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Part Manufacturer Description Datasheet BUY
KIT_RESISTOR_RC0402J Samsung Electro-Mechanics RES KIT 0.0-1M 1/32W 1950 PCS visit Digikey
KIT_RESISTOR_RC0603J Samsung Electro-Mechanics RES KIT 0.0-1M 1/20W 3000 PCS visit Digikey
KIT_RESISTOR_RC0402F Samsung Electro-Mechanics RESISTOR KIT 3-1M 1/32W 3000 PCS visit Digikey
AXA016A0X3-SR12Z GE Critical Power 12V Austin SuperLynxTM 16A: Non-Isolated DC-DC Power Module, 10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 16A Output Current, 100Ω Resistor between Sense and Output Pins visit GE Critical Power
AXA016A0X3-SR12 GE Critical Power 12V Austin SuperLynxTM 16A: Non-Isolated DC-DC Power Module, 10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 16A Output Current, 100Ω Resistor between Sense and Output Pins visit GE Critical Power
KIT_RESISTOR_RC0603F Samsung Electro-Mechanics RESISOR KIT 10-1M 1/20W 3000 PCS visit Digikey

MSI nichrome resistor

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: : MSTF 3SN-50R00F-GB = 0.030" x 0.030", Silicon Substrate, Resistor, 50â"¦ Tol., Nichrome Resistor , 0.030" SIZE SUBSTRATE SUBSTRATE RESISTOR BOND PADS 0.030" x 0.030" (±0.003") x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS TANT ANTALUM NICHROME OR TANTALUM NITRIDE 15,000 à , ±25ppm/°C (A) STANDARD* ±2ppm/°C STANDARD* 0.030" R1 NICHROME 1Mâ"¦ 1â"¦ TO 1Mâ"¦ 125Kâ , 25° ±0. 0.2 5X RATED POWER, 25° C, 5 SEC., ±0.25% MAX. âR/R: ±0.1% MSI TYPICAL  Mini-Systems
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102-G-0306
Abstract: -2-S-N-50-01-GB = .020" x .020", Silicon Substrate, Nichrome Resistor, 5 0 0 , ± 1 % Tol., Gold Backside. , THIN FILM CHIP RESISTORS MSTF-2 SERIES M ECHANICAL DATA SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .020" X . 020" X . 0 10 " (±.003" ') SILICON, ALUM INA, QUARTZ, OR GLASS NICHROME OR , . NICHROME 2 0 TO 1.2 M O 2 0 TO 150K .1% . .5%, 1%, 2%, 5%, 10%; TO 0.01% A V A IL ±50ppm /°C STANDARD , % MSI TYPICAL 1 50°C, 100 HRS., ±0.25% MAX. A R/R; MSI TYPICAL 0.03% MIL-STD 202, METHOD 107F, ±0.25% -
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sn5001 Mini-Systems 250KO MSTF-2-S-N-50-01-GB
Abstract: EXAMPLE: MSTF 1SN-50R00F-BGB = 0.015" x 0.015", Silicon Substrate, Nichrome Resistor , 50, ±1% T ol , THIN FILM CHIP RESISTOR 0.015" Sq. MSTF 1 SERIES MECHANICAL DA TA DAT 0.010" SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS BACKSIDE SURF ACE SURFACE 0.015" x 0.015" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM , TA DAT RESIST ANCE RANGE RESISTANCE SILICON, QUARTZ, GLASS ALUMINA TOLERANCES T.C.R. NICHROME 2 TO Mini-Systems
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Abstract: -B-0306 EXAMPLE: MSMR 1SN-50R00F-BGB = 0.012" x 0.009", Silicon Substrate, Nichrome Resistor , 50, ±1% T ol , THIN FILM CHIP RESISTOR 0.012" 0.009" MSMR1 SERIES MECHANICAL DA TA DAT 0.006" SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS BACKSIDE SURF ACE SURFACE 0.012" x 0.009" x 0.006" (±0.001") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 , SILICON, QUARTZ, GLASS ALUMINA TOLERANCES NICHROME 2 TO 75K 2 TO 15K 0.01% TO 10% (Value Dependent Mini-Systems
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146-B-0306
Abstract: Substrate, Nichrome Resistor , 50, ±1% T ol., ±25ppm/°C, Gold Backside. Resistor, Tol., *Consult Sales for , THIN FILM CHIP RESISTOR 0.015" Sq. MSTF 1 SERIES MECHANICAL DA TA DAT 0.010" CHIP RESISTORS SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS BACKSIDE SURF ACE SURFACE 0.015" x 0.015" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR T ANT ALUM NITRIDE , Resistance. RESIST ANCE RANGE RESISTANCE SILICON, QUARTZ, GLASS ALUMINA TOLERANCES NICHROME 2 TO 150K Mini-Systems
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Abstract: Substrate, Nichrome Resistor, 1MQ, ± 1 % Toi., Gold Backside. p ED=E3=i 508-695-0203 FAX: 508-695-6076 , MSTF-4 SERIES MECHANICAL DATA SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .040" x . 0 4 0 " x . 0 1 0 " (+ .0 03") SILICON, QUARTZ. OR GLASS NICHROME OR TANTALUM NITRIDE 15.000 MINIMUM , RESISTANCE RANGE SILICON, QUARTZ, GLASS TOLERANCES T.C.R. NICHROME IM f iT O IO M O .1%, .5%. 1%, 2%, 5%, 10 , % MSI TYPICAL 150°C, 100 HRS., ± 0 .2 5% MAX. A R/R; MSI TYPICAL 0.03% MIL-STD 202, METHOD 107F, ± 0 .2 -
