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SX-1131-S-1K* Red Lion Controls OKY-LTD TO1024I/O,SNGLPRO visit Digikey Buy
MT-10 Amprobe Test Tools MOISTURE METER visit Digikey Buy
ACC-007 LAIRD PLC BOARD CODEC MULTICH OKI 7705 visit Digikey Buy
1A-CC3B-020 Essentra Components CHEESECLOTH MOISTURE ABSORB 1BX visit Digikey Buy
SEN-13322 SparkFun Electronics SPARKFUN SOIL MOISTURE SENSOR visit Digikey Buy
3371012 SCS BAG MOISTUR BARRIER 10X12 visit Digikey Buy

Oki Moisture

Catalog Datasheet MFG & Type PDF Document Tags

oki qfp tray

Abstract: Ultrasonic humidifier circuit Packing & Handing Methods for Packages of Each Moisture Sensitivity Level (OKI Level) Package method , PACKAGE HANDLING GUIDE 3.1 Storing and Handling of Pack Products 3.1.1 Moisture Sensitivity Levels of Plastic Surface Mount Packages (1) Overview of Moisture Sensitivity Levels Each surface mount package is provided with a moisture sensitivity level through evaluation of the moisture absorption for use with reflow soldering techniques. The main purposes of adopting the moisture sensitivity system
OKI Electric Industry
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sem 2106 inverter diagram

Abstract: induction cooker schematic diagram for supporting OKI Semiconductor products. In the rapidly advancing electronics industry, types of , performance and function, are rapidly increasing. To meet such demands, Oki makes constant efforts to develop , areas. Oki Semiconductor manufacturing locations such as the Electronic Devices(ED) Group of Oki Electric, Oki Miyazaki, Oki Miyagi, Oki Semiconductor Manufacturing (USA), and Oki Thailand (Thailand , customer satisfaction system for product quality. At this time we have created the "OKI Semiconductor
OKI Electric Industry
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Abstract: Moisture Resistance * 1.0 96 Max Vibration t 0D + 0.5 96 Max Current Noise : 0d  , VOLTAGE RESISTANCE RANGE E-24, 15% 281 2 0.610.05 1/2W 250V 400V 0.511) - 51 OKI) 11.511 4.510.5 2513 0.810.05 1W 350V 600V 0.511) - 51 OKI) RSF-2 15.511 5.010.5 3513 0.810.05 2W 350V 600V 0.511) - 51 OKI) RSF-3M 17.511 6.511.0 , 0.810.05 3W 500V 800V 0.51!) - 51 OKI) RSF-4 24.411.5 8.511.0 3 813 0.810.05 -
OCR Scan

koki solder paste

Abstract: BGA256 mounting techniques are required. The main point here is to present how OKI's SOP, QFP, SOJ, QFJ (PLCC , . If necessary, please contact OKI local representative. 24 PACKAGE INFORMATION 4. OUTLINE OF , molding resin used in the plastic package molding process is left in air, moisture in the air penetrates the package and diffuses throughout. 4.5.2 Moisture Absorption Characteristics of Molding Resin Absorbed Moisture Amount (ppm) Figure 4.5.1 shows the moisture absorption characteristics of the molding
OKI Electric Industry
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LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations , -P-1020-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for , Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to , 6.3 ± 0.15 Please consult OKI for soldering, assembly and storage recommendations. Specification , 0.15 1.1 ± 0.15 3.1 ± 0.15 0.125 ± 0.05 2.3 ± 0.05 3.3 ± 0.15 7.3 ± 0.15 Please consult OKI for
OKI Electric Industry
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RTCK

