NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: ) TRAY STACKING DETAIL SCALE : 3/1 3.11 ITEM NO. CABGA 15X15 XXXXXXX * / DETAIL \ "G" REVISION , REVISIONS REV DESCRIPTION DATE APPROVED 02 ADDED NEW PACKAGE - BC/BCG 196 & BF/BFG 289 11/01 , SHALL CONFORM TO IDT SPEC MSA-3032 MSA-3032. 5. DAEWON PART NUMBER : BLACK TRAY : 12C-1515-119 12C-1515-119 RED TRAY , 95138 PHONE: (408) 284-8200 www.IDT.com fhm«»»-»» TITLE: BC/BCG 196 Sc. BF/BFG 208/289 SHIPPING TRAY , 1 OF 2 REVISIONS REV DESCRIPTION DATE APPROVED 02 ADDED NEW PACKAGE - BC/BCG 196 & BF/BFG 289 ... | OCR Scan |
2 pages, |
daewon CABGA 15X15 TRAY 15X15 daewon DAEWON tray drawing P7-246-000 P7-246-000 abstract |
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| Abstract: ) Package Packing STA260 STA260 LFBGA289 LFBGA289 Tray STA260TR STA260TR LFBGA289 LFBGA289 Tape & reel STA260-8x8 VFBGA244 VFBGA244 Tray 1. This device is Pb-Free ECOPACK® see Chapter 3: Package information. June 2007 , ) 2.5V capable I/OS STA260 STA260 is packaged in a Low profile Fine pitch Ball Grid Array (LFBGA 15x15) and , specification on a 4 layers board 3/7 Package information 3 STA260 STA260 Package information In order , package and on the inner box label, in compliance with JEDEC Standard JESD97 JESD97. The maximum ratings related ... | Original |
7 pages, |
STA210N sirius sdars radio tuner Package tray 15X15 LFBGA289 CMOS090 STA210 LFBGA 289 STA260 STA260 abstract |
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| Abstract: (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package thickness · Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution FEATURES DESCRIPTION , stacking 2 to 7 die in a single package. Die to die bonding capability enables device and signal integration to improve electrical performance and reduce overall package I/O requirements. Wafer thinning , flexibility to stack almost any desirable configuration of die in one package. This capability uses existing ... | Original |
2 pages, |
vFBGA* 96 bALL tray 8X14 chippac AN 7823 239.2 10x14 tray 23X23 VFBGA package tray VFBGA 120 datasheet abstract |
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| Abstract: FBGA Fine Pitch Ball Grid Array · Array molded, cost effective, space saving package solution · , ) maximum thickness · Laminate substrate based package which enables 2 and 4 layers of routing flexibility FEATURES DESCRIPTION · Thin, lightweight, space saving package STATS ChipPAC's Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package's reduced outline and ... | Original |
2 pages, |
vFBGA* 96 bALL JESD51-2 AN 7823 VFBGA package tray JESD51-9 datasheet abstract |
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| Abstract: ) 15x15 mm (PoP) 11x13 mm (MCP) 9 KF Package Markings 133 MHz K JF Package Type , deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those , to 1.95V Package: Flash access time: 80 ns for NOR Flash, 25 ns for ORNAND Flash 9.0 x 12.0 , Package 512 Mb 80 MHz 256 Mb 104 MHz (SDR) MCP 9 x 12 mm Type 2 NOR Flash + ORNAND , 160-ball 512Mb S72WS512PFFJF9GH S72WS512PFFJF9GH Package 66 MHz x16 MCP 11 x 13 mm 137-ball Yes Type ... | Original |
17 pages, |
S72WS512PEF JEP95 MCP NAND MCP NAND DDR NAND FLASH BGA S29WS-P S30MS-P S72WS-P S72WS256PD0 S72WS512PE0 130 MCP NAND DDR BGA 130 MCP NAND DDR S72WS-P abstract |
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| Abstract: Remarks Tray Shrink (Unit: mm) (10) 32 pin Package NEC Code EIAJ Code Lead pitch , Tray Shrink Shrink (Unit: mm) (14) 48 pin Package NEC Code EIAJ Code Lead pitch , Embossed Tape Remarks Tray Shrink (Unit: mm) (15) 64 pin Package NEC Code P64C-70-750A P64C-70-750A,C-3 , Embossed Tape Remarks Tray Shrink (Unit: mm) (1) 8 pin Package NEC Code P8DH-100-300A P8DH-100-300A,B-1 , Tape Remarks Tray CERDIP (Unit: mm) (2) 14 pin Package NEC Code EIAJ Code Lead pitch ... | Original |
240 pages, |
CDIP-22 MD-400 P-PGA-120 tray bga MD300-10A P32C-100-600A datasheet abstract |
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| Abstract: or deletion of a speed option, temperature range, package type, or VIO range. Changes may also , Package: Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz 8.0 x 11.6 mm MCP pSRAM Access time , CellularRAM Supplier 104 512 Package 80 64 CellularRAM Speed (MHz) Type 2 MCP 8 x , Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA , The package and/or data integrity may be compromised if the package body is exposed to temperatures ... | Original |
10 pages, |
S71WS512PD0HF3 S71WS512PC0HF3 S71WS512PC0 S71WS-P S29WS512P S29WS-P S71WS512PD0 S71WS-P abstract |
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| Abstract: or deletion of a speed option, temperature range, package type, or VIO range. Changes may also , voltage of 1.7 to 1.95V Package: Flash access time: 80 ns for NOR Flash 9.0 x 12.0 mm MCP , DRAM Speed DRAM Supplier Package S73WS512PD0HF64V S73WS512PD0HF64V 512 Mb 66 MHz 128 Mb 104 MHz , Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA , The package and/or data integrity may be compromised if the package body is exposed to temperatures ... | Original |
