500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
TNETE2004PGJ Texas Instruments DATACOM, ETHERNET TRANSCEIVER, PQFP128, QFP-128 visit Texas Instruments
LM97593VH/NOPB Texas Instruments Dual ADC / Digital Tuner / AGC 128-QFP -40 to 85 visit Texas Instruments Buy
TSB43AB21PDT Texas Instruments 2 CHANNEL(S), 400Mbps, SERIAL COMM CONTROLLER, PQFP128, PLASTIC, MO-136, QFP-128 visit Texas Instruments
TSB42AA4PDT Texas Instruments 1 CHANNEL(S), 400Mbps, SERIAL COMM CONTROLLER, PQFP128, PLASTIC, QFP-128 visit Texas Instruments
CLC5903VLA Texas Instruments RF/Microwave Up/Down Converter, RF/MICROWAVE DOWN CONVERTER, PLASTIC, QFP-128 visit Texas Instruments
CLC5903VLA/NOPB Texas Instruments Dual Digital Tuner/AGC 128-QFP -40 to 85 visit Texas Instruments

QFP Package 128 lead .5mm

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: . Package P a rt Lead S ty le N um ber Count D2 3320-40S3 3320-44S5 40 44 .610 , /(25.40) 1.050/(26.67) Package P a rt Lead S ty le N um ber Count 3322-44S7 , B ADVANCED QFP Adapters .025" (.635mm) Pitch - INTERCONNECTIONS 5 Energy Way, P.O. Box , advintcorp@aol.com Internet http://www.advintcorp.com Adapters for .025"(.635mm) Pitch QFP Devices 0 Features: â'¢ Adapters for .025" pitch and 0.5, 0.65, 0.8 & 1.Omm pitch QFP's (leaded gull wing type). â -
OCR Scan
3322-52S3 3322-52S4 3323-64S7

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm "] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP, 0.5mm gull-wing leads. For pin mapping see page 6 , socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package, orientation is not
Ironwood Electronics
Original
A54SX72A-FG484 SI-SX72-ACQ256SFG484 QFP Package 128 lead .5mm QFP 128 lead .5mm BGA reflow guide A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance 27X27 PC-BGA/QFP-SX72A-Z-01 FR4/G10 72A-CQ256

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 144 61 129 144 160 , 61 72 XC8103 128 32 61 64 XC8106 168 61 76 129 192 XC8109 208 61 129 192 11-2 84 133 196 June 1, 1996 (Version 1.1) Package Options PLCC JEDEC , Standard Lead Pitch Body Temperature Options Ordering Code XC7236A XC7272A XC7318 XC7336 XC7336Q
Xilinx
Original
XC7354 XC7372 XC73144 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance footprint jedec MS-026 TQFP 144 XC73108 XC9536 XC9572

schematic impulse sealer

Abstract: PCB footprint cqfp 132 The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead , Reel Packaging Package Type PLCC (Plastic Leaded Chip Carrier) SO (Plastic Small Outline) QFP , 112 61 77 XC4005L 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 , 196 August 6, 1996 (Version 1.2) Package Options PLCC JEDEC 50 mil Plastic PQFP EIAJ
Xilinx
Original
PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm xc4010e-pq208 footprint pga 84 XC4013E-PQ240 XC95108 XC95144 XC95180 XC95216 XC95288 XC95432

CXA1541M

Abstract: QFP Package 128 lead .5mm Through Hole Lead 1-direction Standard flat QFP QUAD FLAT L LEADED PACKAGE P C 1.0mm 0.8mm 0 65mm , CODE Package Name Type Package name Package Features Symbol Description Materni* Lead pitch Lead shape Lead pull D I P DUAL IN-LINE PACKAGE P C 2.54mm (100MIL) Through Hole Lead 2-direction S I P SINGLE IN LINE PACKAGE 0 P 2 54mm UOOMIL) Through Hole Lead 1-direction Standard Z I P ZIG ZAG IN-LINE PACKAGE 0 P 2 54mm (100MILI Zig-Zag in-line Through Hole Lead 1-direction Inserted PGA
-
OCR Scan
CXA1541M circuit diagram of MOD 64 counter 70MIL 50MIL

