PM1210H - Datasheet Archive

 

Material PM1210H Product Line CHIP INDUCTOR Date 11-September-2006 No. Construction element 1 Core Material Weight [g] 2 Solder 3

 

MATERIAL DECLARATION SHEET Material PM1210H PM1210H Product Line CHIP INDUCTOR Date 11-September-2006 No. Construction element 1 Core Material Weight [g] 2 Solder 3 Molded body Sum [%] Iron & Compounds N/A Remainder 100 Zinc & Compounds 0.025 Average mass [%] N/A 19 N/A 10 Copper & Compounds Ferrite Ni-Zn Series if applicable Nickel & Compounds Material group N/A 4 Materials CAS 5 Wire Adhesive Headquarters Riverside CA 0.002 Sn 7440-31-5 99.97 0.005 LCP N/A N/A Cu/Ni/Sn100% N/A N/A Enamelled Copper Wire 0.01 Cu 7440-50-8 90.08~99.00 Polyester Resin N/A 1~9.92 Epoxy 0.008 Epoxy N/A N/A Total weight 4 Bar Solder Sn100% body & Terminal Electrode Traces 0.05g www.bourns.com 100 100 100 page 1 of 2 MATERIAL DECLARATION SHEET Contact person Cathy Godfrey Bourns location Riverside, CA Phone Ext. 5008 Bourns , Inc. 1200 Columbia Ave. Riverside, CA 92507 USA phone: 909 781-5690 fax: 909 781-5273 Fax e-mail Cathy_Godfrey@bourns.com Important remarks: 1. 2. 3. 4. Traces are product parts substances etc. that are below a percentage of 0.1% of total weight. A list of the legally regulated substances or materials is available at internet address http://www.eicta.org/content.asp?pageID=113 Substances, materials etc. with possible harm to men and environment are listed. There are no risks for human beings and to the environment if products are used properly as designated. This shall not apply to risks caused during procedures for disposal etc. 5. All statements herein are based on our present knowledge. Headquarters Riverside CA www.bourns.com page 2 of 2