PC4SD11NTZ PC4SD21NTZ UL1577 E64380 4SD11 CA95323 EN60747-5-2 VDE0884 - Datasheet Archive
VDRM : 800V Non-zero cross type DIP 6pin Phototriac Coupler for triggering PC4SD11NTZ Series Zero cross type is also available.
PC4SD11NTZ PC4SD11NTZ Series VDRM : 800V Non-zero cross type DIP 6pin Phototriac Coupler for triggering PC4SD11NTZ PC4SD11NTZ Series Zero cross type is also available. (PC4SD21NTZ PC4SD21NTZ Series) Description Agency approvals/Compliance PC4SD11NTZ PC4SD11NTZ Series Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers for medium to high current Triacs. DIP package provides 5.0kV isolation from input to output with superior commutative noise immunity. 1. Recognized by UL1577 UL1577 (Double protection isolation), file No. E64380 E64380 (as model No. 4SD11 4SD11) 2. Approved by CSA, file No. CA95323 CA95323 (as model No. 4SD11 4SD11) 3. Optionary available VDE Approved ()(DIN EN 607475-2), file No. 40008189 (as model No. 4SD11 4SD11) 4. Package resin : UL flammability grade (94V-0) () DIN EN60747-5-2 EN60747-5-2 : succesor standard of DIN VDE0884 VDE0884. Up to Date code "RD" (December 2003), approval of DIN VDE0884 VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2 EN60747-5-2. () Reinforced insulation type is also available. (PC4SF11YVZ PC4SF11YVZ Series) Features 1. High repetitive peak off-state voltage (VDRM : 800V) 2. Non-zero crossing functionality 3. IFT ranks available (see Model Line-up section in this datasheet) 4. 6 pin DIP package 5. Lead-free components are also available (see Model Line-up section in this datasheet) 6. Double transfer mold construction (Ideal for Flow Soldering) 7. High isolation voltage between input and output (Viso(rms) : 5.0kV) Applications 1. Triggering for Triacs used to switch on and off devices which require AC Loads. For example heaters, fans, motors, solenoids, and valves. 2. Triggering for Triacs used for implementing phase control in applications such as lighting control and temperature control (HVAC). 3. AC line control in power supply applications. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A07801EN D2-A07801EN Date Mar. 31. 2004 © SHARP Corporation PC4SD11NTZ PC4SD11NTZ Series Internal Connection Diagram 1 2 1 6 5 2 3 4 3 5 4 6 Anode Cathode NC Anode/Cathode No external connection Cathode/Anode Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC4SD11NTZ PC4SD11NTZ] 2. Wide Through-Hole Lead-Form [ex. PC4SD11NVZ PC4SD11NVZ] ±0.3 1.2 6 Model No. 4 SHARP mark "S" 6.5±0.5 Date code (2 digit) 3 Date code (2 digit) Factory identification mark ±0.5 1 7.62 3.25±0.5 2.54 : 0 to 13° 0.5±0.1 Model No. Rank mark 4SD11 4SD11 Anode mark 1.2±0.3 6 SHARP mark "S" 6.5±0.5 5 Rank mark 4SD11 4SD11 Anode mark Date code (2 digit) 1 2 Date code (2 digit) 3 1 Factory identification mark 7.12±0.5 3 Factory identification mark 7.62±0.3 0.35±0.25 0.26±0.1 1.0+0.4 -0 2 7.12±0.5 7.62±0.3 3.5±0.5 2.54±0.25 Model No. 4 0.25±0.25 SHARP mark "S" ±0.1 0.26 4. Wide SMT Gullwing Lead-Form [ex. PC4SD11NWP PC4SD11NWP] 0.6±0.2 4 ±0.5 10.16 Product mass : approx. 0.35g 1.2±0.3 5 0.5 ±0.25 3. SMT Gullwing Lead-Form [ex. PC4SD11NXP PC4SD11NXP] 6 TYP. Epoxy resin Product mass : approx. 0.35g 0.6±0.2 ±0.3 7.62 2.9±0.5 0.5TYP. 3.5±0.5 2.9±0.5 0.5±0.1 Factory identification mark 7.12±0.5 Epoxy resin 2.54±0.25 2 ±0.3 7.12 3 3.5±0.5 2 Anode mark 3.5±0.5 1 Rank mark 4SD11 4SD11 2.7MIN. Anode mark Model No. 6.5±0.5 Rank mark 4SD11 4SD11 4 5 6.5±0.5 5 Epoxy resin 2.54±0.25 1.0+0.4 -0 10.0+0 -0.5 0.26±0.1 6 3.25±0.5 0.6 SHARP mark "S" 1.2±0.3 0.6±0.2 ±0.2 0.75±0.25 Epoxy resin 10.16±0.5 0.75±0.25 MAX. 12.0 Product mass : approx. 