OCR Scan
MSTF-4-S-N-1M-01-GB
Abstract: " x 0.020", Silicon Substrate, Nichrome Resistor , 50, ±1% T ol., ±50ppm/°C, Gold Backside. Resistor , THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR , NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE , TA DAT RESIST ANCE RANGE RESISTANCE SILICON, QUARTZ, GLASS ALUMINA* ABSOLUTE TOLERANCE NICHROME 2 , : ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 03 % MSI TYPICAL ±0.25% 0.03 Mini-Systems
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101-G-0306 2SN-50R00F-GB
Abstract: 3SN-50R00F-GB = 0.030" x 0.030", Silicon Substrate, Nichrome Resistor , 50, ±1% T ol., ±50ppm/°C, Gold , TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.030" x 0.030" (±0.003") x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE SUBSTRA TE SUBSTRATE GOLD BACK OPTIONAL NICHROME 1 TO 1M 1 , TED POWER, 25 ° C, 5 SEC., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 % MSI TYPICAL 150 Mini-Systems
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Abstract: ", Silicon Substrate, Nichrome Resistor , 50, ±1% T ol., ±50 ppm/°C, Gold Backside. Resistor, Tol., Not , THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR , GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM , ALUMINA NICHROME 2 TO 1.5M 2 TO 250K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE ±25ppm/°C ST ANDARD , DERATED LINEARLY SHORT TERM OVERLOAD 5X RA TED POWER, 25 ° C, 5 SEC., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL Mini-Systems
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101-F-0403
Abstract: 0.020", Silicon Substrate, Nichrome Resistor , 50 , ±1% T ol., ±50 ppm/°C, Gold Backside. Resistor, Tol , THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR , GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM , , GLASS ALUMINA NICHROME 2 TO 1.5M 2 TO 300K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE ±50ppm/°C ST , /R DERATED LINEARLY 5X RA TED POWER, 25 °C, 5 SEC., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL 0.2 RATED Mini-Systems
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101-D-0698
Abstract: ", Alumina Substrate, Nichrome Resistor , 50, ±1% T ol., ±25ppm/°C, w/ Solder . Full W rap Around. Resistor , RESISTORS W SUBSTRA TE SUBSTRATE RESISTOR BOND P ADS & WRAP AROUND PADS WRAPAROUND TERMINA TIONS TERMINATIONS 99.6% ALUMINA, ALUMINUM NITRIDE NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM GOLD WITH NICKEL , 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 03 % MSI TYPICAL 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. ±0.25% 0.03 03% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI TYPICAL 107F, ±0.25% Mini-Systems
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X 0040 ta 111-F-0306 1AN-50R00F-T
Abstract: RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" (±0.003") 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, T ANT ALUM NITRIDE, SICHROME TANT ANTALUM 15,000 Å MINIMUM GOLD , T.C.R. NICHROME TANT ALUM NITRIDE ANTALUM SICHROME 2 TO 150K ST VAILABLE STANDARD AV ANDARD RANGE; TO , POWER, 25 ° C, 5 SEC., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 03 % MSI TYPICAL ±0.25% 0.03 03% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI Mini-Systems
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106-F-0306 T-10001F-G
Abstract: ", Alumina Substrate, Nichrome Resistor , 50, ±1% T ol., ±25ppm/°C, w/ Solder . Full W rap Around. Resistor , TE SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINA TIONS TERMINATIONS L T W 0.040" x 0.020" x , 0.010" 99.6% ALUMINA, ALUMINUM NITRIDE NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM TOLERANCE (±0.003" , . R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 03 % MSI TYPICAL 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. ±0.25% 0.03 03% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI TYPICAL 107F, ±0.25% MIL-STD 202 Mini-Systems
