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Part Manufacturer Description PDF & SAMPLES
TPA2005D1GQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA
TPA2005D1ZQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA, 2.5 X 2.5 MM, LEAD FREE

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PBGA Datasheet

Part Manufacturer Description PDF Type
PBGA Amkor Technology Innovative designs and expanding package offerings provide a platform from prototype-to-production Original
PBGA196 N/A Original
PBGA256 N/A Original

PBGA

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: component DDR2 SDRAM PBGAs - Typical Application 128M x 64 DDR2 SDRAM 208 PBGA, 1.8V 16mm x 22mm , ) 800-1066 800-1066 800-1066 800-1066 Voltage (V) 1.5 1.5 1.5 1.5 Package 377 PBGA 377 PBGA 377 PBGA 377 PBGA Dimensions 21mm x 21mm 21mm x 21mm 23mm x 25mm 23mm x 25mm Temperature C , 400-667 Voltage (V) 1.8 1.8 1.8 1.8 1.8 1.8 Package 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA Dimensions 16mm x 20mm 16mm x 20mm 16mm x 22mm 16mm x 22mm 16mm x 22mm White Electronic Designs
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W3J128M64G-XPBX W3J128M72G-XPBX W3J2256M72-XPBX W3H32M64E-XSBX W3H32M72E-XSB2X W3H128M72E-XSBX DDR1 512M 256mb EEPROM Memory W3H128M72 W3J256M72G-XPBX
Abstract: Title: Plastic Ball Grid Array (PBGA) Tape & Reel Intermediate Box Re-Design and Moisture Barrier , Change to the Customer: Intel will re-design the PBGA tape & reel intermediate box and optimize the , Affected: PKG PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PIN 324 324 324 208 324 -
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L45H FW82443BX FW82801AA fw82810 FW82443ZXM FW82443dX FW82810ES FW82820S FW82820DPS FW82820PC600S FW82804AAS FW82806AAS
Abstract: ) 800-1066 800-1066 800-1066 Voltage (V) 1.5 1.5 1.5 Package PBGA PBGA PBGA Dimensions TBD TBD TBD Temperature C, I, M C, I, M C, I, M 800-1066 1.5 PBGA TBD C, I, M , 1.8 1.8 1.8 1.8 Package 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA , ) 400-667 Voltage (V) 1.8 Package 255 PBGA Dimensions 22mm x 26mm Temperature C, I, M , 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Package 60 PBGA 60 PBGA 219 PBGA 219 PBGA 219 PBGA 219 White Electronic Designs
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W3J128M72G-XNBX ddr sram 256mb w3j128m72 DDR2 128M x 32 NAND Flash Qualification Reliability 2.5 pata W3J256M32G-XNBX W3J128M64G-XNBX W3J2256M16G-XNBX W3H64M64E-XSBX W3H64M72E-XSBX
Abstract: (SMD Pads on PBGA-Either on PCB) Motherboard (Typically FR4/Glass) Page 15 Motorola General , Information PBGA Assembly Pre-assembly Handling PBGA Moisture Sensitivity t Many PBGAs are moisture , ­ ­ BGA Flip Chip PBGA GTBGA TBGA CSP DCA Customer assembly problems with Motorola , Motorola General Business Information PBGA Presentation t PBGA Introduction and Package Description t PC Board Design for PBGA t PBGA Assembly t PBGA Solder Joint Voids t Rework t Reliability Page Motorola
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PBGA 256 reflow profile bt 2328 pbga 144 304-pin dimensions bga jedec OSP FLIPCHIP CRACK nsmd smd
Abstract: the 0.635 mm package pad is recommended for the FC PBGA. The preferred CBGA pad is larger with a , 100°C thermal cycling on a CBGA using a PBGA-sized motherboard pad shows that reliability is not , greater than or equal to that for the FC PBGA. A via size increase may be possible due to the decreased solder pad diameter associated with the FC PBGA. Soldermask clearance around the solder pad should be , both the CBGA and PBGA-sized pads. Both cases used a solder-paste volume of 0.079 mm3. Figure 7 Motorola
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CBGA 255 motorola 90Pb10Sn 360-Pin AN-1850 BGA cte cte table epoxy AN1850/D
Abstract: heated from bottom only, PBGAs may warp ­ Upward bowing due to expansion of the PBGA substrate ­ Fully , PBGA Solder Joint Reliability Air temperature cycling is commonly performed on mounted PBGAs to , Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 TM , actual practice at Freescale. Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder Joint Voids Rework Solder Joint Reliability Thermal Freescale Semiconductor