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead , Reel Packaging Package Type PLCC (Plastic Leaded Chip Carrier) SO (Plastic Small Outline) QFP , 112 61 77 XC4005L 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 , 196 August 6, 1996 (Version 1.2) Package Options PLCC JEDEC 50 mil Plastic PQFP EIAJ
Xilinx
Original
MO-83-AF PQFP moisture sensitive handling and packaging EFTEC-64 eftec 64 JEDEC MS-026 footprint EIA standards 481 XC95576 XC3020/A/L XC3120A XC3030/A/L XC3130A XC3042/A/L

SMD IC 2025 bl

Abstract: ssop64 MOUNTING TYPE PACKAGE QFP PLCC QFJ 3 CUSTOM PACKAGE IC TAB TAPE AUTOMATED BONDING TCP , Package Low profile Quad Flat L-Leaded Package QFP QFP QFP 1.0mm1.27mm QFP 1.4mm Small , L I 1. 1-5-2 1 QFP Quad Flat Package QFJ Quad Flat J-Leaded , , , , BONDING WIRE (Au WIRE) LEAD DIE PAD SUPPORT DIE PAD 93 2. (1) PLASTIC QFP mm QFP44-P , SKINNY DIP ZIP SOP QFJ SOJ QFP TSOP TCP TQFP/LQFP BGA/LGA SSOP CSP
OKI Electric Industry
Original
SMD IC 2025 bl ssop64 DIP16-C-300-2 MK 50075 N D560 IC51-2084-1052-11 J2T0011-38-60 1998OKIELECTRICINDUSTRYCO J2T0002-38-60 IC107-4004-G SOJ-40-1 IC107-4204-G

BGA reflow guide

Abstract: QFP Package 128 lead .5mm 26 A C E G BGA J L N R U W AA AC AE 64 129 128 65 This package , "] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View , onto the socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package , BGA Package Shoulder screw Socket lid screws, DO NOT ADJUST B Socket / Elastomer assembly
Ironwood Electronics
Original
A54SX32A-FG484 SI-SX32-ACQ256SFG484 A54SX32A-CQ256 PC-BGA/QFP-SX32A-Z-01 32A-CQ256

mb87020

Abstract: tag 9335 (V) 3.3 I/O Level LVTTL/ SSTL Package 100-pin QFP Fujitsu Microelectronics, Inc , +3 SSOP 20P, 34P Package QFP SQFP 48P 64P Package: P - Plastic, C - Ceramic 14 , Development Flowchart (MCM/MCP) Multichip Module (MCM) Multichip Package (MCP) Advanced Packaging , ) I/O Level Package N/A 5 74 68 TTL/ 3 State TTL 18-pin DIP 26-pin SOJ 20 , 93 I/O Level Package TTL/ 40-pin SOJ 3 State TTL 44-pin TSOP TTL/ 40-pin SOJ 3 State
Fujitsu
Original
mb87020 tag 9335 MB87086 MB87086A FPF21C8060UA-92 2M X 32 Bits 72-Pin Flash SO-DIMM SD-SG-20342-9/96

FBGA-484

Abstract: actel FG484 package mechanical drawing 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket , coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA , pattern. The emulator foot emulates the physical characteristics of a QFP gull wing package very closely , has a larger thermal mass than an actual QFP package, and therefore, may require longer reflow time , - Gull Wing Surface mount Foot Soldering Instructions 5). Appendix D ­ CQ256 Package Pin Assignment
Actel
Original
FG484 FBGA-484 actel FG484 package mechanical drawing silicone paste p4 B22 filament base land pattern QFP 208 FBGA484 SI-SX72ACQ256SFG484 RT54SX32S-CQ256 A54SX72ACQ256 RT54SX72S-CQ256

mb89371

Abstract: MB89371AH products (small package) MB89193AH ROM 8 KB RAM 256 B MB89191AH ROM 4 KB RAM 128 B MB89191A ROM , > Part number Operating power supply voltage (V) Package QFP 48P - 48P - MB89125A , Part number Operating power Package supply voltage* SH-DIP QFP MQFP (V) MB89131 , MB2144-230) Part number Package Operating power supply voltage (V) SH-DIP SSOP QFP 32P , temperature range: -40°C to +85°C Package SH-DIP QFP LQFP MDIP 64P
Fujitsu
Original
PG00-00072-3E mb89371 MB89371AH mb89371a Visitor counter a calculator LCD display china usb dvd player repair guide

