PCA2002 PCA2002U/AA PCA2002U/AB PCA2002U/10AA PCA2002U/10AB PCA2002T PCA2002TK - Datasheet Archive

 

32 kHz watch circuit with programmable output period and pulse width Rev. 04 - 7 September 2005 Product data sheet 1. General

 

PCA2002 PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 04 - 7 September 2005 Product data sheet 1. General description The PCA2002 PCA2002 is a CMOS integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The crystal oscillator and the frequency divider are optimized for minimum current consumption. A timing accuracy of 1 ppm is achieved with a programmable, digital frequency adjustment. The output period and the output pulse width can be programmed. It can be selected between a full output pulse or a chopped output pulse with a duty cycle of 75 %. In addition, a stretching pulse can be added to the primary driving pulse. Pin RESET is used for stopping the motor, accurate time setting and for an accelerated testing of the watch. 2. Features s 32 kHz quartz oscillator, amplitude regulated with excellent frequency stability and high immunity to leakage currents s Electrically programmable time calibration with 1 ppm resolution (stored in OTP memory) s The quartz crystal is the only external component required s Very low current consumption: typically 90 nA s Output pulses for bipolar stepping motors s Five different programmable output periods (1 s to 30 s) s Output pulse width programmable between 1 ms and 8 ms s Full or chopped motor pulse and pulse stretching, selectable s Stop function for accurate time setting and current saving during the shelf life s Test mode for accelerated testing of the mechanical parts of the watch s Test bits for type recognition (version B) PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 3. Ordering information Table 1: Ordering information Type number Package Name Description Version PCA2002U/AA PCA2002U/AA - bare die; chip in tray - PCA2002U/AB PCA2002U/AB - bare die; chip in tray B PCA2002U/10AA PCA2002U/10AA - bare die; chip on film frame carrier - PCA2002U/10AB PCA2002U/10AB - bare die; chip on film frame carrier B PCA2002T PCA2002T PMFP8 plastic micro flat package; 8 leads (straight) SOT144-1 PCA2002TK PCA2002TK HVSON10 HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 × 3 × 0.85 mm SOT650-1 4. Block diagram 32 Hz OSCIN 3 (3) 8 kHz ÷4 OSCILLATOR OSCOUT (10) 8 DIVIDER RESET 4 (4) reset TIMING ADJUSTMENT, INHIBITION VDD VSS RESET 5 (7) 1 (1) VOLTAGE DETECTOR, OTP-CONTROLLER OTP-MEMORY 1 Hz MOTOR CONTROL PCA2002U PCA2002U PCA2002T PCA2002T (PCA2002TK PCA2002TK) (2) 2 n.c. (6) 6 (8) 7 (9) MOT1 (5) i.c. MOT2 n.c. mbl568 M The pin numbers given in parenthesis refer to the PCA2002TK PCA2002TK Fig 1. Block diagram 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 2 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 5. Pinning information 5.1 Pinning terminal 1 index area VSS 1 8 RESET i.c. 2 7 3 6 4 5 VDD i.c. 2 9 MOT2 3 8 MOT1 OSCOUT 4 7 VDD n.c. 5 6 n.c. MOT1 OSCOUT 10 RESET MOT2 OSCIN 1 OSCIN VSS PCA2002T PCA2002T 001aac501 PCA2002TK PCA2002TK 001aac502 Transparent top view a. PMFP8 (SOT144-1) b. HVSON10 HVSON10 (SOT650-1) Fig 2. Pin configuration 5.2 Pin description Table 2: Pin description Symbol Pin Description PCA2002T PCA2002T VSS 1 ground supply i.c. 2 internally connected OSCIN 3 oscillator input OSCOUT 4 oscillator output VDD 5 supply voltage MOT1 6 motor 1 output MOT2 7 motor 2 output RESET 8 reset input VSS 1 ground supply i.c. 2 internally connected OSCIN 3 oscillator input OSCOUT 4 oscillator output n.c. 5 not connected n.c. 6 not connected VDD 7 supply voltage MOT1 8 motor 1 output MOT2 9 motor 2 output RESET 10 reset input PCA2002TK PCA2002TK 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 3 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 6. Functional description 6.1 Motor pulse The motor driver delivers pulses with an alternating polarity. The output waveform across the motor terminals is illustrated in Figure 3. Between the motor pulses, both terminals are connected to VDD which means that the motor is short-circuit. The following parameters can be selected and are stored in a One Time Programmable (OTP) memory: · · · · Output periods of 1 s, 5 s, 10 s, 20 s and 30 s Pulse width (tp) between 0.98 ms and 7.8 ms in steps of 0.98 ms Full or chopped (75 %) output pulse Pulse stretching: an enlargement pulse is added to the primary motor pulse. This enlargement pulse has a duty cycle of 25 % and a width which is twice the programmed motor pulse width. period full pulse chopped pulse full pulse with stretching chopped pulse with stretching tp 2t p tp 2t p mgu718 Fig 3. Motor output waveforms 6.2 Time calibration The crystal oscillator has an integrated load capacitance of 5 pF, which is lower than the specified load capacitance of 8.2 pF for the quartz crystal. It oscillates therefore, at a frequency which is typically 60 ppm higher than 32.768 Hz. This positive frequency offset is then compensated by removing, every minute or every two minutes, the appropriate number of 8192 Hz pulses (maximum 127 pulses) of the divider chain. The timing correction is given in Table 3. After measuring the effective oscillator frequency, the number of correction pulses must be calculated and stored together with the calibration period in the OTP memory; see Section 6.6. 