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Direct from the Manufacturer

Part Manufacturer Description PDF Samples Ordering
TPA2005D1GQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA ri Buy
TPA2005D1ZQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA, 2.5 X 2.5 MM, LEAD FREE ri Buy
SN65220YZBR Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 ri Buy

PBGA* Datasheet

Part Manufacturer Description PDF Type Ordering
PBGA Amkor Technology Innovative designs and expanding package offerings provide a platform from prototype-to-production
ri

2 pages,
289.56 Kb

Original Buy
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PBGA196 N/A
ri

1 pages,
37.51 Kb

Original Buy
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PBGA256 N/A
ri

1 pages,
40.32 Kb

Original Buy
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PBGA*

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Ordering Information MT90866AG MT90866AG 344 Ball PBGA Trays MT90866AG2 MT90866AG2 344 Ball PBGA* Trays *Pb Free Tin/Silver , . . . . 2 Figure 2 - 27 mm x 27 mm PBGA (JEDEC MO-151 MO-151) Pinout . . . . . . . . . . . . . . . . . . . , identified by metallized markings. Figure 2 - 27 mm x 27 mm PBGA (JEDEC MO-151 MO-151) Pinout 8 Zarlink , Pin Description PBGA Ball Number Name Description D5, D7, D9, D11, D12, D14, D16, E4, E17 , . MT90866 MT90866 Data Sheet Pin Description (continued) PBGA Ball Number Name Description C4, A3 ... Zarlink Semiconductor
Original
datasheet

87 pages,
741.44 Kb

ST012 MT90866AG2 MT90866AG MT90866 MO-151 dom2 lidr-9 TEXT
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Abstract: output streams Ordering Information ZL50060GAC ZL50060GAC 256 Ball PBGA ZL50060GAG2 ZL50060GAG2 256 Ball PBGA* ZL50061GAG ZL50061GAG 272 Ball PBGA ZL50061GAG2 ZL50061GAG2 272 Ball PBGA* *Pb Free Tin/Silver/Copper Trays Trays Trays , ZL50060 ZL50060: a 17 mm x 17 mm body, 1 mm ball-pitch, 256-PBGA. · ZL50061 ZL50061: a 27 mm x 27 mm body, 1.27 mm ball-pitch, 272-PBGA. 3 Zarlink Semiconductor Inc. ZL50060/1 ZL50060/1 Data Sheet Table of Contents 1.0 , . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - ZL50061 ZL50061 PBGA Connections (272 PBGA ... Zarlink Semiconductor
Original
datasheet

99 pages,
720.89 Kb

ZL50061GAG2 ZL50061GAG ZL50061 ZL50060GAG2 ZL50060GAC MT90869 BST04 DTA 2030 BCD8 ZL50060/1 TEXT
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Abstract: RFC4553 Package Availability ZL50110 ZL50110 8 T1/E1 (256Ch.) or 2 J2 552 PBGA Now ZL50111 ZL50111 32 T1/E1 (1024Ch.), 2 T3/E3 or 8 J2 552 PBGA Now ZL50112 ZL50112 16 T1/E1 (512Ch.) or 4 J2 552 PBGA Now ZL50114 ZL50114 4 T1/E1 (128Ch.) or 1 J2 552 PBGA Now Applications Leased line support over packet ... Zarlink Semiconductor
Original
datasheet

2 pages,
194.75 Kb

ZL50114 ZL50112 ZL50110 MT9072 GPON block diagram ZL50111 ZL50110/1/2/4 TEXT
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Abstract: R17-2 ZL50232GDG2 ZL50232GDG2 100 Pin LQFP Trays 208 Ball PBGA Trays 100 Pin LQFP* Trays, Bake & Drypack 208 Ball PBGA ... Zarlink Semiconductor
Original
datasheet

44 pages,
653.49 Kb

ZL50232QC ZL50232GD ZL50232 Canceller ZL50232QCG1 TEXT
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Abstract: VDD_COREA S/P Converter OSCi STi[31:0] VDD_IO Ordering Information ZL50019GAC ZL50019GAC 256 Ball PBGA , 256 Ball PBGA* Trays, Bake & Drypack *Pb Free Matte Tin *Pb Free Tin/Silver/Copper Figure 1 - , . . . . . . . 1 Figure 2 - ZL50019 ZL50019 256-Ball 17 mm x 17 mm PBGA (as viewed through top of package) . , ZL50019 ZL50019 256-Ball 17 mm x 17 mm PBGA (as viewed through top of package) 11 Zarlink Semiconductor Inc , Sheet Pin Description PBGA Pin Number LQFP Pin Number E6, E11, F6, F7, F10, F11, L6, L7 ... Texas Instruments
Original
datasheet

