NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: , 1.8, 3.3 V HL82572EI HL82572EI HL82571EB HL82571EB - Intel® 82583V 9x9 mm 64-pin QFN 9x9 mm 64-pin QFN 6x6 mm , PBGA 8x8 mm 56-pin QFN 8x8 mm 56-pin QFN PCI-e 1.1 (2.5 Ghz) x1 PCI-e 1.1 (2.5 Ghz) x1 PCI Express , http://intel.com/go/ethernet Driver Support Microsoft Windows 7* Microsoft Windows Vista* (32 & 64 bit) Microsoft Windows XP* (32 & 64 bit) Microsoft Windows CE* Microsoft Windows NT* Microsoft Windows 2000 Server* Microsoft Windows Server 2003* (32 & 64 bit) SCO UnixWare* 7.x Open Unix* 8.0 Novell ODI ... | Original |
2 pages, |
JL82599ES 82575EB RC82573 Serdes IEEE standard 82573l pxe 82572ei WG82583 82574IT2 GD82541PI JL82576EB JL82599EB WG82583V WG82574 82541PI Gigabit Ethernet Controller datasheet abstract |
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| Abstract: LeadFrame® (MLF®/QFN/SON/DFN) Package · Small size (reduce package footprint by 50% or more and improved , only) 2x3 3x3 4x4 5x5 6x5 6x6 7x7 8x8 9x9 10 x 10 11 x 11 12 x 12 13 x 13 QFN / DFN / SON Leadcounts , ) Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with , 12 ld 28 ld 44 ld 52 ld 64 ld 124 ld Electrical 3x3 5 x 5 7x7 8 x 8 10 x 10 10 x 10 1 9 16 , 7 x 7 Longest 44 ld 7 x 7 Shortest 64 ld 10 x 10 Longest 64 ld 10 x 10 Shortest (nH) 0.564 0.531 ... | Original |
2 pages, |
Amkor Technology MLF footprint mlf QFN leadframe QFN 64 9x9 footprint qfn 76 PACKAGE footprint DUAL ROW QFN leadframe qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 76 9x9 footprint QFN 64 8x8 footprint datasheet abstract |
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| Abstract: Programmable up to 20dB 8x8 QFN (Footprint Compatible With GN1407 GN1407) 8x8 QFN (Footprint Compatible , 424M, 292M, 344M and 259M compliant. Future proof your design by using Gennum's QFN footprint , 350 350 350 350 Footprint Compatible With all 16 QFN EQs all 16 QFN EQs all 16 , (mm) 5x5 9x9 6x6 9x9 9x9 9x9 9x9 32 QFN 64 QFN 40 QFN 64 QFN 64 QFN 64 QFN 64 QFN Package 5 Gennum Fall 2009 Product Guide · Broadcast Video Cable ... | Original |
20 pages, |
EBK-GS2962-00 GN1406 GS2962 GS2961 hdmi SDI Gennum GS2988 Gennum GV8500 QFN-64 footprint GV8502 GENNUM GS2972 EBK-GS2972-00 gs2970 GS2965 GN4124 datasheet abstract |
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| Abstract: Operation 3.3 Volt I/O with 5V Input Tolerance 64-Pin TQFP or 56 Pin QFN Package; green, leadfree package , Hub ORDER NUMBER(S): USB2504/USB2504A-JD USB2504/USB2504A-JD FOR 64 PIN TQFP PACKAGE, USB2504/USB2504A-ABZJ USB2504/USB2504A-ABZJ FOR 56 PIN QFN PACKAGE AND USB2504/USB2504A-JT USB2504/USB2504A-JT FOR 64 PIN TQFP PACKAGE (GREEN, LEAD-FREE) 80 Arkay Drive , Pin TQFP Package Outline (10x10x1.4 mm body - 2 mm footprint) Table 1 64 Pin TQFP Package Parameters , 3 56 Pin QFN Package and Parameters SCALE 2/07/04 REV MO-56-QFN-8x8 2/07/04 ... | Original |
6 pages, |
QFN 64 8x8 dimension MO-220 jedec package MO-220 0.4 pitch 8x8 64 footprint USB2504A-JT USB2504A QFN 64 8x8 footprint MO-220 8x8 USB2504/USB2504A USB2504/USB2504A abstract |
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| Abstract: (QFN) Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed , written generically to encompass various Quad Flat Pack No-lead (QFN) packages assembled internally and , PACK NO-LEAD (QFN) PACKAGE 3.1 Package Description The QFN package is a lead-less, near Chip Scale , performance. QFN is a surface mount plastic package with leads located at the bottom of the package. A thermally enhanced QFN with an exposed die pad is available and is denoted as QFN-EP. The suffix "EP" ... | Original |
32 pages, |
qfn 5x5 thermal resistance EIA-783 4914 smd JEDEC JESD51-8 BGA land pattern BGA 0.75 jedec package MO-220 32 5x5 32 pins qfn 5x5 footprint QFN PACKAGE thermal resistance qfn 44 7x7 PACKAGE footprint MO-220 8x8 Motorola MAP QFN EIA and EIAJ standards 783 AN1902/D AN1902/D abstract |