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 4 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width The oscillator frequency can be measured at pin RESET, where a square wave with the frequency fosc / 1024 is provided. It should be noted that this frequency shows a jitter every minute or every two minutes (depending on the programmed calibration period) which originates from the time calibration. Details on how to measure the oscillator frequency and the programmed inhibition time are given in Section 6.6. Table 3: Timing correction Calibration period (min) Correction per step (n = 1) Correction per step (n = 127) ppm seconds per day ppm seconds per day 1 2.03 0.176 258 22.3 2 1.017 0.088 129 11.15 6.3 Reset An output frequency of 32 Hz (fosc / 1024) is provided at pin RESET. Connecting pin RESET to VDD stops the motor drive and opens the motor switches. After releasing pin RESET, the first motor pulse is generated exactly one period later with the opposite polarity to the last pulse before stopping. The debounce time for the reset function is between 31 ms and 62 ms. Connecting pin RESET to VSS activates the test mode. In this mode the motor output frequency is 32 Hz, which can be used to test the mechanical function of the watch. 6.4 Programming possibilities The programming data is organized in an array of 8-bit words (see Table 4). A contains the time calibration, B the setting for the monitor pulses, C is not used and D contains the type recognition. Table 4: Word Words and bits Bit 1 2 3 4 A pulse width 6 7 number of 8192 Hz pulses to be removed B 5 8 calibration period output period duty cycle pulse stretching C D type factory test bit 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 5 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width Table 5: Description of word A bits Bit Value Description - the number of the 8192 Hz pulses to be removed (binary coded; MSB = A1 and LSB = A7) 0 1 minute 1 2 minutes Inhibit time 1 to 7 Calibration period 8 Table 6: Description of word B bits Bit Value Description 000 0.98 001 1.95 010 2.9 011 3.9 100 4.9 101 5.9 110 6.8 111 7.8 000 1 001 5 010 10 011 20 100 30 0 75 % 1 100 % Pulse width tp (ms) 1 to 3 Output period (s) 4 to 6 Duty cycle of motor pulse 7 Pulse stretching 8 0 no pulse stretching 1 a pulse width of 2tp and a duty factor of 25 % are added 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 6 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 6.5 Type recognition (version B only) Byte D is read to determine which type of the PCA200X PCA200X family is used in a particular application. Table 7: Description of word D bits Bit Value Description 0000 PCA2002 PCA2002 1000 PCA2000 PCA2000 0100 PCA2001 PCA2001 Type recognition 1 to 4 6.6 Programming procedure To ensure that the oscillator starts up correctly you must execute a reset sequence (see Figure 4). VDD tp(stop) VP(stop) t(start) > 500 ms VDD(nom) VSS 001aac503 Fig 4. Supply voltage at start-up during production and testing For a watch it is essential that the timing calibration can be made after the watch is fully assembled. In this situation, the supply pins are often the only terminals which are still accessible. Writing to the OTP cells and performing the related functional checks is achieved in the PCA2002 PCA2002 by modulating the supply voltage. The necessary control circuit consists basically of a voltage level detector, an instruction state counter (which determines the function to be performed) and an 8-bit shift register which allows writing the OTP cells of an 8-bit word in one step and which acts as data pointer for checking the OTP content. · · · · · · State 1; measurement of the crystal oscillator frequency (divided by 1024) State 2; measurement of the inhibition time State 3; write/check word A State 4; write/check word B State 5; check word C State 6; check word D (type recognition) 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 7 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width There are four different instruction states: Each instruction state is switched on with a pulse to VP(start). After this large pulse, an initial waiting time of t0 is required. The programming instructions are then entered by modulating the supply voltage with small pulses of an amplitude VP(mod) and pulse width tmod. The first small pulse defines the start time, the following pulses perform three different functions, depending on the time delay (td) from the preceding pulse (see Figure 5): · td = t1 (0.7 ms); increments the instruction counter · td = t2 (1.7 ms); clocks the shift register with D = 0 at the input · td = t3 (2.7 ms); clocks the shift register with D = 1 at the input The programming procedure requires a stable oscillator, which means that a waiting time, determined by the start-up time of the oscillator, is necessary after power-up of the circuit. After the VP(start) pulse, the instruction counter is in State 1 and the data shift register is cleared. The instruction state ends with a second pulse to VP(start) or with the pulse to Vstore. In any event the instruction states are terminated automatically 2 seconds after the last VP(mod) pulse. 