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111-E-0403
Abstract: 0.010", Alumina Substrate, Conductor Nichrome Resistor , 50 , ±1% T ol., ±50ppm/°C, w/ Solder . Full W , TE SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINA TIONS TERMINATIONS L T W 0.040" x 0.020" x , 0.010" 99.6% ALUMINA, ALUMINUM NITRIDE NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM TOLERANCE (±0.003" , . R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 03 % MSI TYPICAL ±0.25% 0.03 03% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI TYPICAL 107F, ±0.25% MIL-STD 202 Mini-Systems
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111-D-0698
Abstract: ", Alumina Substrate, Nichrome Resistor , 50, ±1% T ol., ±25ppm/°C, w/ Solder . Full W rap Around. Resistor , RESISTORS W SUBSTRA TE SUBSTRATE RESISTOR BOND P ADS & WRAP AROUND PADS WRAPAROUND TERMINA TIONS TERMINATIONS 99.6% ALUMINA, ALUMINUM NITRIDE NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM GOLD WITH NICKEL , 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 03 % MSI TYPICAL 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 0.03 03% ±0.25% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI TYPICAL 107F, ±0.25% Mini-Systems
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Abstract: , Nichrome Resistor, 500, ± 1% Tol., with Solder. , SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINATIONS W L TOLERANCE POWER RATING (@ 70°C) 125mW 250mW , x .053" (±.003") .050" x .153" (±.003") ALUMINA. ALUMINUM NITRIDE NICHROME OR TANTALUM NITRIDE , ; 0.1% MSI TYPICAL 150°C, 100 HRS., ±0.25% MAX. A R/R; MSI TYPICAL 0.03% MIL-STD 202, METHOD 107F, +0.25% MAX. A R/R; 0.1% MSI TYPICAL MIL-STD 202, METHOD 106, ±0.5% MAX. A R/R; 0.25% MSI TYPICAL 1000 HRS -
OCR Scan
WATF-1-A-N-50-01-T 150KO 400KO 400KD 700KO 625KO DCN-TF111-A-1093
Abstract: % Zeros. EXAMPLES: MSTF 3SN-50R00F-GB = 0.030" x 0.030", Silicon Substrate, Nichrome Resistor , 50, ±1% T , SUBSTRATE RESISTOR BOND PADS 0.030" x 0.030" (±0.003") x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE SUBSTRA TE SUBSTRATE GOLD BACK OPTIONAL NICHROME 1 TO 1M 1 TO 125K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01 , DERATED LINEARLY 5X RA TED POWER, 25 ° C, 5 SEC., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 Mini-Systems
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102-F-0403
Abstract: RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" (±0.003") 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) TANT ANTALUM NICHROME, TANTALUM NITRIDE, SICHROME 15,000 à , TOLERANCES T.C.R. NICHROME ANTALUM TANTALUM NITRIDE SICHROME DAT SERIES DATA 101â"¦ 250Kâ"¦ 101â , : ±0.1% MSI TYPICAL ±0.25% 0.03 03% 150°C, 100 HRS., ±0.25% MAX. âR/R: ±0.03% MSI TYPICAL 107F, ±0.25% MIL-STD 202, METHOD 107F, ±0.25% MAX. âR/R: ±0.1% MSI TYPICAL ±0. 0.5 0.1 Mini-Systems
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AT-10001F-G
Abstract: RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" (±0.003") 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, T ANT ALUM NITRIDE, SICHROME TANT ANTALUM 15,000 Å MINIMUM GOLD , TOLERANCES T.C.R. NICHROME TANT ALUM NITRIDE ANTALUM SICHROME 2 TO 150K ST ANDARD RANGE; TO 10M IN SiCr A , ., ± 0. 25% MAX. R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 03 % MSI TYPICAL ±0.25% 0.03 03% MIL-STD 202, METHOD 107F ,± 0.25% MAX. R/R: ±0.1% MSI TYPICAL 107F Mini-Systems
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106-D-1198
Abstract: : MSTF 3SN-50R00F-GB = 0.030" x 0.030", Silicon Substrate, Nichrome Resistor , 50 , ±1% T ol., ±50 ppm/°C , SUBSTRATE RESISTOR BOND PADS 0.030" x 0.030" (±0.003") x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE SUBSTRA TE SUBSTRATE GOLD BACK OPTIONAL NICHROME 2 TO 2M 2 TO 500K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01 , . R/R: ±0.1% MSI TYPICAL RATED 25° ±0. 0.2 150°C, 100 HRS., ± 0.25% MAX. R/R: ±0. 03 % MSI TYPICAL Mini-Systems
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MSTF 102-D-0698
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