NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| ADV7189KST | Analog Devices | IC COLOR SIGNAL DECODER, PQFP80, LEAD FREE, MS-026-BEC, LQFP-80, Color Signal Converter | 
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| AD9857AST | Analog Devices | IC SPECIALTY TELECOM CIRCUIT, PQFP80, MS-026-BEC, LQFP-80, Telecom IC:Other |
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| AD9854ASQZ | Analog Devices | IC PLL FREQUENCY SYNTHESIZER, 30 MHz, PQFP80, MS-026-BEC, LQFP-80, PLL or Frequency Synthesis Circuit |
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| AD9782BSV | Analog Devices | IC PARALLEL, WORD INPUT LOADING, 12-BIT DAC, PQFP80, THERMALLY ENHANCED, MS-026-ADD, LQFP-80, Digital to Analog Converter |
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| PXAS30KBBE,557 | NXP Semiconductors | IC 16-BIT, 30 MHz, MICROCONTROLLER, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-315-1, LQFP-80, Microcontroller |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: standard packages MS-026) · Heatsink-up and down configurations available Thermal Resistance , 0.60 0.60 0.60 Board JEDEC Standoff Package 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 Tray Matrix Units Per Tray 8 x 20 6 x , LEADFRAME data sheet LQFP PowerQuad® 4 Features: LQFP PowerQuad® 4 Packages: LQFP , applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is achieved by using an exposed ... | Original |
2 pages, |
tray 20 x 14 MS-026 lqfp 80 JEDEC Matrix Tray outlines CS-007 MS-026 datasheet abstract |
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| Abstract: TITLE: THERMALLY ENHANCED LQFP 144 I/O, 20 X 20 PKG, 0.50 MM PITCH, 7.62x7.62 EXPOSED PAD DOCUMENT NO: 98ARE10686D 98ARE10686D REV: 0 09 FEB 2007 CASE NUMBER: 1921-01 STANDARD: JEDEC MS-026 BFB-HD © FREESCALE , LQFP 144 I/O, 20 X 20 PKG, 0.50 MM PITCH, 7.62x7.62 EXPOSED PAD DOCUMENT NO: 98ARE10686D 98ARE10686D REV: 0 09 FEB 2007 CASE NUMBER: 1921-01 STANDARD: JEDEC MS-026 BFB-HD NOTES: 1. ALL DIMENSIONS IN , REV: 0 09 FEB 2007 CASE NUMBER: 1921-01 STANDARD: JEDEC MS-026 BFB-HD ... | OCR Scan |
3 pages, |
MS-026 MS-026 lqfp 80 98ARE10686D 98ARE10686D abstract |
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| Abstract: 7 x 7 - 20 x 20 mm body sizes (JEDEC standard packages MS-026) · Heatsink-up and down , 0.10 0.10 0.10 0.10 0.10 0.10 JEDEC Package MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 Tray Matrix 10 x 25 6 x 15 6 x 15 6 x 15 6 x 15 5 x 12 5 x 12 Units Per Tray 250 , LEADFRAME data sheet LQFP PowerQuad® 2 Features: LQFP PowerQuad® 2 Packages: LQFP , applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging provides extraordinary ... | Original |
2 pages, |
MS-026 JEDEC Matrix Tray outlines datasheet abstract |
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| Abstract: 1.40 1.00 0.10 0.60 9.0 32/48/64 MS-026 10 x 25 250 10 x 10 1.40 1.00 0.10 0.60 12.0 44/52/64/80 MS-026 8 x 20 160 14 x 14 1.40 1.00 0.10 0.60 16.0 44/64/80/100/120/128 MS-026 6 x 15 90 14 x 20 1.40 1.00 0.10 0.60 16.0 x 22.0 100/128 MS-026 6 x 12 72 20 x 20 1.40 1.00 0.10 0.60 22.0 128/144/176 MS-026 5 x 12 60 24 x 24 1.40 1.00 0.10 0.60 26.0 160 ... | Original |
2 pages, |
MS-026 datasheet abstract |
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| Abstract: Matrix Units Per Tray 7x7 1.40 1.00 0.10 0.60 9.0 32/48/64 MS-026 10 x 25 250 10 x 10 1.40 1.00 0.10 0.60 12.0 44/52/64/80 MS-026 8 x 20 160 14 x 14 1.40 1.00 0.10 0.60 16.0 44/64/80/100/120/128 MS-026 6 x 15 90 14 x 20 1.40 1.00 0.10 0.60 16.0 x 22.0 100/128 MS-026 6 x 12 72 20 x 20 1.40 1.00 0.10 0.60 22.0 128/144/176 MS-026 5 x 12 60 24 x 24 1.40 ... | Original |
2 pages, |
MS-026 lqfp 7x7 tray Amkor mold compound datasheet abstract |
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| Abstract: 80-Lead Low Profile Quad Flat Package [LQFP] (ST-80-2 ST-80-2) Dimensions shown in millimeters a 0.75 0.60 0.45 16.20 16.00 SQ 15.80 1.60 MAX 1 61 80 60 PIN 1 14.20 14.00 SQ 13.80 TOP VIEW (PINS DOWN) 1.45 1.40 1.35 0.15 0.05 SEATING PLANE VIEW A ROTATED 90° CCW 0.20 0.09 7° 3.5° 0° 0.10 MAX COPLANARITY 20 40 21 VIEW A 0.65 BSC LEAD PITCH COMPLIANT TO JEDEC STANDARDS MS-026-BEC 0.38 0.32 0.22 41 ... | Original |