6.6.1 Measurement of the oscillator frequency and the inhibition time The output of the two measuring states can either be monitored directly at pin RESET or as a modulation of the supply current (a modulating resistor of 30 k is connected between VDD and VSS when the signal at pin RESET is HIGH): · State 1; crystal oscillator frequency divided by 1024; State 1 starts with a pulse to VP(start) and ends with a second pulse to VP(stop) · State 2; inhibition time (see Figure 5); a frequency with the period of (31.25 + n × 0.122) ms appears at pin RESET and as current modulation at the supply pin (see Figure 6) VDD t p(stop) t p(start) VP(stop) VP(start) t0 t1 VP(mod) VDD(nom) VSS mgu719 Fig 5. Supply voltage modulation for start and stop of instruction State 2 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 8 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 31.25 ms + Inhibtion time VDD VSS mgu720 Fig 6. Output waveform at pin RESET for instruction State 2 6.6.2 Programming the memory cells Applying the two-stage programming pulse (see Figure 7) transfers the stored data in the shift register to the OTP cells. Perform the following to program a memory word: 1. Starting with a VP(start) pulse, wait for the time period t0 then set the instruction counter to the word to be written (td = t1). 2. Enter the data to be stored into the shift register (td = t2 or t3), LSB first (bit 8) and MSB last (bit 1). 3. Applying the two-stage programming pulse Vpre-store followed by Vstore stores the word. The delay between the last data bit and the pre-store pulse Vpre-store is td = t4. Store the word by raising the supply voltage to Vstore; the delay between the last data bit and the store pulse is td. The example shown in Figure 7 performs the following functions: start, setting the instruction counter to State 4 (word B), entering data word 1101 0001 into the shift register (sequence: LSB first and MSB last) and writing the OTP cells for word B. tpre-store Vstore VDD(mod) t PR VP(start) Vpre-store t0 t1 t1 t1 t3 t2 t2 t2 t3 t2 t3 t3 t4 tstore VP(mod) VDD VSS mgu721 Fig 7. Supply voltage modulation for programming 6.6.3 Checking the memory content The stored data of the OTP array can be checked bit-wise by measuring the supply current (see Figure 8). The array word is selected by the instruction state, the bit is addressed by the shift register. To read a word, the word is first selected (td = t1) and a logic 1 is written into the first cell of the shift register (td = t3). This logic 1 is then shifted through the entire shift register (td = t2, so that it points with each clock pulse to the next bit. If the addressed OTP cell contains a logic 1, a 30 k resistor is connected between VDD and VSS; this increases the supply current accordingly. 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 9 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width VDD(mod) t p(start) t p(stop) VP(start) VP(stop) t0 t1 t1 t1 t3 t2 t2 t2 t2 t2 VP(mod) VDD VSS I DD (1) mgw357 (1) V DD I DD = -30 k The corresponding supply current variation for B = 110101 (the sequence is MSB first and LSB last). Fig 8. Supply voltage modulation for reading word B 6.7 Frequency tuning at assembled watch Figure 9 shows the test set-up for frequency tuning the assembled watch. 32 kHz M FREQUENCY COUNTER PROGRAMMABLE DC POWER SUPPLY PCA200x motor battery PC INTERFACE PC mgw568 Fig 9. Frequency tuning the assembled watch 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 10 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 7. Limiting values Table 8: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions VSS = 0 V Min [1] [2] Max Unit -1.8 +7 V VI all input voltages VSS - 0.5 VDD + 0.5 V to(sc) output short-circuit duration - indefinite s Tamb ambient temperature -10 +60 °C Tstg storage temperature -30 +100 °C [1] When writing to the OTP cells, the supply voltage (VDD) can be raised to a maximum of 12 V for a time period of 1 s. [2] Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows which rapidly discharges the battery. 