Abstract: ARM7tdmi pin configuration 1 OKI ADI BOARD User's Manual Oki ARM7TDMI Interface Unit (ADI Board) Preliminary 5'th Edition, Feb 2001 Oki Electric Industry Co., Ltd. Notes 1. The contents of this Document are , ranges. Oki Electric Industry shall not be liable for adverse results when the product is operated , license for any third-party industrial rights, intellectual property rights, or other rights. Oki , or breakdown. Equipment and system designs based on Oki Electric Industry products should therefore
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Abstract: at 310'C for 3 sec or less. Keep the package surface temperature below 150'C. It is OKI checks the , reflow soldering conditions differ from those recommended by OKI, contact an OKI sales personnel. 14 OPTICAL MOS RELAY Handling Precautions At that times, provide OKI with the following information. Package , when it is hydrolyzed, which will deteriorate the moisture resistance in semiconductor devices and it , frequency should be only once. If the frequency must be changed, contact an OKI sales personnel. 15 -
OCR Scan

BCM2002X

Abstract: L7055 OKI Semiconductor ML7055LA PEDL7055LA-01 Issue Date: Aug. 30, 2002 Preliminary Bluetooth , architecture, and supports the interfaces for a variety of applications. Since the ML7055LA has Oki , Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - BROADCOM , . and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development. 1/1 PEDL7055LA-01 OKI Semiconductor ML7055LA
OKI Electric Industry
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BCM2002X L7055 paramp 64-pin conexant modem 176KB

UART Program Examples

Abstract: BCM2002X OKI Semiconductor ML7055LP PEDL7055LP-01 Issue Date: Aug. 30, 2002 Preliminary Bluetooth , architecture, and supports the interfaces for a variety of applications. Since the ML7055LP has Oki , Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - BROADCOM , . and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development. 1/1 PEDL7055LP-01 OKI Semiconductor ML7055LP
OKI Electric Industry
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UART Program Examples

BCM2002X

Abstract: broadcom acl packet moisture content when in storage. Therefore, please contact your Oki Electric Industry Co., Ltd. sales , OKI Semiconductor ML7055HB PEDL7055HB-01 Issue Date: Aug. 30, 2002 Preliminary Bluetooth , architecture, and supports the interfaces for a variety of applications. Since the ML7055HB has Oki , Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - BROADCOM , , Inc. and licensed to Oki Electric Industry. The information contained herein can change without
OKI Electric Industry
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broadcom acl packet Broadcom reflow

induction cooker schematic diagram

Abstract: schematic diagram induction cooker for supporting Oki Semiconductor products. To welcome the dawn of a new age of unlimited potential brought about by advances in the global network information revolution, the Oki semiconductor business was launched as a new company, Silicon Solution Company (SiSC), in April 2000. Making the most of Oki , supplier in terms of customer satisfaction. In order to introduce Oki's approach to and efforts in quality , create the Oki Semiconductor Integrated Circuit Quality and Reliability Handbook in the belief that its
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induction cooker schematic diagram schematic diagram induction cooker gas cooker circuit ignitor 4701-306 foundry metals quality MANUALS transistor 1411 tester ED-4701

MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

Abstract: IEC60068 INTRODUCTION Thank you for supporting Oki Semiconductor products. To welcome the dawn of a new age of unlimited potential brought about by advances in the global network information revolution, the Oki , most of Oki's unique technology, such as silicon platform architecture (SPA) solutions, communications , the number one supplier in terms of customer satisfaction. In order to introduce Oki's approach to and , opportunity to create the Oki Semiconductor Integrated Circuit Quality and Reliability Handbook in the belief
OKI Electric Industry
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MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR IEC60068 EIAJ ED-4701-1 TR4 TRANSISTOR SMD MARKING CODE The Japanese Transistor Manual 1981 Diode SMD SJ 19 MIL-STD-883 MIL-STD-202

oki qfp tray

Abstract: 353512 Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI , ] OKI Suffix Remarks TSOP(2) (Thin Small Outline Package Type 2) 26(20), 26(24), 28, 28(24 , ] OKI Suffix LFBGA (Low Fine Ball Grid Array) 104, 144, 224 1.00, 1.27 LA Epoxy package , . For example, MLML63152TB is an LSI moulded into a TQFP. The package identifiers are unique to OKI , Layout D Layout E Layout F OKI JAPAN M XXXXXXX M OKI JAPAN XXXX M M OKI XXXX M
OKI Electric Industry
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oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 16PHSSOP 40PQFP

