MURA215T3 MURA220T3 215T3 220T3 MURA215T3/D - Datasheet Archive

 

Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as

 

MURA215T3 MURA215T3, MURA220T3 MURA220T3 Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. · · · · Small Compact Surface Mountable Package with J­Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.77 Volts Max @ 2.0 A, TJ = 150°C) Mechanical Characteristics: http://onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES 100­200 VOLTS · Case: Epoxy, Molded · Weight: 70 mg (approximately) · Finish: All External Surfaces Corrosion Resistant and Terminal · · · · · Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Shipped in 12 mm Tape and Reel, 5000 units per reel Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) ESD Protection: Machine Model > 400 V (Class C) Marking: U5C, U5D MARKING DIAGRAM U5x SMA CASE 403D PLASTIC x = C (215T3 215T3) D (220T3 220T3) ORDERING INFORMATION MAXIMUM RATINGS Device Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA215T3 MURA215T3 MURA220T3 MURA220T3 VRRM VRWM VR Average Rectified Forward Current @ TL = 155°C @ TL = 135°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 40 TJ ­65 to +175 Shipping MURA215T3 MURA215T3 SMA 5000/Tape & Reel SMA 5000/Tape & Reel A °C Operating Junction Temperature Range © Semiconductor Components Industries, LLC, 2001 February, 2001 ­ Rev. 0 Value Package MURA220T3 MURA220T3 Rating Unit V 150 200 A 1.0 2.0 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURA215T3/D MURA215T3/D MURA215T3 MURA215T3, MURA220T3 MURA220T3 THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction to Ambient (Note 1.) Max Unit PsiJL (Note 2.) RJA Thermal Resistance, Junction to Lead (TL = 25°C) (Note 1.) 24 °C/W 216 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3.) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3.) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/µs) Volts trr 0.95 0.77 µA 2.0 50 35 ns 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR­4. 2. In compliance with JEDEC 51, these values (historically represented by RJL) are now referenced as PsiJL. 3. Pulse Test: Pulse Width = 300 µs, Duty Cycle v 2.0%. 100 IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) 100 TJ = 175°C 10 1 TJ = 100°C 0.1 TJ = 25°C 0.01 TJ = 175°C 10 TJ = 100°C TJ = 25°C 1 0.1 0.001 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Figure 2. Maximum Reverse Current IF, INSTANTANEOUS FORWARD CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current IF, INSTANTANEOUS FORWARD CURRENT (A) VR, REVERSE VOLTAGE (VOLTS) 10 TC = 175°C 100°C 25°C 1 0.1 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 2 1.1 MURA215T3 MURA215T3, MURA220T3 MURA220T3 50 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 40 NOTE: MAXIMUM CAPACITANCE AT 0 V = 47 pF 45 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 45 35 30 25 20 15 10 40 35 30 25 20 15 10 5 5 0 0 0 4 8 12 16 20 24 28 32 36 0 40 4 8 12 16 20 24 28 32 40 160 180 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 6. Maximum Capacitance 5 4 dc 3 SQUARE WAVE 2 1 0 100 110 120 130 140 150 160 170 180 1.5 1.25 dc 1 0.75 SQUARE WAVE 0.5 0.25 0 20 0 TL, LEAD TEMPERATURE (°C) 40 60 2.5 dc 2 SQUARE WAVE 1.5 1 0.5 0 0.5 100 120 140 Figure 8. Current Derating, Ambient (FR­4 Board with Minimum Pad) 3 0 80 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Lead PF, AVERAGE POWER DISSIPATION (W) 80 90 36 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance IF(AV), AVERAGE FORWARD CURRENT (A) VR, REVERSE VOLTAGE (VOLTS) 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 3 3.5 MURA215T3 MURA215T3, MURA220T3 MURA220T3 PACKAGE DIMENSIONS SMA CASE 403D­01 ISSUE O S A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D H J K S B INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.105 0.050 0.064 0.004 0.008 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.67 1.27 1.63 0.10 0.20 0.15 0.41 0.76 1.52 4.83 5.59 C K J H MINIMUM SOLDER PAD SIZE 0.157 4.0 0.0787 2.0 0.0787 2.0 inches mm ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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