8. Characteristics Table 9: Characteristics VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; quartz crystal: Rs = 40 k, C1 = 2 fF to 3 fF, CL = 8.2 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage normal operating mode; Tamb = -10 °C to +60 °C 1.1 1.55 3.6 V VDD supply voltage variation V/t = 1 V/µs - - 0.25 V IDD supply current between motor pulses - 90 120 nA between motor pulses at VDD = 3.5 V - 120 180 nA Tamb = -10 °C to +60 °C - - 200 nA Stop mode; pin RESET connected to VDD - 100 135 nA Supplies Motor output Vsat saturation voltage (P + N) RM = 2 k; Tamb = -10 °C to +60 °C - 150 200 mV Zo(sc) short-circuit impedance - 200 300 1.1 - - V VOSCIN 50 mV (p-p) 5 10 - µS - 0.3 0.9 s VDD = 100 mV - 0.05 0.2 ppm 4.3 5.2 6.3 pF 20 - - M between motor pulses; Imotor < 1 mA Oscillator Vstart starting voltage gm transconductance tosc start-up time f/f frequency stability Cint integrated load capacitance Rpar parasitic resistance allowed resistance between adjacent pins 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 11 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width Table 9: Characteristics .continued VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; quartz crystal: Rs = 40 k, C1 = 2 fF to 3 fF, CL = 8.2 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Reset fo output frequency - 32 - Hz Vo output voltage swing RL = 1 M; CL = 10 pF 1.4 - - V tr rise time RL = 1 M; CL = 10 pF - 1 - µs tf fall time RL = 1 M; CL = 10 pF - 1 - µs Ii(av) average input current pin RESET connected to VDD or VSS - 10 20 nA Min Typ Max Unit 9. OTP programming characteristics Table 10: OTP programming characteristics [1] Symbol Parameter Conditions VDD supply voltage during programming procedure 1.5 - 3.0 V VP(start) supply voltage for starting programming procedure 6.6 - 6.8 V VP(stop) supply voltage for stopping programming procedure 6.2 - 6.4 V VP(mod) supply voltage modulation for entering instructions 320 350 380 mV Vpre-store supply voltage for pre-store pulse 6.2 - 6.4 V Vstore supply voltage for writing to the OTP cells 9.9 10.0 10.1 V Istore supply current for writing to the OTP cells - - 10 mA tp(start) pulse width of start pulse 8 10 12 ms tp(stop) pulse width of stop pulse 0.05 - 0.5 ms tmod modulation pulse width 25 30 40 µs tpre-store pulse width of pre-store pulse 0.05 - 0.5 ms tstore pulse width for writing to the OTP cells 95 100 110 ms t0 waiting time after start pulse 20 - 30 ms t1 pulse distance for incrementing the state counter 0.6 0.7 0.8 ms t2 pulse distance for clocking the data register with data = logic 0 1.6 1.7 1.8 ms t3 pulse distance for clocking the data register with data = logic 1 2.6 2.7 2.8 ms 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 12 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width Table 10: OTP programming characteristics [1] .continued Symbol Parameter Min Typ Max Unit t4 waiting time for writing to the OTP cells 0.1 0.2 0.3 ms SR slew rate for modulation of the supply voltage 0.5 - 5 V/µs Rread read-out resistor for supply current modulation 18 30 45 k [1] Conditions Program each word once only. 10. Bare die information Table 11: Symbol Bonding pad locations Coordinates [1] Pad x y 1 -480 +330 i.c. [3] 2 -480 +160 OSCIN 3 -480 -160 OSCOUT 4 -480 -330 VSS [2] VDD 5 +480 -330 MOT1 6 +480 -160 MOT2 7 +480 +160 RESET 8 +480 +330 [1] All coordinates are referenced, in µm, to the center of the die (see Figure 10). [2] The substrate (rear side of the chip) is connected to VSS. Therefore, the die pad must be either floating or connected to VSS. [3] Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal pull-down resistance to VSS. 1.20 mm VSS 1 i.c. 2 8 7 y 0 OSCIN 3 OSCOUT 4 0 MOT2 PCA2002 PCA2002 x 0.90 mm RESET 6 MOT1 5 VDD mbl574 Fig 10. Bonding pad locations 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 13 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width Table 12: Mechanical chip data [1] Parameter Value Bonding pad metal [1] 96 µm × 96 µm opening 86 µm × 86 µm The substrate of the chip is connected to VSS. The pad i.c. is used for factory test, in normal operation it should be left open-circuit. The pad i.c. has an internal pull-down resistor connected to VSS. 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 14 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 11. Package outline PMFP8: plastic micro flat package; 8 leads (straight) SOT144-1 E D X c m t n HE 8 5 Q2 A2 Q1 pin 1 index L detail X 1 4 e w M b 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 b c D (1) E (1) e HE L m max. n max. Q1 Q2 t w mm 0.9 0.7 0.40 0.25 0.19 0.12 3.1 2.9 3.1 2.9 0.8 4.6 4.4 0.75 0.26 0.3 0.4 0.3 0.4 0.3 0.95 0.1 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-01-24 03-03-12 SOT144-1 Fig 11. Package outline SOT144-1 (PMFP8) 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 15 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width HVSON10 HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 2.55 2.15 3.1 2.9 1.75 1.45 0.5 2 0.55 0.30 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT650-1 - MO-229 MO-229 - EUROPEAN PROJECTION ISSUE DATE 01-01-22 02-02-08 Fig 12. Package outline SOT650-1 (HVSON10 HVSON10) 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 16 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 12. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling MOS devices; see JESD625-A JESD625-A and/or IEC61340-5 IEC61340-5. 