BCM2002X

Abstract: CX72303 OKI Semiconductor ML70512HB PEDL70512HB-01 Issue Date: Aug. 30, 2002 Preliminary , Oki's Bluetooth protocol stack software installed, when the IC is used in conjunction with the , Bluetooth RF Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - , trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained , -01 OKI Semiconductor ML70512HB ABSOLUTE MAXIMUM RATINGS Parameter Power supply voltage (I/O
OKI Electric Industry
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BCM2002X

Abstract: CX72303 package moisture content when in storage. Therefore, please contact your Oki Electric Industry Co., Ltd , OKI Semiconductor ML70512LA PEDL70512LA-01 Issue Date: Aug. 30, 2002 Preliminary , Oki's Bluetooth protocol stack software installed, when the IC is used in conjunction with the , Bluetooth RF Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - , by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can
OKI Electric Industry
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pcms

BCM2002X

Abstract: CX72303 during reflow mounting and package moisture content when in storage. Therefore, please contact your Oki , OKI Semiconductor ML70512LP PEDL70512LP-01 Issue Date: Aug. 30, 2002 Preliminary , Oki's Bluetooth protocol stack software installed, when the IC is used in conjunction with the , Bluetooth RF Interfaces: - OKI's RF-LSI interface (ML7050LA) - CONEXANT's RF-LSI interface (CX72303) - , by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can
OKI Electric Industry
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MD14 MD25 MD14 package

xc9572 pin diagram

Abstract: MTU-11096 1 ML67Q4003 CPU BOARD Hardware Manual Oki ARM7TDMI Emulation Kit Second Edition, Mar. 2003 , range, heat dissipation characteristics, and other guaranteed ranges. Oki Electric Industry shall not , rights, intellectual property rights, or other rights. Oki Electric Industry shall therefore be in no , designs based on Oki Electric Industry products should therefore ensure that such failures do not risk , contact Oki Electric Industry Sales. 7. The product described in this Manual qualifies as strategic
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XC9572 xc9572 pin diagram MTU-11096 MAX3232 ML674K 20 pin JTAG CONNECTOR TC55V16256FT MSM56V64160

MD14 package

Abstract: ML7050LA FEDL70Q5110LA-01 OKI Semiconductor ML70Q5110LA Issue Date:Sep.2, 2002 Bluetooth Baseband , (Bluetooth RF Transceiver IC) and the OKI Bluetooth Protocol Stack Software, data/voice communications are , . BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The , FEDL70Q5110LA-01 OKI Semiconductor ML70Q5110LA ABSOLUTE MAXIMUM RATINGS Parameter Symbol , FEDL70Q5110LA-01 OKI Semiconductor ML70Q5110LA PIN PLACEMENT 1 2 3 NC PLL_PS PLL
OKI Electric Industry
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bluetooth 1 chip controller usb

xc9572 pin diagram

Abstract: ML674000 guaranteed ranges. Oki Electric Industry shall not be liable for adverse results when the product is , license for any third-party industrial rights, intellectual property rights, or other rights. Oki , or breakdown. Equipment and system designs based on Oki Electric Industry products should therefore , attachment to actual equipment) should first contact Oki Electric Industry Sales. 7. The product described , discrepancies to your nearest Oki Electric Industry representative. 9. The contents of this Manual shall not
OKI Electric Industry
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ML674000 12pin connector circular RS232C

Oki Moisture

Abstract: ML671000 OKI ML674000 CPU BOARD User's Guide Oki ARM7TDMI Emulation Kit Second Edition, Apr. 2002 Oki Electric Industry Co., Ltd. Notes 1. The contents of this Document are subject to change , , operating supply voltage range, heat dissipation characteristics, and other guaranteed ranges. Oki Electric , industrial rights, intellectual property rights, or other rights. Oki Electric Industry shall therefore be , designs based on Oki Electric Industry products should therefore ensure that such failures do not risk
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Oki Moisture ML671000 B8001000
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