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SAC405 IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch bga thermal cycling reliability fine BGA thermal profile JESD51 JESD5112
Abstract: Type Package Type Package Type CABGA 100 PBGA 196 PLCC 32 SOJ 32 CPGA 208 CABGA 144 PBGA 208 PLCC 44 SOJ 36 CPGA 223 CABGA 256 PBGA 240 PLCC 52 SOJ 44 CPGA 296 FPBGA 165 PBGA 256 PLCC 68 TQFP 100 CPGA 447 FCBGA 372 PBGA 260 PLCC 84 TQFP 120 CPGA 68 FCBGA 472 PBGA 272 PQFP 100 TQFP 128 CPGA 84 FCBGA 616 PBGA 324 PQFP 128/132 TQFP 144 CQSOP 84 FCBGA 900 PBGA 388 PQFP 144 TQFP 44 LCC Integrated Device Technology
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IDT marking IDT package marking IDT marking TQFP A-0410-02 IDT TOP SIDE package marking IDT CODE DATE marking
Abstract: is 0.05 mm smaller than the 0.635 mm package pad is recommended for the FC PBGA. The preferred CBGA , reliability data in 0 to 100°C thermal cycling on a CBGA using a PBGA-sized motherboard pad shows that , mm for CBGA and greater than or equal to that for the FC PBGA. A via size increase may be possible due to the decreased solder pad diameter associated with the FC PBGA. Soldermask clearance around the , both the CBGA and PBGA-sized pads. Both cases used a solder-paste volume of 0.079 mm3. Figure 7 Freescale Semiconductor
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62Sn36Pb2Ag 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Abstract: Per-Stream M M M M M M M M 16 16 16 16 16 16 16 16 1.8 V 196 ball PBGA 196 ball PBGA (pin compatible with MT90871) 256 ball PBGA 196 ball PBGA 256 pin LQFP 272 ball PBGA 272 ball PBGA (pin compatible with MT90870) 256 ball PBGA 12 K x 12 K 48 48 12 K x 12 K 48 48 12 K x 12 K 48 48 www.ZARLINK.com 5V , M M M M M 16 16 16 16 16 16 1.8 V 272 ball PBGA 256 ball PBGA 272 ball PBGA (pin compatible with MT90869) 256 ball PBGA 196 ball PBGA 256 pin LQFP 484 ball PBGA 484 ball PBGA 484 ball PBGA 324 Zarlink Semiconductor
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X32K ZL50050 ZL50051 ZL50052 ZL50053 ZL50057 ZL50058
Abstract: PQFP 352 PBGA XC4028XL-HQ160C XC4028XL-HQ208C XC4028XL-HQ240C XC4028XL-PG299C XC4028XL-HQ304C , CPGA 304 PQFP 352 PBGA XC4028XL-HQ160I XC4028XL-HQ208I XC4028XL-HQ240I XC4028XL-PG299I , HQFP 240 HQFP 304 PQFP 352 PBGA 432 PBGA XC4036XL-HQ160C XC4036XL-HQ208C XC4036XL-HQ240C , Industrial Industrial Industrial Package Type 304 PQFP 352 PBGA 432 PBGA Xilinx Equivalent , 160 HQFP 208 HQFP 240 HQFP 304 PQFP 352 PBGA 432 PBGA XC4044XL-HQ160C XC4044XL-HQ208C Chip Express
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proteus HQFP 208 XC4020XLA-PQ160 xc4013xla-pq208c XC4013XL-PQ240C XC4013XL-HT176C 4000E/EX 4000XL/XLA CEC003 CEC004 R4013 CEC002
Abstract: Thermal Data for the 540-Lead PBGA Package Application Note June 2000 Order Number: 273390-001 Thermal Data for the 540-Lead PBGA Package Information in this document is provided in , property of their respective owners. Application Note Thermal Data for the 540-Lead PBGA Package , .5 2.0 540-Lead PBGA Thermal Data - with No Heatsink . 6 3.0 540-Lead PBGA Thermal Data - with 0.25" Heatsink Intel
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jc 540 intel 540 PBGA jc thermal resistance 540-L
Abstract: user should ask for pad information regarding a specific design packaged in PBGA. For either SMD and , exposure onto the leads. Due to low mass of the PBGA. It is relatively easy to obtain a suitable profile with boards containing a variety of surface mount and through-hole device types along with the PBGA. , $40K and up without post-removal vision placement capabilities. Of course, special PBGA-specific , Ball Grid Array (PBGA) Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations Motorola
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AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 NXR-1400 AN1231/D
Abstract: Grid Array) and the 252-pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA pinout is identical to the PBGA pinout, and it drops into a board laid out for PBGA. Select members of the DSP56300 , Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages Summary of Differences , Die Changes . 7 252-pin MAP-BGA and 252-Pin PBGA Package , -pin plastic ball grid array (PBGA) on selected members of the DSP56300 family. Table 1 summarizes the Motorola