10 pages, |
S73WS-P S29WS256P S29WS-P S73WS-P abstract |
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| Abstract: or deletion of a speed option, temperature range, package type, or VIO range. Changes may also , ) Features Power supply voltage of 1.7 to 1.95V Package: Flash access time: 25 ns for ORNAND Flash , S72MS512PE0HF94V S72MS512PE0HF94V 512 Mb x8 Yes 256 Mb 104 MHz (SDR) Type 5 Package MCP 11x13mm 137-ball , D-DQS1 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory , cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to ... | Original |
10 pages, |
Spansion NAND Flash DIE Spansion NAND Flash S72MS512PE0HF94V S72MS-P S30MS-P nand sdram mcp MCP nand dram 130 MCP NAND DDR BGA 15X15 S72MS-P abstract |
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| Abstract: numbers available, such as the addition or deletion of a speed option, temperature range, package type , ns Package: Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz 8.0 x 11.6 mm MCP , Package 104 Type 2 84 ball MCP 8x11.6x1.2 mm 104 Type 2 84 ball MCP 8x11.6x1.2 mm , Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in , methods. The package and/or data integrity may be compromised if the package body is exposed to ... | Original |
12 pages, |
spansion top marking S29WS-P S29WS128P S29WS256P S29WS512P S71WS-P S71WS128PC0 S71WS256PC0 S71WS256PC0hf S71WS512PC0 S71WS512PD0 Spansion MCP products, 56 BGA Package 14x14 66 ball nor flash S71WS-P abstract |
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| UTOPIA section uses 2.5V power supply. All I/O are 3.3V tolerant. 196 LBGA package, 15x15x1.37 mm, 1 /N 92UT16 92UT16 92UT16 92UT16 General Description Features Datasheet Package & Models Samples & Pricing Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Format Type Pins MSL .ibis 250+ $18.00 tray of 119 NSUZXYYTT DS92UT16TUF DS92UT16TUF DS92UT16TUF DS92UT16TUF BBBBB 8-9 weeks 1000 General Description The DS92 www.datasheetarchive.com/files/national/pf/ds92ut16.html |
National | 17/02/2005 | 11.76 Kb | HTML | ds92ut16.html |
| supply. Digital UTOPIA section uses 2.5V power supply. All I/O are 3.3V tolerant. 196 LBGA package, 15x15x1.37 mm, 1.0 mm ball pitch [Information as of 11-Sep-2003] Website /N 92UT16 92UT16 92UT16 92UT16 General Description Features Datasheet Package & Models Samples & Pricing If you have trouble printing or viewing PDF file(s), see Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders www.datasheetarchive.com/files/national/ds92ut16.html |
National | 25/09/2003 | 12.62 Kb | HTML | ds92ut16.html |
| power supply. All I/O are 3.3V tolerant. 196 LBGA package, 15x15x1.37 mm, 1.0 mm ball pitch Description Features Datasheet Package & Models Samples & Pricing Parametric Table trouble printing or viewing PDF file(s), see Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type Pins MSL/Lead-Free Availability Lead Time Qty SPICE IBIS Qty $US www.datasheetarchive.com/files/national/ds92ut16.htm |
National | 27/02/2004 | 11.52 Kb | HTM | ds92ut16.htm |
| supply. Digital UTOPIA section uses 2.5V power supply. All I/O are 3.3V tolerant. 196 LBGA package, 15x15x1.37 mm, 1.0 mm ball pitch [Information as of 24-Oct-2002 /N 92UT16 92UT16 92UT16 92UT16 General Description Features Datasheet Package & Models Samples & Pricing PDF file(s), see Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package www.datasheetarchive.com/files/national/htm/nsc01863-v5.htm |
National | 01/11/2002 | 17.69 Kb | HTM | nsc01863-v5.htm |
| power supply. All I/O are 3.3V tolerant. 196 LBGA package, 15x15x1.37 mm, 1.0 mm ball pitch /N 92UT16 92UT16 92UT16 92UT16 General Description Features Datasheet Package & Models Samples & Pricing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type Pins MSL SPICE IBIS LBGA 196 MSL Preliminary N/A N/A 250+ $39.9000 tray of 119 [logo]¢U¢Z¢3¢T¢P DS92UT16TUF DS92UT16TUF DS92UT16TUF DS92UT16TUF ¢B www.datasheetarchive.com/files/national/htm/nsc02969-v5.htm |
National | 16/08/2002 | 15.59 Kb | HTM | nsc02969-v5.htm |
| Programming Support Packages and Thermal Characteristics Testing, Quality, and Reliability Technical Support HardWire Products 9 Military Products 10 Programming Support 11 Packages and Thermal Characteristics 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Bundled Packages Product Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 Packages and Thermal Characteristics Packages and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 Development Systems: Bundled Packages Product Descriptions Foundation Series: Foundation Base www.datasheetarchive.com/download/90212243-999460ZC/dbookold.zip (DBOOKOLD.PDF) |
Xilinx | 07/09/1996 | 10340.01 Kb | ZIP | dbookold.zip |