QS32X383 QS32X2383 QS323X2383 AN-13 MDSL-00115-04 32X383 32X2383 - Datasheet Archive

 

Q QUALITY SEMICONDUCTOR, INC. QuickSwitch® Products High-Speed CMOS 20-Bit Bus Exchange QS32X383 QS32X2383 FEATURES/BENEFITS

 

QS32X383 QS32X383, QS32X2383 QS32X2383 Q QUALITY SEMICONDUCTOR, INC. QuickSwitch® Products High-Speed CMOS 20-Bit Bus Exchange QS32X383 QS32X383 QS32X2383 QS32X2383 FEATURES/BENEFITS DESCRIPTION · Enhanced N channel FET with no inherent diode to VCC · 5 bidirectional switches connect inputs to outputs · Zero propagation delay (QS32X383 QS32X383) · Zero ground bounce · Undershoot Clamp diodes on all control and switch pins · 20-bit Double-Width format · Bus exchange allows nibble swap · Zero ground bounce in flow-through mode · TTL-compatible input and output levels · Available in 48-pin, 150-mil QVSOP package · QS323X2383 QS323X2383 is 25 version for low noise The QS32X383 QS32X383 and QS32X2383 QS32X2383 provide two sets of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance (5) of the QS32X383 QS32X383 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The Bus Enable (BE) signals turn the switches on. The Bus Exchange (BX) signals provide nibble swap of the AB and CD pairs of signals. This exchange configuration allows byte swapping of buses in systems. It can also be used as a 10-wide 2-to-1 multiplexer and to create low delay barrel shifters, etc. APPLICATIONS · · · · ny pa The QS32X2383 QS32X2383 adds an internal 25 series termination resistor to each switch to reduce reflection noise in high speed applications. om C Resource sharing Crossbar switching Hot-docking (Application Note AN-13 AN-13) Voltage translation (5V to 3.3V; Application Note An-11) an w No Figure 1. Functional Block Diagram A0 C0 A5 C5 B0 D0 B5 D5 A4 C4 A9 C9 B4 D4 B9 D9 BXA BEA BXB BEB MDSL-00115-04 MDSL-00115-04 JULY 31, 1997 QUALITY SEMICONDUCTOR, INC. 1 QS32X383 QS32X383, QS32X2383 QS32X2383 Table 1. Pin Description Figure 2. Pin Configuration (All Pins Top View) Name I/O Function Ai, Bi I/O Buses A, B Ci, Di I/O Buses C, D BEn I Bus Switch Enable BXn I Bus Exchange QVSOP Table 2. Function Table BEA BXA A0-A4 B0­B4 H X Hi-Z Hi-Z L L C0­C4 D0­D4 Connect L H D0­D4 C0­C4 Exchange BEB BXB A5­A9 B5­B9 Function H X Hi-Z Hi-Z L L C5­C9 D5­D9 Connect L H D5­D9 C5­C9 Exchange Function Disconnect Disconnect BEA C0 A0 B0 D0 C1 A1 B1 D1 C2 A2 GND BEB C5 A5 B5 D5 C6 A6 B6 D6 C7 A7 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 No VCC D4 B4 A4 C4 D3 B3 A3 C3 D2 B2 BXA VCC D9 B9 A9 C9 D8 B8 A8 C8 D7 B7 BXB ny pa om C an w 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 Table 3. Absolute Maximum Ratings Supply Voltage to Ground . ­0.5V to +7.0V DC Switch Voltage VS . ­0.5V to +7.0V DC Input Voltage VIN . ­0.5V to +7.0V AC Input Voltage (for a pulse width 20ns) . ­3.0V DC Output Current Max. Sink Current/Pin . 120mA Maximum Power Dissipation . 0.5 watts TSTG Storage Temperature . ­65° to +150°C Note: ABSOLUTE MAXIMUM CONTINUOUS RATINGS are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum conditions is not implied. Table 4. Capacitance TA = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V Pins QVSOP Typ Max Unit Control Inputs 5 pF QuickSwitch Channels (Switch OFF) 2 3 5 7 pF Note: Capacitance is guaranteed, but not production tested. For total capacitance while the switch is ON, please see section 1 under "Input and Switch Capacitance." QUALITY SEMICONDUCTOR, INC. MDSL-00115-04 MDSL-00115-04 JULY 