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NE73400 Datasheet

Part Manufacturer Description PDF Type Ordering
NE73400 NEC Electronics NE734 Series NPN Silicon General Purpose Transistor
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12 pages,
1027.28 Kb

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NE73400 NEC Electronics 2 GHz, 30 V, NPN silicon general purpose transistor
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11 pages,
441.85 Kb

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NE73400

Catalog Datasheet Results Type PDF Document Tags
Abstract: assure uniform performance and reliability. Besides the chip form (NE73400), several package styles are , SYMBOLS fT NE73400 00 (CHIP) UNITS GHz GHz dB dB dB dB dB dB MIN 1.5 TYP 2.0 MAX MIN NE73430 NE73430 , Frequency, f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73430-T1 NE73433-T1B NE73433-T1B NE73435 NE73435 Note; 1. , in mm) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160|jm TY P 0.35 0.3 ... OCR Scan
datasheet

7 pages,
175.14 Kb

OCI 531 NE73435 NE73435 abstract
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Abstract: form (NE73400), several package styles are avail able. The NE73433 NE73433 is in the plastic Mini-Mold package , CHARACTERISTICS (Ta = 25°c ) PART NUMBER EIAJ1 REGISTERED NUMBER PACKAGE OUTLINE SYMBOLS fT NE73400 00 (CHIP , , f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73430-T1 NE73433-T1B NE73433-T1B NE73435 NE73435 Note: 1. , (umtsm m m ) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160 um TYP 2.55±0 .2 ,+ 0 ... OCR Scan
datasheet

7 pages,
253.47 Kb

NE73435 NE73435 abstract
datasheet frame
Abstract: v3le assure uniform performance and reliability. Besides the chip form (NE73400) several package styles are , EIA J1 REGISTERED NUMBER PACKAGE OUTLINE NE73400 00 (CHIP) NE73412 NE73412 2SC1424 2SC1424 12 NE73416 NE73416 16 , OUTLINE DIMENSIONS (Units in mm) NE73400(CHIP) Chip Thickness: 160hjtiTYP PACKAGE OUTLINE 16 5.33 MAX ... OCR Scan
datasheet

12 pages,
1027.28 Kb

6206 sot 89 682 MARKING SOT-23 Ic D 1708 ag 05 sg2 SOT23 NE AND micro-X NE734 sot-23 marking jn NE73435 NE73433 NE73430 NE73416 NE73412 NE73400 datasheet abstract
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Abstract: Bes ides the chip form (NE73400) several package styles are available. While the series is designed , NE73400 OO(CHIP) UNITS MIN TYP MAX MIN GHz GHz dB 1.5 2.0 1.5 NE73412 NE73412 2SC1424 2SC1424 12 NE73416 NE73416 16 NE73430 NE73430 , AX- NE73400 (C H IP) Chip Thickness: 160 um TYP - 0 .3 5 - 0.3 - 0.26 -5.84 MAX-* 1*44.95 MAX ... OCR Scan
datasheet

12 pages,
486.63 Kb

2SC4090 2SC2026 017 545 71 32 02 2SC1424 NE73435 NE73435 abstract
datasheet frame
Abstract: assure uniform perform ance and reliability. Besides the chip form (NE73400) several package styles are , Total Power Dissipation Thermal Resistance (Junction to Case) NE73400 00 (CHIP) UNITS MIN TYP MAX MIN , DIMENSIONS (u nitsin mm) NE73400 (CHIP) Chip Thickness: 160|imTYP 0.35 0.3 0.26 PACKAGE OUTLINE ... OCR Scan
datasheet

12 pages,
464.32 Kb

2SC1424 NE73435 NE734 NE73435 abstract
datasheet frame
Abstract: form (NE73400) several package styles are available. While the series is designed for industrial , at VCE = 10 V, IC = 3 mA, f = 0.5 GHz VCE = 10 V, IC = 5 mA, f = 0.9 GHz NFMIN NE73400 00 , | , = S11 S22 - S21 S12 |S12| 2 |S12 S21| NE734 NE734 SERIES OUTLINE DIMENSIONS (Units in mm) NE73400 ... Original
datasheet

