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NE73400 Datasheet

Part Manufacturer Description PDF Type Ordering
NE73400 NEC NE734 Series NPN Silicon General Purpose Transistor
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12 pages,
1027.28 Kb

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NE73400 NEC 2 GHz, 30 V, NPN silicon general purpose transistor
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11 pages,
441.85 Kb

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NE73400

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: form (NE73400), several package styles are avail able. The NE73433 NE73433 is in the plastic Mini-Mold package , CHARACTERISTICS (Ta = 25°c ) PART NUMBER EIAJ1 REGISTERED NUMBER PACKAGE OUTLINE SYMBOLS fT NE73400 00 (CHIP , , f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73430-T1 NE73433-T1B NE73433-T1B NE73435 NE73435 Note: 1 , (umtsm m m ) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160 um TYP 2.55±0 .2 ,+ 0 ... OCR Scan
datasheet

7 pages,
253.47 Kb

NE73435 NE734 TEXT
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Abstract: assure uniform performance and reliability. Besides the chip form (NE73400), several package styles are , SYMBOLS fT NE73400 00 (CHIP) UNITS GHz GHz dB dB dB dB dB dB MIN 1.5 TYP 2.0 MAX MIN NE73430 NE73430 , Frequency, f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73430-T1 NE73433-T1B NE73433-T1B NE73435 NE73435 Note; 1 , in mm) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160|jm TY P 0.35 0.3 ... OCR Scan
datasheet

7 pages,
175.14 Kb

OCI 531 NE73435 NE734 TEXT
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Abstract: assure uniform perform ance and reliability. Besides the chip form (NE73400) several package styles are , 1 MHz Total Power Dissipation Thermal Resistance (Junction to Case) NE73400 00 (CHIP) UNITS MIN TYP , DIMENSIONS (u nitsin mm) NE73400 (CHIP) Chip Thickness: 160|imTYP 0.35 0.3 0.26 PACKAGE OUTLINE ... OCR Scan
datasheet

12 pages,
464.32 Kb

2SC1424 NE73435 NE734 TEXT
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Abstract: . Bes ides the chip form (NE73400) several package styles are available. While the series is designed , NE73400 OO(CHIP) UNITS MIN TYP MAX MIN GHz GHz dB 1.5 2.0 1.5 NE73412 NE73412 2SC1424 2SC1424 12 NE73416 NE73416 16 NE73430 NE73430 , AX- NE73400 (C H IP) Chip Thickness: 160 um TYP - 0 .3 5 - 0.3 - 0.26 -5.84 MAX-* 1*44.95 MAX ... OCR Scan
datasheet

12 pages,
486.63 Kb

2SC4090 2SC2026 017 545 71 32 02 2SC1424 NE73435 NE734 TEXT
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Abstract: v3le metallization system to assure uniform performance and reliability. Besides the chip form (NE73400) several , CHARACTERISTICS PARTNUMBER EIA J1 REGISTERED NUMBER PACKAGE OUTLINE NE73400 00 (CHIP) NE73412 NE73412 , 3-140 b427525 00bS?24 DT3 NE734 NE734 SERIES OUTLINE DIMENSIONS (Units in mm) NE73400(CHIP) Chip ... OCR Scan
datasheet

12 pages,
1027.28 Kb

2SC2026 2SC4090 2SC4185 6206 sot 89 682 MARKING SOT-23 dh 1507 Ic D 1708 ag NE73412 NE AND micro-X NE734 NE73400 NE73416 mic J60 2SC202 j60 mic 017 545 71 32 02 2SC2148 MARKING Dt3 sot23 transistor 2SC1424 NE73435 TEXT
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Abstract: the chip form (NE73400) several package styles are available. While the series is designed for , 0.9 GHz NFMIN NE73400 00 (CHIP) hFE ICBO IEBO CCB PT RTH NE73430 NE73430 2SC4185 2SC4185 30 , |S12| 2 |S12 S21| NE734 NE734 SERIES OUTLINE DIMENSIONS (Units in mm) NE73400 (CHIP) Chip Thickness ... Original
datasheet

12 pages,
196.14 Kb

2SC12 2SC1275 2SC202 2SC2148 2SC4185 micro-x mhz ghz microwave NE734 NE73400 NE73412 RF TRANSISTOR NPN MICRO-X NE73435 NE73433 NE73430 NE73416 transistor "micro-x" "marking" 3 2SC2026 transistor 2sc2026 pt 5767 Rf transistor 2SC1733 2SC1424 TEXT
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Abstract: the chip form (NE73400), several package styles are available in both single and dual chip , 1SE D OUTLINE DIMENSIONS (Units m mm) NE73400 (CHIP) Chip Thickness: 160 pm TYP b427414 GOOmbT T M ... OCR Scan
datasheet

11 pages,
441.85 Kb

UHF mic ic 2SC2141 NE734 NE73400 NE73432B NE73433 NE73437 2SC1275 NE73435 2SC2148 2sc2026 NE73432 JE73 2SC2759 ne73436 2SC1424 2SC1733 2SC2037 TEXT
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Abstract: NE02107-L NE85608-L Ratings Units NE73400(L) NE73408 NE73408(L) VCBO Collector to Base Voltage 30 v vceo Collector to Emitter , mm) 0.030 33/37 GET-30698 GET-30698 Rev.F 5) NE73400(L) ©Metallization — Emitter and Base Metal â ... OCR Scan
datasheet

39 pages,
1034.1 Kb

NE02107 NE02108 NE41600 UPC2758B UPC1678B UPC2709P UPB1510P UPB1509 UPB1510B NE02103 NE41607 NE85608 UPB1508B NE73408 NE68108 GET-30698 GET-30698 upc2709b GET-30698 GET-30698 UPB1509B GET-30698 GET-30698 UPC2712B GET-30698 GET-30698 GET-30698 GET-30698 GET-30698 TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
! FILENAME: NE73400D.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=30mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.583
/datasheets/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400d.s2p
Spice Models 29/07/2012 2.12 Kb S2P ne73400d.s2p
! FILENAME: NE73400C.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=20mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50
/datasheets/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400c.s2p
Spice Models 29/07/2012 2.16 Kb S2P ne73400c.s2p
! FILENAME: NE73400A.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V IC=5mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0113"(286um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0081"(205um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0123"(312um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.804
/datasheets/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400a.s2p
Spice Models 29/07/2012 2.08 Kb S2P ne73400a.s2p
! FILENAME: NE73400B.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=10mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.700
/datasheets/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400b.s2p
Spice Models 29/07/2012 2.07 Kb S2P ne73400b.s2p