31, 1997 QS32X383 QS32X383, QS32X2383 QS32X2383 Table 5. DC Electrical Characteristics Over Operating Range TA = ­48°C to 85°C, VCC = 5.0V ± 5% Parameter Test Conditions Min Typ(1) Max Unit VIH Input HIGH Voltage Guaranteed Logic HIGH for Control Inputs 2.0 - - V VIL Input LOW Voltage Guaranteed Logic LOW for Control Inputs - - 0.8 V | IIN | Input Leakage Current (Control Inputs) 0 VIN VCC, Control Inputs - 0.01 1 µA | IOZ | Off-State Current (Hi-Z) 0 VOUT VCC, Switches OFF - 0.01 1 µA RON Switch ON Resistance(2) VCC = Min., VIN = 0.0V ION = 30mA 32X383 32X383 32X2383 32X2383 - 20 5 28 7 40 RON Switch ON Resistance(2) VCC = Min., VIN = 2.4V ION = 15mA 32X383 32X383 32X2383 32X2383 - 20 10 35 15 48 Pass Voltage(3) VCC = 5V, IOUT = ­5µA 3.7 4.0 4.2 V Symbol VP ny a mp Co Notes: 1. Typical values indicate VCC = 5.0V and TA = 25°C. 2. For a diagram explaining the procedure for RON measurement, please see Section 1 under "DC Electrical Characteristics." Max. value of RON guaranteed, but not production tested. 3. Pass voltage is guaranteed, but not production tested. an w Figure 3. Typical ON Resistance vs VIN at VCC = 5.0V (QS32X383 QS32X383) No 16 14 RON (ohms) 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (Volts) Note: For QS32X2383 QS32X2383, add 23 to RON shown. MDSL-00115-04 MDSL-00115-04 JULY 31, 1997 QUALITY SEMICONDUCTOR, INC. 3 QS32X383 QS32X383, QS32X2383 QS32X2383 Table 6. Power Supply Characteristics Over Operating Range TA = ­40°C to 85°C, VCC = 5.0V ± 5% Symbol Parameter Test Conditions(1) Max Unit ICCQ Quiescent Power Supply Current VCC = Max., VIN = GND or VCC, f = 0 3.0 mA ICC Power Supply Current per Input HIGH(2) VCC = Max., VIN = 3.4V, f = 0 per Control Input 2.5 mA QCCD Dynamic Power Supply Current per MHz(3) Vcc = Max., A and B Pins Open, Control Inputs Toggling @ 50% Duty Cycle 0.25 mA/ MHz Notes: 1. For conditions shown as Min. or Max., use the appropriate values specified under DC specifications. 2. Per TTL driven input (VIN = 3.4V, control inputs only). A, B, C, D pins do not contribute to ICC. 3. This current applies to the control inputs only and represents the current required to switch internal capacitance at the specified frequency. The A and B inputs generate no significant AC or DC currents as they transition. This parameter is guaranteed, but not production tested. ny pa Table 7. Switching Characteristics Over Operating Range om C TA = ­40°C to 85°C, VCC = 5.0V ± 5% CLOAD = 50pF, RLOAD = 500 unless otherwise noted. Symbol Description(1) Min QS32X383 QS32X383 Typ Max Min QS32X2383 QS32X2383 Typ Max Unit tPLH tPHL Data Propagation Delay(2,4) AiBi to CiDi, CiDi to BiAi - - 0.25(3) - - 1.5(3) ns tPZL tPZH Switch Turn-on Delay BE to Ai, Bi, Ci, Di 1.5 - 6.5 1.5 - 7.5 ns tPLZ tPHZ Switch Turn-off Delay(2) BE to Ai, Bi, Ci, Di 1.5 - 5.5 1.5 - 6.5 ns tBX tPHZ Switch Multiplex Delay BX to Ai, Bi, Ci, Di 1.5 - 6.5 1.5 - 7.5 ns an w No Notes: 1. See Test Circuit and Waveforms. Minimums guaranteed, but not production tested. 2. This parameter is guaranteed, but not production tested. 3. The time constant for the switch alone is of the order of 0.25ns for QS32X383 QS32X383 and 1.25ns for QS32X2383 QS32X2383 for CL = 50pF. 4. The bus switch contributes no propagation delay other than the RC delay of the ON resistance of the switch and the load capacitance. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 4 QUALITY SEMICONDUCTOR, INC. MDSL-00115-04 MDSL-00115-04 JULY 31, 1997