13. Packing information 13.1 Tray information A x G C H y 1,1 2,1 3,1 1,2 x,1 2,2 D B 1,3 F x,y 1,y A A E M J SECTION A-A mgu653 Fig 13. Tray details Table 13: Tray dimensions Dimension Description Value A pocket pitch; x direction 2.15 mm B pocket pitch; y direction 2.43 mm C pocket width; x direction 1.01 mm D pocket width; y direction 1.39 mm E tray width; x direction 50.67 mm F tray width; y direction 50.67 mm G distance from cut corner to pocket (1 and 1) center 4.86 mm H distance from cut corner to pocket (1 and 1) center 4.66 mm J tray thickness 3.94 mm 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 17 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width Table 13: Tray dimensions .continued Dimension Description Value M pocket depth 0.61 mm x number of pockets in x direction 20 y number of pockets in y direction 18 PCA2002 PCA2002 mbl573 The orientation of the IC in a pocket is indicated by the position of the IC type name on the surface of the die, with respect to the cut corner on the upper left of the tray. Fig 14. Tray alignment 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: · below 225 °C (SnPb process) or below 245 °C (Pb-free process) ­ for all BGA, HTSSON.T and SSOP.T packages ­ for packages with a thickness 2.5 mm 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 18 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width ­ for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. · below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): ­ larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; ­ smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 19 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 14.5 Package related soldering information Table 14: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON.T [3], LBGA, LFBGA, SQFP, SSOP.T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN.L [8], not suitable not suitable PMFP [9], WQCCN.L [8] [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026 AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 20 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 15. Revision history Table 15: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes PCA2002 PCA2002_4 20050907 Product data sheet - 9397 750 14617 PCA2002 PCA2002_3 · The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. · Modifications: Version B added to data sheet ­ Section 2 "Features": Added version B feature ­ Section 3 "Ordering information": Added version B types ­ Section 6.4 "Programming possibilities": Added Word D description for version B ­ Section 6.6 "Programming procedure": Added word D remark for version B PCA2002 PCA2002_3 20040120 Product specification - 9397 750 11671 PCA2002 PCA2002_2 PCA2002 PCA2002_2 20030204 Objective specification - 9397 750 10986 PCA2002 PCA2002_1 PCA2002 PCA2002_1 20021025 Objective specification - 9397 750 09659 - 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 21 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions Short-form specification - The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition - Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information - Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18. Disclaimers Life support - These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes - Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Bare die - All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 19. Trademarks Notice - All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 14617 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 04 - 7 September 2005 22 of 23 PCA2002 PCA2002 Philips Semiconductors 32 kHz watch circuit with programmable output period and pulse width 21. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 6.6 6.6.1 6.6.2 6.6.3 6.7 7 8 9 10 11 12 13 13.1 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Motor pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Time calibration . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Programming possibilities. . . . . . . . . . . . . . . . . 5 Type recognition (version B only) . . . . . . . . . . . 7 Programming procedure . . . . . . . . . . . . . . . . . . 7 Measurement of the oscillator frequency and the inhibition time . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Programming the memory cells . . . . . . . . . . . . 9 Checking the memory content . . . . . . . . . . . . . 9 Frequency tuning at assembled watch . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 OTP programming characteristics . . . . . . . . . 12 Bare die information . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Handling information. . . . . . . . . . . . . . . . . . . . 17 Packing information. . . . . . . . . . . . . . . . . . . . . 17 Tray information . . . . . . . . . . . . . . . . . . . . . . . 17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 19 Package related soldering information . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information . . . . . . . . . . . . . . . . . . . . 22 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 7 September 2005 Document number: 9397 750 14617 Published in The Netherlands