166 pages,
1533.68 Kb

DM647 BED02 PBGA 324 19x19 4M14 344c digital audio SCR 6004 TMS 3450 FUNCTIONING TMS320 TMS320C6000 87a4 BED01 hr 8768 TMS320DM648 dsp application DM648 TMS320DM647/TMS320DM648 SPRS372 POWER INDICATE AUTO OFF TIMER CIRCUIT TMS320DM647/TMS320DM648 SPRS372 DM648 layout TMS320DM647/TMS320DM648 SPRS372 TMS320DM647/TMS320DM648 TMS320DM647/TMS320DM648 SPRS372 SPRS372 TEXT
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Abstract: ) VDD_IO 256 Ball PBGA* *Pb Free Matte Tin *Pb Free Tin/Silver/Copper · VDD_CORE Ordering Information 256 Ball PBGA 256 Lead LQFP 256 Lead LQFP* ZL50021GAG2 ZL50021GAG2 32 serial TDM input, 32 serial TDM , 17 mm PBGA (as viewed through top of package) . . . . . . . . . . . . . . . . . . 11 Figure 3 - , ZL50021 ZL50021 256-Ball 17 mm x 17 mm PBGA (as viewed through top of package) 11 Zarlink Semiconductor Inc , Sheet Pin Description PBGA Pin Number LQFP Pin Number E6, E11, F6, F7, F10, F11, L6, L7 ... Zarlink Semiconductor
Original
datasheet

121 pages,
904.13 Kb

ZL50019QCC ZL50019GAC ZL50019 GR-1244-CORE TEXT
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Abstract: Ordering Information ZL50023GAC ZL50023GAC 256 Ball PBGA Trays ZL50023QCC ZL50023QCC 256 Lead LQFP Trays ZL50023GAG2 ZL50023GAG2 256 Ball PBGA* Trays, Bake & Drypack *Pb Free Tin/Silver/Copper -40°C to +85°C · 32 serial TDM , ZL50023 ZL50023 256-Ball 17 mm x 17 mm PBGA (as viewed through top of package) . . . . . . . . . . . . . . . . . . , shown as viewed through top of package. Figure 2 - ZL50023 ZL50023 256-Ball 17 mm x 17 mm PBGA (as viewed , NC ZL50023 ZL50023 2.0 Data Sheet Pin Description PBGA Pin Number LQFP Pin Number E6 ... Zarlink Semiconductor
Original
datasheet

136 pages,
994.68 Kb

ZL50021QCC ZL50021GAG2 ZL50021GAC ZL50021 GR-1244-CORE TEXT
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Abstract: · ZL50110GAG ZL50110GAG 552 PBGA Trays, Bake ZL50111GAG ZL50111GAG 552 PBGA Trays, Bake ZL50114GAG ZL50114GAG 552 PBGA Trays, Bake ZL50110GAG2 ZL50110GAG2 552 PBGA* Trays, Bake ZL50111GAG2 ZL50111GAG2 552 PBGA* Trays, Bake ZL50114GAG2 ZL50114GAG2 552 PBGA* Trays, Bake *Pb Fee Tin Silver/Copper Circuit Emulation Services over Packet (CESoP , Semiconductor Inc. ZL50110/11/14 ZL50110/11/14 2.0 Physical Specification The ZL50111 ZL50111 will be packaged in a PBGA , Package Thickness: 2.33 mm (typ) The ZL50110 ZL50110 will be packaged in a PBGA device. Features: · ... Zarlink Semiconductor
Original
datasheet

83 pages,
600.64 Kb

ZL50023QCC ZL50023GAG2 ZL50023GAC ZL50023 TEXT
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Abstract: ZL50234 ZL50234 8 Channel Voice Echo Canceller Data Sheet Features · March 2006 Independent multiple channels of echo cancellation; from 8 channels of 64 ms to 4 channels of 128 ms with the ability to mix channels at 128 ms or 64 ms in any combination Ordering Information ZL50234/QCC ZL50234/QCC ZL50234/GDC ZL50234/GDC ZL50234QCG1 ZL50234QCG1 100 Pin LQFP Trays 208 Ball PBGA Trays 100 Pin LQFP* Trays, Bake & Drypack *Pb Free Matte Tin -40°C to +85°C · Independent Power Down mode for each group of 2 channels for ... Zarlink Semiconductor
Original
datasheet

