16 Pages |
Abstract: ... RES 25 — — Reserved. RES should be left unconnected. S4 / 16 14 I TTL. Speed switch. S4 / 16 specifies the token-ring data rate. H = 4-Mbps data rate L = 16-Mbps data rate. TCLK TMS TDI TDO. 43 42 45 46. I I I. O. TTL ... Labels: RES-25 |
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| 4. |  225.08 Kb • 15 Pages |
Abstract: ... RES 25 — — Reserved. RES should be left unconnected. S4 / 16 14 I TTL. Speed switch. S4 / 16 specifies the token-ring data rate. H = 4-Mbps data rate L = 16-Mbps data rate. TCLK TMS TDI TDO. 43 42 45 46. I I I. O. TTL ... Labels: RES-25 |
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| 5. |  1158.96 Kb • 55 Pages |
Abstract: ... BIN0 28 ADDR 27 CLOCK 26 RES 25. SDX 24 CODE 23 PLLF 22 BIN1 21. AIN1 20 VREF1 19 XDN1 18 GNDa1 17. 1. N.C.. 2. AOUT3. 3. VDD. a3. 4. N.C.. 5. BOUT3. 6. CL15 PDM3. GND. d1. 7 8. XOUT. 9. XIN. 10. VDD. d1. 11. N.C.. 12. BOUT1. 13. N.C.. 14. VDD. a1. 15. AOUT1 ... Labels: RES-25, Cross Reference |
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| 6. |  940.71 Kb • 47 Pages |
Abstract: ... 12 RES 25 PA2. 13 VDD. * The IC substrate should be connected to VSS in the PCB layout artwork. * The TMR pad must be bonded to VDD or VSS if the TMR pad is not used. HT48R12. 4 18th July ’97. Package & Pin Assignment ... Labels: RES-25 |
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| 7. |  758.45 Kb • 52 Pages |
Abstract: ... BIN0 28 DIN 27 CLOCK 26 RES 25. SDX 24 CODE 23 PLLF 22 BIN1 21. AIN1 20 VREF1 19 XDN1 18 GNDa1 17. 1. res. 2. AOUT3. 3. VDD. a3. 4. TEST. 5. BOUT3. 6. CL15 PDM3. GND. d1. 7 8. XOUT. 9. XIN. 10. VDD. d1. 11. SCS. 12. BOUT1. 13. ADDR1. 14. VDD. a1. 15. AOUT1 ... Labels: RES-25, Application Notes |
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| 8. |  892.94 Kb • 47 Pages |
Abstract: ... 12 RES 25 PA2. 13 VDD. * The IC substrate should be connected to VSS in the PCB layout artwork. * The TMR pad must be bonded to VDD or VSS if the TMR pad is not used. 1. 14. 2. 15. 3. 16. 4. 17. 5. 18. 6. 19. 7. 20. 8. 21. 9. 22. 10. 23. 11. 24 ... Labels: RES-25, Application Notes |
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| 9. |  1651.13 Kb • 250 Pages |
Abstract: ... modulated component and color index on result bus: Res 31:26 color index (5:0) Res 25:24 color index (5:3) Res 23:12 modulated U component(11:0) Res 11:4 modulated V component(7:0) Res 3:0 modulated ... Labels: RES-25 |
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| 10. |  1232.28 Kb • 139 Pages |
Abstract: ... 103 SUS/RES 25 input. * * 26 control Control cell for pins 106‐155. 106 BL1 27 input. 107 BL2 28 input. 108 BL3 29 input. 109 BL4 30 input. 110 CD_A 31 input. 111 RDY_A 32 input. 112 WP_A 33 input. 113 BVD2_A 34 input ... Labels: RES-25, Application Notes |
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