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| Abstract: 36 38 44 48 · 52 Line-up 64 68 PKG size (mm) 5X5 6X6 7X7 8X8 9X9 7X7 , Heat Sink 11 12 WPAK 13 LQFP 14 QFN 2.5 15 FBGA Products HQFP LFPAK , Package FBGA TQFP Fine Pitch Ball Grid Array Thin Quad Flat Package MCP 1.0 QFN , ) 3.0 TQFP family BGA family 100 LQFP QFN family TQFP TQFP QFN TQFP family QFN family LGA family QFN BGA 1.0 BGA LGA LGA LGA family Under development ... | Original |
21 pages, |
sandisk ultra ii HLQFP 144 LFPAK footprint Renesas lga 4x4 footprint MO-235 pin diode do34 qfn 44 PACKAGE footprint 7x7 QFP Package 80 lead renesas mosfet Sandisk TSOP HLQFP 176 Package 1000-pin bga 0,8 mm footprint WSON datasheet abstract |
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| Abstract: I2C EEPROM Programmable up to 20dB 8x8 QFN (Footprint Compatible With GN1407 GN1407) 8x8 QFN , 424M, 292M, 344M and 259M compliant. Future proof your design by using Gennum's QFN footprint , 350 Footprint Compatible With - all 16 QFN EQs all 16 QFN EQs all 16 QFN EQs all , Size (mm) 5x5 9x9 6x6 9x9 9x9 9x9 32 QFN 64 QFN 40 QFN 64 QFN 64 QFN 64 QFN Package www.gennum.com 6 Optical Modules Extend the reach of 3Gb/s-SDI over ... | Original |
20 pages, |
Gennum GS2964 GX3290 GS2989 GS2994 QFN 64 9x9 footprint GN4124 GS2965 GS2960A GN1406 GO2918 GX3146 GS2970A GS2988 QFN 64 8x8 footprint datasheet abstract |
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| Abstract: Power · Small Package Footprint · High Logic Density 4 IGLOO nano · Low Power · Small Package Footprint 5 IGLOO PLUS · Low Power · Small Package Footprint · High I/O-to-Logic Ratio , Small Package Footprint · High Performance · Low Cost 8 ProASIC3L · · · · 9 , FG144 FG144 FG256 FG256 FG484 FG484 FG256 FG256 FG484 FG484 FG484 FG484 FG896 FG896 1 Package Pins UC CS QFN UC81 CS81 , quick time-to-market in low power and small footprint profiles. · Ultra-low power in Flash*Freeze ... | Original |
23 pages, |
jtag cortex schematic oled display 96x16 QN132 QFN 64 8x8 footprint qfn 20 5x5 Atmel footprint A2F500M3G-FGG484 BGA A3P1000 144 AFS600-FG256 delta modulation tutorial ARM JTAG Programmer Schematics ACTEL flashpro A3PE jtag connector datasheet abstract |
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| Abstract: ®/e · Low Power · Small Package Footprint · High Logic Density 4 IGLOO nano · Low Power · Small Package Footprint 5 IGLOO PLUS · Low Power · Small Package Footprint · High I , nano · Small Package Footprint · High Performance · Low Cost 8 ProASIC3L · · · · 9 , FG484 FG484 FG896 FG896 1 Package Pins UC CS QFN UC81 CS81 QN48 QN68 QN132 QN132 VQ100 VQ100 QN68 IGLOO , FPGA advantages of flexibility and quick time-to-market in low-power and small footprint profiles. · ... | Original |
23 pages, |
A2F200M3F 96x16 CORE8051 CS81 PWM fan connector footprint QN68 QN132 QFN 64 8x8 footprint A3PE-BRD1500 A3PE1500-PQ208 actel smart fusion A2F200M3F-FGG484 BGA A3P1000 144 ACTEL flashpro datasheet abstract |
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| Abstract: light system displays images of both the QFN leads and the footprint on the PCB. The two superimposed , (QFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and , generically to encompass various Quad Flat Pack No-lead (QFN) packages assembled internally and externally. , . .1 3.0 3.1 3.2 3.3 3.4 Quad Flat Pack No-Lead (QFN) Package . . . . .2 Package , . . .2 QFN Package Design . . . . . . . . . . . . . . . . . . . . .2 Process Flow . . . . . . . . ... | Original |
31 pages, |
4914 smd AN1902 eia783 land pattern BGA 0.75 land pattern BGA 0.75 freescale MO-220 qfn 32 land pattern qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 QFN 56 7x7 footprint QFN 64 9x9 footprint QFN 9X9 JEDEC JESD51-8 BGA AN1902 abstract |
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