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NE73400 Datasheet

Part Manufacturer Description PDF Type
NE73400 NEC NE734 Series NPN Silicon General Purpose Transistor Scan
NE73400 NEC 2 GHz, 30 V, NPN silicon general purpose transistor Scan

NE73400

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: form (NE73400), several package styles are avail able. The NE73433 is in the plastic Mini-Mold package , CHARACTERISTICS (Ta = 25°c ) PART NUMBER EIAJ1 REGISTERED NUMBER PACKAGE OUTLINE SYMBOLS fT NE73400 00 (CHIP , , f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73433-T1B NE73435 Note: 1 , (umtsm m m ) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160 um TYP 2.55±0 .2 ,+ 0 -
OCR Scan
23STYLE NE734 IME73430 NE73430 2SC4185 IS12I IS12S21I
Abstract: assure uniform performance and reliability. Besides the chip form (NE73400), several package styles are , SYMBOLS fT NE73400 00 (CHIP) UNITS GHz GHz dB dB dB dB dB dB MIN 1.5 TYP 2.0 MAX MIN NE73430 , Frequency, f (GHz) ORDERING INFORMATION PART NUMBER NE73400 NE73430-T1 NE73433-T1B NE73435 Note; 1 , in mm) PACKAGE OUTLINE 35 (MICRO-X) NE73400 (CHIP) Chip Thickness: 160|jm TY P 0.35 0.3 -
OCR Scan
OCI 531 IS22I2 082-H
Abstract: assure uniform perform ance and reliability. Besides the chip form (NE73400) several package styles are , 1 MHz Total Power Dissipation Thermal Resistance (Junction to Case) NE73400 00 (CHIP) UNITS MIN TYP , DIMENSIONS (u nitsin mm) NE73400 (CHIP) Chip Thickness: 160|imTYP 0.35 0.3 0.26 PACKAGE OUTLINE -
OCR Scan
2SC1424 s2l sot23 PACKAGEOUTUNE33 PACKAGEOUTUNE39
Abstract: . Bes ides the chip form (NE73400) several package styles are available. While the series is designed , NE73400 OO(CHIP) UNITS MIN TYP MAX MIN GHz GHz dB 1.5 2.0 1.5 NE73412 2SC1424 12 NE73416 16 NE73430 , AX- NE73400 (C H IP) Chip Thickness: 160 um TYP - 0 .3 5 - 0.3 - 0.26 -5.84 MAX-* 1*44.95 MAX -
OCR Scan
017 545 71 32 02 2SC2026 2SC4090 NE73432 S12S21
Abstract: metallization system to assure uniform performance and reliability. Besides the chip form (NE73400) several , CHARACTERISTICS PARTNUMBER EIA J1 REGISTERED NUMBER PACKAGE OUTLINE NE73400 00 (CHIP) NE73412 , 3-140 b427525 00bS?24 DT3 NE734 SERIES OUTLINE DIMENSIONS (Units in mm) NE73400(CHIP) Chip -
OCR Scan
MARKING Dt3 sot23 transistor 2SC2148 j60 mic 2SC202 mic J60 v3le 4B75ES L5715 M275ES PACKAGEOUTUNE30 42752S
Abstract: the chip form (NE73400) several package styles are available. While the series is designed for , 0.9 GHz NFMIN NE73400 00 (CHIP) hFE ICBO IEBO CCB PT RTH NE73430 2SC4185 30 , |S12| 2 |S12 S21| NE734 SERIES OUTLINE DIMENSIONS (Units in mm) NE73400 (CHIP) Chip Thickness -
Original
2SC1733 pt 5767 Rf transistor transistor 2sc2026 transistor "micro-x" "marking" 3 RF TRANSISTOR NPN MICRO-X micro-x mhz ghz microwave
Abstract: the chip form (NE73400), several package styles are available in both single and dual chip , 1SE D OUTLINE DIMENSIONS (Units m mm) NE73400 (CHIP) Chip Thickness: 160 pm TYP b427414 GOOmbT T M -
OCR Scan
NE73437 2SC2037 ne73436 2SC2759 JE73 2SC1275 NE73436 00Q1477
Abstract: Ratings Units NE73400(L) NE73408(L) VCBO Collector to Base Voltage 30 v vceo Collector to Emitter , mm) 0.030 33/37 GET-30698 Rev.F 5) NE73400(L) ©Metallization â'" Emitter and Base Metal â -
OCR Scan
UPC2712B UPB1509B upc2709b NE85608-L NE68108 UPB1508B MIL-PRF-19500 MIL-PRF-38535 NE680 UPB15 UPC2726B MIL-STD-883