0.33g Product mass : approx. 0.34g Sheet No.: D2-A07801EN D2-A07801EN 2 PC4SD11NTZ PC4SD11NTZ Series Outline Dimensions (Unit : mm) 5. Through-Hole VDE option [ex. PC4SD11YTZ PC4SD11YTZ] 6. Wide Through-Hole Lead-Form VDE option [ex. PC4SD11YVZ PC4SD11YVZ] 1.2±0.3 6 Model No. SHARP mark "S" Rank mark 2 Anode mark 4 Date code (2 digit) 3 Date code (2 digit) Factory identification mark 7.12±0.5 1 0.5TYP. 3.25±0.5 Factory identification mark 7.12±0.5 Epoxy resin : 0 to 13° ±0.25 2.54 0.5±0.1 Product mass : approx. 0.35g 0.6±0.2 Model No. SHARP mark "S" Rank mark 4SD11 4SD11 4 5 4 Rank mark 4SD11 4SD11 Anode mark 4 Date code (2 digit) 2 Date code (2 digit) 3 1 Factory identification mark 7.12±0.5 7.12±0.5 7.62±0.3 0.26±0.1 3.5±0.5 2.54±0.25 1.0+0.4 -0 2 VDE identification mark 3 Factory identification mark 7.62±0.3 0.35±0.25 VDE identification mark 0.25±0.25 1 Model No. 3.5±0.5 Anode mark 1.2±0.3 6 6.5±0.5 4 6.5±0.5 SHARP mark "S" 5 ±0.1 0.26 8. Wide SMT Gullwing Lead-Form VDE option [ex. PC4SD11YWP PC4SD11YWP] 1.2±0.3 6 ±0.5 10.16 Product mass : approx. 0.35g 7. SMT Gullwing Lead-Form VDE option [ex. PC4SD11YXP PC4SD11YXP] 0.6±0.2 ±0.3 7.62 0.5 2.9±0.5 3.5±0.5 7.62±0.3 0.5±0.1 2 VDE identification mark Epoxy resin 2.54±0.25 3 TYP. 1 VDE identification mark Rank mark 4SD11 4SD11 2.7MIN. 4 Model No. 2.9±0.5 Anode mark 6.5±0.5 4SD11 4SD11 4 5 6.5±0.5 4 3.5±0.5 5 Epoxy resin 2.54±0.25 1.0+0.4 -0 10.0+0 -0.5 0.26±0.1 6 3.25±0.5 0.6 SHARP mark "S" 1.2±0.3 0.6±0.2 ±0.2 0.75±0.25 Epoxy resin 10.16±0.5 0.75±0.25 MAX. 12.0 Product mass : approx. 0.33g Pin 5 Product mass : approx. 0.34g is not allowed external connection Sheet No.: D2-A07801EN D2-A07801EN 3 PC4SD11NTZ PC4SD11NTZ Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M · · N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C · · · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark Refer to the Model Line-up table Sheet No.: D2-A07801EN D2-A07801EN 4 Absolute Maximum Ratings Parameter Symbol Rating IF 50 Forward current Input VR 6 Reverse voltage IT (rms) 0.1 RMS ON-state current *3 Output Peak one cycle surge current 1.2 Isurge 800 Repetitive peak OFF-state voltage VDRM *1 5.0 Viso (rms) Isolation voltage -30 to +100 Topr Operating temperature -55 to +125 Tstg Storage temperature *2 270 *4 Tsol Soldering temperature (Ta=25°C) Unit mA V A A V kV °C °C °C 1mm PC4SD11NTZ PC4SD11NTZ Series Soldering area *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 f=50Hz sine wave *4 Lead solder plating models: 260°C Electro-optical Characteristics Parameter Forward voltage Input Reverse current Repentitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Rank B Transfer Minimum trigger current Rank C characIsolation resistance teristics Turn-on time (Ta=25°C) Symbol VF IR IDRM VT IH dV/dt Conditions IF=20mA VR=3V VD=VDRM IT=0.1A VD=6V - VD=1/2 ·VDRM IFT VD=6V, RL=100 RISO ton DC500V DC500V,40 to 60%RH VD=6V, RL=100, IF=20mA MIN. TYP. 1.2 - - - - - - - - 0.1 - 50 - - - - 10 1011 5×10 - - MAX. 1.4 10 3 2.5 3.5 - 7 5 - 100 Unit V µA µA V mA V/µs mA µs Sheet No.: D2-A07801EN D2-A07801EN 5 PC4SD11NTZ PC4SD11NTZ Series Model Line-up (1) (Lead-free components) Lead Form Through-Hole Shipping Package DIN EN60747-5-2 EN60747-5-2 Model No. Lead Form Shipping Package DIN EN60747-5-2 EN60747-5-2 Model No. - Approved SMT Gullwing Sleeve 50pcs/sleeve - Wide Through-Hole Rank mark - B C MAX.7 MAX.5 Rank mark IFT[mA] (VD=6V, RL=100) B C MAX.7 MAX.5 Rank