103 pages,
1172.14 Kb

ZL50114GAG ZL50114 ZL50111GAG2 ZL50111GAG ZL50111 ZL50110GAG ZL50110/11/14 TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
Q: What is Ball Grid Array? A: Plastic Ball Grid Array (PBGA) packages have increased signal
/datasheets/files/intel/design/i960/packdata/2451-v2.htm
Intel 31/10/1997 12.07 Kb HTM 2451-v2.htm
   PBGA    PLCC    PQFP    PSOP    SBGA    SC-70 SC-70    SHELLOP    SOIC NARROW    PBGA: 163. ubb256a - 256L PBGA, 27.00 x 27.00 x 2.13mm body size 164. ubb256b - 256L PBGA, 27.00 x 27.00 x 2.13mm body size 165. ubd316a - 316L PBGA, 27.00 x 27.00 x 2.13mm body size 166. ube292a - 292L PBGA, 27.00 x 27.00 x 2.13mm body size 167. uca313a - 313L PBGA, 35.00 x 35.00 x 2.33mm body size 168. ucb352a - 352L PBGA, 0.00 x 0.00
/datasheets/files/national/htm/nsc00747.htm
National 01/11/2002 42.38 Kb HTM nsc00747.htm
National Semiconductor - Selection Guide by Package Type - METAL QUAD Plastic: EBGA     FBGA     ISOLATED TO220     LAMINATE CSP     LAMINATE TCSP     LAMINATE UCSP     LBGA     LLP     LQFP     MDIP     METAL QUAD     MICROSMD     MINI SOIC     PBGA     PLCC     PQFP     PSOP     SC-70 SC-70     SOIC NARROW     SOIC WIDE     SOP EIAJ TYPE II     SOT-223     SOT-23     SSOP     SSOP-EIAJ     TO 220     TO 252     TO 263     TO 92     TQFP    
/datasheets/files/national/htm/nsc02402-v3.htm
National 16/08/2002 9.76 Kb HTM nsc02402-v3.htm
National udd217a Package Folder: 217L PBGA, 35.00 x 35.00 x 2.13mm body size National udd217a Package 217L PBGA, 35.00 x 35.00 x 2.13mm body size Contents Dimensions Packaging Mechanical Drawing PBGA Selection Guide
/datasheets/files/national/htm/nsc00829.htm
National 01/11/2002 8.8 Kb HTM nsc00829.htm
National ube292a Package Folder: 292L PBGA, 27.00 x 27.00 x 2.13mm body size     Design   Purchasing   Quality   Company    Jobs   National ube292a Package 292L PBGA, 27.00 x 27.00 x 2.13mm body size Contents
/datasheets/files/national/htm/nsc02028-v2.htm
National 14/09/2000 8.2 Kb HTM nsc02028-v2.htm
National Semiconductor - Selection Guide by Package Type - CERAMIC SOIC Plastic: EBGA     FBGA     ISOLATED TO220     LAMINATE CSP     LAMINATE TCSP     LAMINATE UCSP     LBGA     LLP     LQFP     MDIP     MICROSMD     MINI SOIC     PBGA     PLCC     PQFP     PSOP     SC-70 SC-70     SOIC NARROW     SOIC WIDE     SOP EIAJ TYPE II     SOT-223     SOT-23     SSOP     SSOP-EIAJ     TO 220    
/datasheets/files/national/htm/nsc00911.htm
National 01/11/2002 69.62 Kb HTM nsc00911.htm
National ubb256b Package Folder: 256L PBGA, 27.00 x 27.00 x 2.13mm body size National ubb256b Package 256L PBGA, 27.00 x 27.00 x 2.13mm body size Contents Standards Dimensions Packaging Mechanical Drawing PBGA Selection Guide
/datasheets/files/national/htm/nsc00813.htm
National 01/11/2002 8.98 Kb HTM nsc00813.htm
National Semiconductor - Selection Guide by Package Type - SOIC WIDE Plastic: EBGA     FBGA     ISOLATED TO220     LAMINATE CSP     LAMINATE TCSP     LAMINATE UCSP     LBGA     LLP     LQFP     MDIP     MICROSMD     MINI SOIC     PBGA     PLCC     PQFP     PSOP     SC-70 SC-70     SOIC NARROW     SOIC WIDE     SOP EIAJ TYPE II     SOT-223     SOT-23     SSOP     SSOP-EIAJ     TO 220     TO 252     TO 263     TO 92     TQFP     TSSOP     TSSOP EXP
/datasheets/files/national/htm/nsc00942-v2.htm
National 01/11/2002 228.77 Kb HTM nsc00942-v2.htm
National Semiconductor - Selection Guide by Package Type - CPGA Plastic: EBGA     FBGA     ISOLATED TO220     LAMINATE CSP     LAMINATE TCSP     LAMINATE UCSP     LBGA     LLP     LQFP     MDIP     MICROSMD     MINI SOIC     PBGA     PLCC     PQFP     PSOP     SC-70 SC-70     SOIC NARROW     SOIC WIDE     SOP EIAJ TYPE II     SOT-223     SOT-23     SSOP     SSOP-EIAJ     TO 220     TO 252     TO 263     TO 92     TQFP     TSSOP     TSSOP EXP
/datasheets/files/national/htm/nsc00915.htm
National 01/11/2002 11.33 Kb HTM nsc00915.htm
National UCB388A UCB388A Package Folder: 388 BALL PLASTIC BALL GRID ARRAY (PBGA)     Design   Purchasing   Quality   Company    Jobs   National UCB388A UCB388A Package 388 BALL PLASTIC BALL GRID ARRAY (PBGA) Contents Standards Dimensions Packaging Mechanical Drawing Standards Dimensions Body Size Wide Nom.: Long
/datasheets/files/national/htm/nsc01740-v6.htm
National 13/08/1999 6.5 Kb HTM nsc01740-v6.htm