Dt3 dual transistor

Abstract: QFP Package 128 lead .5mm ) Zig-Zag in-line Through Hole Lead 1-direction Standard flat QFP QUAD FLAT L LEADED PACKAGE P C 1.0mm , Description Malenal* Lead pitch Lead shape Lead pull D I P DUAL IN-LINE PACKAGE P C 2.54mm (100MIL) Through Hole Lead 2-direction S I P SINGLE IN LINE PACKAGE 0 P 2 54mm UOOMIL) Through Hole Lead 1-direction Standard Z I P ZIG ZAG IN-LINE PACKAGE 0 P 2 54mm (100MILI Zig-Zag in-line Through Hole Lead 1-direction Inserted PGA PIN GRID ARRAY C 2.54mm (100MIL) Through Hole Lead Package under side PIGGY BACK PIGGY
-
OCR Scan
CXA1474M CXA1474N Dt3 dual transistor for Operational Amplifier CXA1474M/N 000S7

ZTE DSLAM configuration

Abstract: BCM56800 PACKAGE DIMENSION PI7C8140A 4 128-pin, 14 X 20mm, QFP PI7C8148A 4 160-pin, 15 X 15mm, BGA PI7C8152B 4 160-pin, 31 X 31mm, QFP PI7C8150B 8 256-pin, 17 X 17mm, BGA , Industry First Packet Switch in QFP package Cost Effective QFP package for volume applications PCIe , , Analog, Mixed Signal IC's Frequency Control Products Over 1000 Products Available Including Lead , Power ­
Pericom Semiconductor
Original
ZTE DSLAM configuration BCM56800 INVENTEC ericsson atca HUAWEI Base Station PI7C9X20505GP PI2PCIE2412 PI3PCIE2412FT PI2PCIE2422 PI3L500A

KSZ8692

Abstract: 27mhz rf amplifier MOSFET to220 2mm, 3mm x 3mm and 4mm x 4mm package options. Founded in 1978, Micrel maintains a portfolio of , Custom and semi-custom products Big Technology, Small Package Innovation In response to increasing , IOUT VIN VOUT IGND (Typ.) VDROPOUT (Typ.) Package MIC5231 10mA 3.5V to 12V , .) VDROPOUT (Typ.) Package Comments MIC5207 180mA 2.5V to 16V 1.8, 2.5, 2.8, 2.9, 3.0, 3.1 , , 1.65, 1.8, 2.5, 3.3 17mA 325mV SPAK Fixed Voltage in 3-pin Package. Yes MIC37151
Micrel Semiconductor
Original
KSZ8692 27mhz rf amplifier MOSFET to220 SMD transistor 2x sot 23 27mhz remote control transmitter circuit PQFP-128 footprint KSZ8851SNL M0009-012809

CDB455

Abstract: QFP Package 128 lead .5mm Through Hole Lead 1-direction Standard flat QFP QUAD FLAT L LEADED PACKAGE P C 1.0mm 0.8mm 0 65mm , 122 - Package Name Type Package name Package Features Symbol Description Malenal* Lead pitch Lead shape Lead pull D I P DUAL IN-LINE PACKAGE P C 2.54mm (100MIL) Through Hole Lead 2-direction S I P SINGLE IN LINE PACKAGE 0 P 2 54mm UOOMIL) Through Hole Lead 1-direction Standard Z I P ZIG ZAG IN-LINE PACKAGE 0 P 2 54mm (100MILI Zig-Zag in-line Through Hole Lead 1-direction Inserted PGA
-
OCR Scan
CXA1184M CXA1184N CDB455 CDB455C3 CXA1184M/N S0P-20P-L01 VS0P-20P-L01 E88Z43-T0

