NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 15.3x11.8x3.06 Nitto GE-100-LFC PCB; BT; Sn/ Pb Balls Sn Plate/Ni/Stainless Steel QMI 516, Dexter Hysol Au , Units: Quantity: Fails: Ea: MTTF (Yrs): FITs: CRYSTAL 1 100 0 0.7 12463 ... | Original |
5 pages, |
nitto GE ML614R J-STD-020 MIL-STD-883-2012 GE-100-LFC Nitto GE 100 DS12R887 DS12R887 abstract |
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| Abstract: ATP (Amkor, PI) 256 MCMBGA (Pb-Free) 27x27x1.73 Nitto GE-100-L PCB; BT 4 layers SnAgCu Ball ... | Original |
6 pages, |
MARK FA Nitto GE 100 Nitto GE DS33R11 DS33R11 abstract |
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| Abstract: Sensitivity (JEDEC J-STD20A J-STD20A) Date Code Range: ATP (Amkor, PI) 256 MCMBGA (Pb-Free) 27x27x1.73 Nitto GE-100-L PCB; BT 4 layers SnAgCu Ball (96.5/3/0.5) 2300 Ablebond Silverfiled Epoxy Au / 1.2 mil UL ... | Original |
7 pages, |
nitto GE Nitto GE 100 DS33R41 DS33R41 abstract |
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| Abstract: ASE Taiwan Nitto GE-100LFCS series Sumitomo G770 series Amkor Korea Amkor Philippines , Cycle "B" FBGA 896 450 hrs PCL3 + HAST Nitto GE-100LFCS series 0/25 High Temp Bake @ , this notification. Revision History: Date 10/03/2007 Rev 1.0.0 1.0.1 Altera Corporation , 672 UBGA 49 169 484 MBGA 100 256 FBGA 100 144 Altera Corporation 10/17 , N/mm2 % Sumitomo EME-G770 EME-G770 series MAR/Low vis. MAR/Tough 88.5 100/0 55 13 Modified ... | Original |
9 pages, |
cte table CEL9750ZHF10AKL G770* G770 mold compound Sumitomo 1000 cel hitachi G770 mold compound G770* sumitomo CEL-9750 GE100LFCS nitto CEL9750 GE-100LFCS CEL-9750ZHF10AKL Nitto GE 100 Hitachi CEL-9750ZHF10AKL PCN0712 PCN0712 abstract |
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| Abstract: Au wire Mold Compound: HC-100XJAA-M HC-100XJAA-M Nitto GE-100L Substrate: HL832HS/ HL832HS/ AUS303 AUS303 HL832NX-A/ HL832NX-A/ AUS308 AUS308 , Test (Biased, 130 °C/85% RH, 100 Hours) JESD22-A110 JESD22-A110 45/0 * Temperature Cycle (-55 °C to +125 ... | Original |
4 pages, |
HL832NX HL832NX-A HL832nxa Nitto AUS-308 SXVX-210BHG SXVX-50 HC-100-XJAA-M aus303 AUS308 HL832HS sxvx Nitto HC SXVX-50BHG HC-100XJAA-M A1008-07 A1008-07 abstract |
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| Abstract: : CCL-HL832 CCL-HL832 Ablestik 2300 25 um or 30 um Nitto GE 100L 63 Sn / 37 Pb Test Services Program generation , 1.00, 1.27 & 1.50 mm ball pitch available · 13 mm to 40 mm body sizes · Low Profile and lightweight , 313 352/388 420/456 452 809 580 680 1,156 524 784 564 900 1.0 1.27 1.27 1.27 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.50 1.27 1.27 1.27 1.00 1.00 1.50 1.27 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.27 1.27 1.00 1.00 1.00 1.27 1.27 ... | Original |
2 pages, |
MS-034 CO-029 CCL-HL832 CCL-HL-832 100L nitto GE-100L Nitto GE 100 GE-100L nitto GE datasheet abstract |
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| Abstract: Au wire 25 um or 30 um Mold compound Nitto GE 100L Solder Balls 63 Sn / 37 Pb Test Services , from prototype-to-production. · Ball counts up to 1156 · 13.0 mm to 40.0 mm body sizes · 1.00, 1.27 , 1.27 1.27 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.50 1.27 1.27 1.27 1.00 1.00 1.50 1.27 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.27 1.27 1.00 1.00 1.00 1.27 1.27 1.27 1.27 12 x 12 F 7 x 17 F 9 x 17 F 11 x 11 F 14 x 14 P 14 x 14 F 16 x 16 ... | Original |
2 pages, |
nitto GE-100L Amkor Wafer level mold compound CCL-HL832 CO-029 HL832 pcb material datasheet MS-034 nitto GE 100L Nitto GE 100 GE-100L datasheet abstract |
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| Abstract: Eas y to Use g M n ge r Managem me n we Po w we ow ow on P Powering Your , / 100%) and margining (5% / 10%) · Wide operating range · Power-up/down sequencing · , VIN 25% 50% 75% 100% Drivers Controller Load Current · · · · · · VOUT , Voltage tracking (50% / 100%) Autonomous output sequencing Adjustable voltage margining (5% / 10% , 1-888-INTERSIL 1-888-INTERSIL 1-888-468-3774 6F, Mita Nitto Daibiru 3-11-36, Mita, Minato-ku Tokyo, 108-0073 Japan (TEL ... | Original |
6 pages, |
5V 40A DESIGN POWER SUPPLY converter 12v 3a digital dc-dc converter 12v to 5v 3a ic design ideas Nitto GE 100 ZL1505 ZL1505ALNNT ZL2008 ZL2008ALAFT ZL2103 ZL2106 ZL6100 datasheet abstract |
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| Abstract: test) Bill Of Material Package Material type Current New type BGA Mold Compound Nitto Denko GE-100LC Sumikon EME-G760L EME-G760L BGA Die Attach Yizbond NC7720 NC7720 Ablebond 2025D 2025D BGA Bond wire 99.99% Au , Autoclave (PCT) JESD22-A102 JESD22-A102 121癈 / 100% RH, 96 hrs 77/0 Biased HAST JESD22-A110 JESD22-A110 130癈 / 85%RH, 3.3V, 96 ... | Original |
7 pages, |
EFM32G200F64 EN4900 QFN64 QFN0606 HL-832NXA CEL9220HF BGA112 CEL9220 Yizbond SUMIKON EME-G700 PSR4000AUS308 eme-g700 EME-G760L DS-7409HG PCN1-110704 PCN1-110704 abstract |
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| Abstract: 1 Ge (dopant) 7440-56-4 0.000 1 P (dopant) 7723-14-0 0.000 1 Sb (dopant , TECHNICHEM-MALAYSIA per Report# ATJB/2038BS/2006 ATJB/2038BS/2006 by Nitto Elect Kyusha-Japan per Report# 05-03-100 RoHS Material , (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of ... | Original |
2 pages, |
JIG-101 Co3O4 121-990 Nitto GE 100 nitto GE datasheet abstract |
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