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punch singulation for PBGA EB362/D 252-P
Abstract: the PBGA. Typically the choice of solder paste determines the profile and reflow parameters. Most , multiple PBGAs on the board, the profile should be checked at the different PBGA locations on the board , more efficiently. Environmental conditions play a critical role in the thermal performance of PBGAs. , constraints limit a PBGA's ability to dissipate heat, a copper or aluminum heatsink is often used to provide , 2 14 An Introduction to Plastic Ball Grid Array (PBGA) Packaging 1/17/97 9:57 AM Intel
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Intel reflow soldering profile BGA socket s1 REFLOW PROFILE pbga package weight heat pipes intel outline of the heat slug for JEDEC intel topside mark CH14WIP
Abstract: recommended by Motorola for the PBGA. This is because the soldermask defined pad provides better adhesion , chosen to match that on the PBGA. The standard PBGA soldermask opening is specified at 25 mils for all , its diameter is never less than that on the PBGA. Having a joint with a larger diameter at the device , PBGA. In this case there is a soldermask clearance area around the copper pad. Due to the large volume , and through-hole device types along with the PBGA. Figure 4. Micrograph of an PBGA Test Board Pad Motorola
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reballing Air-Vac Engineering Company 830B OMPAC nicolet nxr1400 MPC105
Abstract: â'" â'" 64 82 â'" 2.0 Full/Low â'" 516-pin PBGA MPC8248 266â'"400 3 x 10, 2 x 10/100 Mb/s 2 â'" â'" 64 82 â'" 2.0 Full/Low Y 516-pin PBGA , '" 516-pin PBGA/ 480-pin TBGA MPC8271 266â'"400 3 x 10, 2 x 10/100 Mb/s 2 â'" 1 64 82 â'" 2.0 Full/Low â'" 516-pin PBGA MPC8272 266â'"400 3 x 10, 2 x 10/100 Mb/s 2 â'" 1 64 82 â'" 2.0 Full/Low Y 516-pin PBGA MPC8275 266 4 x 10, 3 Freescale Semiconductor
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689-pin MPC8247 MPC8270 MPC8280 MPC8241 MPC8245 P1025/P1016
Abstract: JEDEC 100-pin TQFP, 165-ball PBGA and 119ball PBGA packages · Power supply: NLP: Vdd 3.3V (± 5%), Vddq , JTAG Boundary Scan for PBGA packages · Industrial temperature available · Lead-free available , /IS61NVP/NVVP409618B PIN CONFIGURATION - 2M x 36, 165-Ball PBGA (TOP VIEW) 1 A B C D E F G H J K L M N , 119-PIN PBGA PACKAGE CONFIGURATION 1 A B C D E F G H J K L M N P R T U VDDQ NC NC DQc DQc VDDQ DQc , /NVVP204836B IS61NLP409618B/IS61NVP/NVVP409618B 165-PIN PBGA PACKAGE CONFIGURATION 1 A B C D E F G H J K L M Integrated Silicon Solution
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IS61NLP204836B/IS61NVP/NVVP204836B
Abstract: NEC BGA family 1. BGA - -BGA Ball Grid Array - PBGA Plastic BGA TBGA Tape BGA 2. NEC BGA NEC PBGA ABGA Advanced BGA 1TBGA 2TBGA 4 BGA PBGA 300 ABGA 700 PBGA Si 1 TBGA 700 2 TBGA 1000 TBGA TAB 3 NEC BGA family 3. NEC BGAQFP PBGA * * Q1 QFP , % 1.5mm 0.2 0.2 0.75 0.75 Q2 1 PBGA QFP 225 208 256 1.27 0.5 0.4 27×27 28×28 28×28 NEC
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BGA313 NEC VR4300 225PBGA EDR-7315 HG7900 JIS-Z0202 208QFP 225BGA 22561382NH1902 23521382NH1902 24201382NH1902 IC274432124
Abstract: -pin MAP-BGA (Mold Array Process-Ball Grid Array) and the 252-pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA pinout is identical to the PBGA pinout, and it drops into a board laid out for PBGA. Select , . 7 252-pin MAP-BGA and 252-Pin PBGA Package Differences Freescale Semiconductor, Inc. Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages © Motorola, Inc. 2000 , ball grid array (BGA) package and will eventually replace the 252-pin plastic ball grid array (PBGA Motorola
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FREESCALE PACKING
Abstract: Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array (MAP-BGA) and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA is an identical pinout and drops into a board laid out for PBGA. Many members of , (PBGA) on selected member of the DSP56300 family. Table 1 summarizes the differences between these two packages. Table 1. Differences Between 196-Pin MAP-BGA and PBGA 196-pin MAP-BGA 196-pin PBGA Freescale Semiconductor
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EB360 196-pin 196-P
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