12 pages,
196.14 Kb

2SC2148 2SC202 2SC1275 2SC12 1011 sot323 marking NE73400 NE73412 NE73416 SOT-23 marking 717 S21E RF TRANSISTOR NPN MICRO-X pt 5767 Rf transistor NE73435 NE73433 NE73435 abstract
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Abstract: NE02107-L NE85608-L Table 3 - 2 Absolute Maximum Ratings Ta=25°c Part No Symbols Parameters Ratings Units NE73400(L , ©Chip Drawing (Units in mm) 0.030 33/37 GET-30698 GET-30698 Rev.F 5) NE73400(L) ©Metallization - Emitter and ... OCR Scan
datasheet

39 pages,
1034.1 Kb

UPC2758B UPC2758 UPC1677P UPB1510B UPC1678B NE02107 UPB1510P NE02103 UPB1509 UPC2709P NE68108 NE41607 UPB1508B NE85608 NE73408 datasheet abstract
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Abstract: gold metallization system to assure uniform performance and reliability. Besides the chip form (NE73400 , M H /8 ... OCR Scan
datasheet

11 pages,
441.85 Kb

NE73437 2SC2141 2SC1275 NE734 NE73400 ne73436 NE73433 NE73435 2SC1424 2sc2026 NE73432 2SC2148 JE73 2SC2759 2SC1733 datasheet abstract
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! FILENAME: NE73400A.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V IC=5mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0113"(286um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0081"(205um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0123"(312um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.804 -39 10.671 154
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/cel_spice_files_and_s2p_files/small%20signal%20bipolars/s-param/ne73400a.s2p
Spice Models 29/07/2012 2.82 Kb S2P ne73400a.s2p
! FILENAME: NE73400D.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=30mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.583 -109 23.382 128 0.014 53
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400d.s2p
Spice Models 29/07/2012 2.12 Kb S2P ne73400d.s2p
! FILENAME: NE73400C.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=20mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.613 -91 22.603 134
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400c.s2p
Spice Models 29/07/2012 2.16 Kb S2P ne73400c.s2p
! FILENAME: NE73400B.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=10mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.700 -62 17.166 144 0.020 61 0.857
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400b.s2p
Spice Models 29/07/2012 2.07 Kb S2P ne73400b.s2p
! FILENAME: NE73400A.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V IC=5mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0113"(286um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0081"(205um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0123"(312um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.804 -39 10.671 154 0.023 67
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/nec/sparam/ne73400a.s2p
Spice Models 29/07/2012 2.08 Kb S2P ne73400a.s2p
! FILENAME: NE73400D.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=30mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.583 -109 23.382 128
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/cel_spice_files_and_s2p_files/small%20signal%20bipolars/s-param/ne73400d.s2p
Spice Models 29/07/2012 2.82 Kb S2P ne73400d.s2p
! FILENAME: NE73400C.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=20mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.613 -91 22.603
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/cel_spice_files_and_s2p_files/small%20signal%20bipolars/s-param/ne73400c.s2p
Spice Models 29/07/2012 2.86 Kb S2P ne73400c.s2p
! FILENAME: NE73400B.S2P VERSION: 7.0 ! NEC PART NUMBER: NE73400 DATE: 7/93 ! BIAS CONDITIONS: VCE=10V, IC=10mA ! NOTE: S-PARAMETERS INCLUDE BOND WIRES. ! BASE: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0136"(346um) LONG EACH WIRE. ! COLLECTOR: TOTAL 1 WIRE(S), 1 PER BOND PAD, 0.0083"(212um) LONG EACH WIRE. ! EMITTER: TOTAL 2 WIRE(S), 1 PER SIDE, 0.0169"(428um) LONG EACH WIRE. ! WIRE: 0.0007"(17.8um) DIA., GOLD. # GHZ S MA R 50 .100 0.700 -62 17.166 144
www.datasheetarchive.com/files/spicemodels/misc/s_parameter_cd/cel_spice_files_and_s2p_files/small%20signal%20bipolars/s-param/ne73400b.s2p
Spice Models 29/07/2012 2.82 Kb S2P ne73400b.s2p