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PVDF outgas

Catalog Datasheet MFG & Type PDF Document Tags

DIN-50021

Abstract: SHT10 environment the contaminants will slowly outgas. The reconditioning procedure described below will , materials are: All Metals, LCP, POM (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For , ventilated after manufacturing or bake at 50°C for 24h to outgas contaminants before packing. 4.8 Wiring
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SHT11

Abstract: SHT75 Metals, LCP, POM (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For sealing and gluing , manufacturing or bake at 50°C for 24h to outgas contaminants before packing. 4.8 Wiring Considerations and , . In a clean environment the contaminants will slowly outgas. The reconditioning procedure described
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FOST02A

Abstract: PVDF outgas in both offset and sensitivity. In a clean environment the contaminants will slowly outgas. The , (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For sealing and gluing (use sparingly , bake at 50°C for 24h to outgas contaminants before packing. Http://www.hoperf.com E-mail
HOPE Microelectronics
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SHT10

Abstract: DIN-50021 environment the contaminants will slowly outgas. The reconditioning procedure described below will , materials are: All Metals, LCP, POM (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF. For , ventilated after manufacturing or bake at 50°C for 24h to outgas contaminants before packing. 4.8 Wiring
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DIN-50021

Abstract: SHT10 and sensitivity. In a clean environment the contaminants will slowly outgas. The reconditioning , , PB, PPS, PSU, PVDF, PVF. For sealing and gluing (use sparingly): High filled epoxy for electronic , SHTxx (cf. 4.2). Store well ventilated after manufacturing or bake at 50°C for 24h to outgas
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HHT02D

Abstract: shtxx slowly outgas. The reconditioning procedure described below will accelerate this process. High levels of , ), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For sealing and gluing (use sparingly): High , 50°C for 24h to outgas contaminants before packing. Tel: +86-755-82973806 Fax: +86-755-82973550
HOPE Microelectronics
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DIN-50021

Abstract: Mill-Max 851-93-004-20-001 will slowly outgas. The reconditioning procedure described below will accelerate this process. High , (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For sealing and gluing (use sparingly
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STAEFA RH 2000

Abstract: 10LQ50S13030 (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. For sealing and gluing (use sparingly): Use high filled epoxy , to outgas contaminants before packing. Figure 9 Typical application circuit, including decoupling
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JESD22-A104

Abstract: Mill-Max 851-93-004-20-001 in both offset and sensitivity. In a clean environment the contaminants will slowly outgas. The , . Recommended materials are: All Metals, LCP, POM (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF
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SHT20

Abstract: SHT20P are: Any metals, LCP, POM (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. For sealing and , after manufacturing or bake at >50°C for 24h to outgas contaminants before packing. 2.7 Power Pins
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SHT21P

Abstract: THB 2411 (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. For sealing and gluing (use sparingly): Use high filled epoxy , to outgas contaminants before packing. 2.7 Wiring Considerations and Signal Integrity Carrying the
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Abstract: metals, LCP, POM (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. 2.8 SCL â'" Output , after manufacturing or bake at >50°C for 24h to outgas contaminants before packing. 2.7 Power Pins Sensirion
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Abstract: (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. SHT2x SDM bit stream C = 100nF For , well ventilated after manufacturing or bake at >50°C for 24h to outgas contaminants before packing Sensirion
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Abstract: . Recommended materials are: Any metals, LCP, POM (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF , , store the assembly well ventilated after manufacturing or bake at >50°C for 24h to outgas Sensirion
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Abstract: , LCP, POM (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. SHT2x SDM bit stream C = , , store the assembly well ventilated after manufacturing or bake at >50°C for 24h to outgas Sensirion
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Abstract: (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. SHT2x SDM bit stream C = 100nF For , well ventilated after manufacturing or bake at >50°C for 24h to outgas contaminants before packing Sensirion
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STAEFA RH 2000

Abstract: SHT20 , PP, PB, PPS, PSU, PVDF, PVF. For sealing and gluing (use sparingly): Use high filled epoxy for , assembly, store the assembly well ventilated after manufacturing or bake at >50°C for 24h to outgas
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10LQ50S13030

Abstract: SHT21P metals, LCP, POM (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF, PVF. For sealing and gluing (use , manufacturing or bake at >50°C for 24h to outgas contaminants before packing. 2.7 Power Pins (VDD, VSS) The
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SHT75

Abstract: SHT7x Application will slowly outgas. The reconditioning procedure described below will accelerate this process. High , (Delrin), PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF For sealing and gluing (use sparingly
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SHT21S

Abstract: SDA Physical Layer Specification, Version 2.00 , PVDF, PVF. For sealing and gluing (use sparingly): Use high filled epoxy for electronic packaging (e.g , assembly well ventilated after manufacturing or bake at >50°C for 24h to outgas contaminants before packing
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