mark Approved IFT[mA] (VD=6V, RL=100) IFT[mA] (VD=6V, RL=100) B C MAX.7 MAX.5 Rank mark IFT[mA] (VD=6V, RL=100) B C MAX.7 MAX.5 Approved PC4SD11NTZBF PC4SD11NTZBF PC4SD11YTZBF PC4SD11YTZBF PC4SD11NXZBF PC4SD11NXZBF PC4SD11YXZBF PC4SD11YXZBF PC4SD11NVZBF PC4SD11NVZBF PC4SD11YVZBF PC4SD11YVZBF PC4SD11NTZCF PC4SD11NTZCF PC4SD11YTZCF PC4SD11YTZCF PC4SD11NXZCF PC4SD11NXZCF PC4SD11YXZCF PC4SD11YXZCF PC4SD11NVZCF PC4SD11NVZCF PC4SD11YVZCF PC4SD11YVZCF Wide SMT Gullwing Sleeve 50pcs/sleeve - Approved SMT Gullwing Wide SMT Gullwing Taping 1 000pcs/reel - Approved - Approved PC4SD11NWZBF PC4SD11NWZBF PC4SD11YWZBF PC4SD11YWZBF PC4SD11NXPBF PC4SD11NXPBF PC4SD11YXPBF PC4SD11YXPBF PC4SD11NWPBF PC4SD11NWPBF PC4SD11YWPBF PC4SD11YWPBF PC4SD11NWZCF PC4SD11NWZCF PC4SD11YWZCF PC4SD11YWZCF PC4SD11NXPCF PC4SD11NXPCF PC4SD11YXPCF PC4SD11YXPCF PC4SD11NWPCF PC4SD11NWPCF PC4SD11YWPCF PC4SD11YWPCF Model Line-up (2) (Lead solder plating components) Lead Form Through-Hole Shipping Package DIN EN60747-5-2 EN60747-5-2 Model No. Lead Form Shipping Package DIN EN60747-5-2 EN60747-5-2 Model No. - Approved SMT Gullwing Sleeve 50pcs/sleeve - Wide Through-Hole Approved - Approved PC4SD11NTZB PC4SD11NTZB PC4SD11YTZB PC4SD11YTZB PC4SD11NXZB PC4SD11NXZB PC4SD11YXZB PC4SD11YXZB PC4SD11NVZB PC4SD11NVZB PC4SD11YVZB PC4SD11YVZB PC4SD11NTZC PC4SD11NTZC PC4SD11YTZC PC4SD11YTZC PC4SD11NXZC PC4SD11NXZC PC4SD11YXZC PC4SD11YXZC PC4SD11NVZC PC4SD11NVZC PC4SD11YVZC PC4SD11YVZC Wide SMT Gullwing Sleeve 50pcs/sleeve - Approved SMT Gullwing - Wide SMT Gullwing Taping 1 000pcs/reel Approved - Approved PC4SD11NWZB PC4SD11NWZB PC4SD11YWZB PC4SD11YWZB PC4SD11NXPB PC4SD11NXPB PC4SD11YXPB PC4SD11YXPB PC4SD11NWPB PC4SD11NWPB PC4SD11YWPB PC4SD11YWPB PC4SD11NWZC PC4SD11NWZC PC4SD11YWZC PC4SD11YWZC PC4SD11NXPC PC4SD11NXPC PC4SD11YXPC PC4SD11YXPC PC4SD11NWPC PC4SD11NWPC PC4SD11YWPC PC4SD11YWPC Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A07801EN D2-A07801EN 6 PC4SD11NTZ PC4SD11NTZ Series Fig.2 RMS ON-state Current vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 150 RMS ON-state current Ir (rms) (mA) 175 60 Forward current IF (mA) 70 50 40 30 20 10 125 100 75 50 25 0 0 -30 0 50 -30 100 0 50 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 10 Minimum trigger current IFT (mA) Ta=75°C Forward current IF (mA) VD=6V RL=100 9 100 50 50°C 25°C 0°C 10 5 -25°C 8 7 6 5 4 3 2 1 1 0.9 1 1.1 1.2 1.3 1.4 0 -40 1.5 -20 Forward voltage VF (V) 20 40 60 80 100 Ambient temperature T (°C) Fig.5 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature Fig.6 ON-state Voltage vs. Ambient Temperature 2 1.3 IT=100mA 1.9 1.2 1.8 ON-state voltage VT (V) Relative repetitive peak OFF-state voltage VDRM (Tj=Ta)/VDRM (Tj=25°C) 0 1.1 1 0.9 1.7 1.6 1.5 1.4 1.3 1.2 0.8 1.1 0.7 -40 -20 0 20 40 60 80 1 -40 100 Ambient Temperature Ta (°C) -20 0 20 40 60 80 100 Ambient temperature Ta (°C) Sheet No.: D2-A07801EN D2-A07801EN 7 PC4SD11NTZ PC4SD11NTZ Series Fig.7 Holding Current vs. Ambient Temperature Fig.8 Repetitive Peak OFF-state Current vs. Ambient Temperature 10-5 10 Repetitive peak OFF-state current IDRM (A) Holding Current IH (mA) VD=6V 1 0.1 -40 -20 0 20 40 60 80 VD=800V 10-6 10-7 10-8 10-9 -40 100 Ambient temperature Ta (°C) -20 0 20 40 60 80 100 120 Ambient Temperature Ta (°C) Fig.9 Turn-on Time vs. Forward Current Turn-on time tON (µs) 1 000 VD=6V RL=100 100 10 1 10 100 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference. Sheet No.: D2-A07801EN D2-A07801EN 8 PC4SD11NTZ PC4SD11NTZ Series Design Considerations Design guide In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less. Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are intended to be used as triggering device for main Triacs. Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in malfunctions. In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. For designs that will experience excessive noise or sudden changes in load voltage, please include an appropriate snubber circuit as shown in the below circuit. Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often eliminate the need for a snubber circuit. Degradation In general, the emission of the IRED used in Phototriac Couplers will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should provide at least twice the minimum required triggering current from initial operation. Recommended Foot Print (reference) SMT Gullwing Lead-form Wide SMT Gullwing Lead-form 10.2 1.7 1.7 2.54 2.54 2.54 2.54 8.2 2.2 2.2 (Unit : mm) Sheet No.: D2-A07801EN D2-A07801EN 9 PC4SD11NTZ PC4SD11NTZ Series Standard Circuit (Medium/High Power Triac Drive Circuit) PC4SD11NTZ PC4SD11NTZ 1 6 Load 5 Triac 2 3 AC Line 4 Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A07801EN D2-A07801EN 10 PC4SD11NTZ PC4SD11NTZ Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (°C) 300 Terminal : 260°C peak ( package surface : 250°C peak) 200 Reflow 220°C or more, 60s or less Preheat 150 to 180°C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270°C and within 10s. Preheating is within the bounds of 100 to 150°C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400°C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A07801EN D2-A07801EN 11 PC4SD11NTZ PC4SD11NTZ Series Cleaning instructions Solvent cleaning : Solvent temperature should be 45°C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A07801EN D2-A07801EN 12 PC4SD11NTZ PC4SD11NTZ Series Package specification Sleeve package 1. Through-Hole or SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) 2. Wide Through-Hole or Wide SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 15.0 ±2 5.9 10.8 520 6.35 (Unit : mm) Sheet No.: D2-A07801EN D2-A07801EN 13 PC4SD11NTZ PC4SD11NTZ Series Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G I 5° X. MA H H A B C E K Dimensions List A B ±0.3 16.0 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 7.8±0.1 E 2.0±0.1 F 4.0±0.1 (Unit:mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f 23±1.0 2.0±0.5 f a b (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A07801EN D2-A07801EN 14 PC4SD11NTZ PC4SD11NTZ Series 2. Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G E I J MA X. H H A B C Dimensions List A B 24.0±0.3 11.5±0.1 H I ±0.1 12.2 0.4±0.05 5° K C 1.75±0.1 J 4.15±0.1 D 12.0±0.1 K 7.6±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b a 330 e 23±1.0 f b 25.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A07801EN D2-A07801EN 15 PC4SD11NTZ PC4SD11NTZ Series Important Notices with equipment that requires higher reliability such as: - Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) - Traffic signals - Gas leakage sensor breakers - Alarm equipment - Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: - Space applications - Telecommunication equipment [trunk lines] - Nuclear power control equipment - Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: - Personal computers - Office automation equipment - Telecommunication equipment [terminal] - Test and measurement equipment - Industrial control - Audio visual equipment - Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A07801EN D2-A07801EN 16