82437fx

Abstract: A7CA Path to Memory - 4 Mbytes to 128 Mbytes Main Memory - EDO/Hyper Page Mode DRAM (x-2-2-2 Reads) or , QFP for the 82437FX System Controller (TSC); 100 Pin QFP for Each 82438FX Data Path (TDP) Supported , line status bits. For the TSC's DRAM controller, five rows are supported for up to 128 Mbytes of main , .48 5.0 PINOUT AND PACKAGE INFORMATION , . 53 5.3 82437FX Package Dimensions
-
OCR Scan
A7CA 82430FX 256-K 512-K

ksz8863 EVAL BOARD

Abstract: KSZ8863 ® 2x2mm, 3x 3mm and 4x4mm package options. Founded in 1978, Micrel maintains a portfolio of world , , Small Package Innovation In response to increasing demands for smaller and smaller footprint , Thermal shutdown and current-limit protection Available in a 32-pin 5 x 5mm MLF® package -40ºC to +125ºC , 12V 2.75, 3.0, 3.3, 5.0 VDROPOUT (Typ.) Package Comments µCaP SOT-23 Yes MIC5232 , .) Device IOUT VIN VOUT VDROPOUT (Typ.) Package Comments µCaP MIC5376 New! 150mA 2.5V to
Micrel Semiconductor
Original
ksz8863 EVAL BOARD KSZ8863 nu-horizons KSZ9021RLI KSZ8041NLI transistors sot-223 06a 747-NUHO M0009-012910

82430FX

Abstract: 82438FX Controller 64-Bit Data Path to Memory 4 Mbytes to 128 Mbytes Main Memory EDO Hyper Page Mode DRAM (x , Testing Y 208 Pin QFP for the 82437FX System Controller (TSC) 100 Pin QFP for Each 82438FX Data , up to 128 Mbytes of main memory The TSC's optimized PCI interface allows the CPU to sustain the , 4 7 Clock Generation and Distribution 4 7 1 RESET SEQUENCING 5 0 PINOUT AND PACKAGE INFORMATION 5 1 82437FX Pinout 5 2 82438FX Pinout 5 3 82437FX Package Dimensions 5 4 82438FX Package Dimensions
Intel
Original
290518 be5119 AD11 AD12 82371FB 82438

82437fx

Abstract: MAS 10 RCD programming - 64-Bit Data Path to Memory - 4 Mbytes to 128 Mbytes Main Memory - EDO/Hyper Page Mode DRAM (x , Pin QFP for the 82437FX System Controller (TSC); 100 Pin QFP for Each 82438FX Data Path (TDP , line status bits. For the TSC's DRAM controller, five rows are supported for up to 128 Mbytes of main , known as Hyper Page Mode) mem ory. The DRAM interface supports 4 Mbytes to 128 Mbytes with five RAS , CPU-to-main memory performance while maintaining a small package footprint (100 pins each). PCI Interface The
-
OCR Scan
MAS 10 RCD programming

2SKI34

Abstract: westinghouse Package (QFP) P: Plastic Standard Dual Inline Package (DIP) M: Plastic Small Outline Package (SOP) E , w er supply current (m A ) Package (no. o f pins) DIP QFP PLCC TMPZ84C01 1AF-6 , Package types - F: Plastic Flat Package (QFP), T: Plastic Leaded Chip Carrier (PLCC), N: Plastic Shrink DIP (SDIP), G: Ceramic Flat Package (QFP) TLCS-85 Family (CMOS) Type No. Function TMP82C37AO , ), F: Plastic Flat Package (QFP), N: Plastic Shrink DIP (DIP), M: Plastic Small Outline Package (SOP
-
OCR Scan
2SKI34 westinghouse TA8515 TOSHIBA DIODE CATALOG LSI LOGIC product catalog CTC 313 transistor pin diagram J22587 90-3D
Showing first 20 results.