1 pages, |
ST-80-2 MS-026 lqfp 80 ST-80-2 abstract |
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| Abstract: 80-Lead Low Profile Quad Flat Package [LQFP] (ST-80-1 ST-80-1) Dimensions shown in millimeters a 0.75 0.60 0.45 14.00 BSC SQ 1.60 MAX 80 61 60 1 PIN 1 12.00 BSC SQ TOP VIEW 1.45 1.40 1.35 0.15 0.05 SEATING PLANE VIEW A 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY (PINS DOWN) 20 41 21 VIEW A 0.50 BSC LEAD PITCH ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-BDD 40 0.27 0.22 0.17 ... | Original |
1 pages, |
ST-80-1 ST-80-1 abstract |
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| Abstract: JEDEC REGISTRATION MS- 026, VARIATION BDD REVISIONS REV DESCR1PTION E.C.N. DATE BY/APP'D C REVISE I REDRAW 10176 01/26/1994 DEG/HJK D TITLE: LQFP WAS PQFP; UPDATE NOTE 3: ADD GEOMETRIC TOLERANCE , CURRENT STD 1729 02/16/2005 TL/RW (13.2 TYP (80 X 1.6) -I (80X 0.3) (76X 0.5) RECOMMENDED LAND , A SUCHY 02/16/2005 LOFP,JEDEC METRIC, 12x12x1.4mm, 80 LEAD, 0.5mm PITCH ENGR. CHK. RANDALL WALBERO ... | OCR Scan |
1 pages, |
MS-026 lqfp 80 land pattern PQFP 132 datasheet abstract |
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| Abstract: 551 14 551 14 63 1.6 39.6 8.6 PD-1805 PD-1805 FD LQFP 100 MS-026/BED 20 0.5 551 14 551 14 63 1.6 35.93 8.72 PD-2065 PD-2065 FD LQFP 128 MS-026 16 0.4 551 14 551 14 63 1.6 41.8 12 PD-2072 PD-2072 FF LQFP 80 MS-026/BDD 20 0.5 472 12 472 12 63 1.6 38.8 12.8 PD-2064 PD-2064 FG LQFP 64 MS-026/MS-022 20 0.5 394 10 394 10 63 1.6 46.3 7.2 PD-2079 PD-2079 ... | Original |
8 pages, |
FD100 FC64 PD-2062 ZH32 ZD64 PD-2029 TQFN 28 pd1503 PD-2075 PD-2070 PD1203 PD-1324 MO-288 package lbga-100 PD-1203 datasheet abstract |
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| Abstract: 133 89 88 ComL-DT8520 LQFP-176 JEDEC MS-026 45 176 1 CYPRESS SEMICONDUCTOR , e L D1 0.01969 BSC .01772 .02362 0.50 BSC .02953 0.45 0.60 JEDEC MS-026 , +85°C Package available in: LQFP Product Description -Q9 IN 10A -IN 10B - -Q10 , Conditions Figure 3 20% to 80% CL=10pF RL & CL to GND CL=Cintrinsic & Cexternal Falltime Min. , Conditions Figure 3 20% to 80% CL=10pF RL & CL to GND CL=Cintrinsic & Cexternal CYPRESS ... | Original |
7 pages, |
LQFP-176 DT8520 DT8520 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| -1 LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm MS-026 (JEDEC .4 mm MS-026 (JEDEC) 136E01 136E01 136E01 136E01 (IEC) 2000-01-19 SOT358-1 LQFP32 plastic low MS-026 (JEDEC) 136E08 136E08 136E08 136E08 (IEC) 2000-01-19 SOT313-2 LQFP48 plastic low profile quad 414-1 LQFP64 plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm MS-026 ; 100 leads; body 12 x 12 x 1.4 mm MS-026 (JEDEC) 1999-12-08 SOT407-1 LQFP100 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/lqfp-v1.html |
Philips | 05/02/2002 | 13.02 Kb | HTML | lqfp-v1.html |
| 12 x 12 x 1.4 mm MS-026 (JEDEC) 136E15 136E15 136E15 136E15 (IEC) 2/25/2003 - SOT823-1 LQFP80 plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm MS-026 (JEDEC) 136E19 136E19 136E19 136E19 (IEC MS-026 (JEDEC) 136E10 136E10 136E10 136E10 (IEC) 2/25/2003 - SOT791-1 LQFP64 plastic low profile ; body 12 x 12 x 1.4 mm MS-026 (JEDEC) 2/20/2003 - SOT407-1 LQFP100 plastic ED-7311PD ED-7311PD ED-7311PD ED-7311PD (EIAJ) MS-026 (JEDEC) 136E27 136E27 136E27 136E27 (IEC) 8/14/2002 - SOT420-1 LQFP128 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/lqfp-v2.html |
Philips | 16/06/2005 | 16.34 Kb | HTML | lqfp-v2.html |
| ) MS-026 (JEDEC) 136E18 136E18 136E18 136E18 (IEC) 2002-10-22 SOT315-1 LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm MS-026 (JEDEC) 136E15 136E15 136E15 136E15 (IEC) 2000 leads; body 5 x 5 x 1.4 mm MS-026 (JEDEC) 136E01 136E01 136E01 136E01 (IEC) 2000-01-19 SOT358-1 LQFP32 10 x 1.4 mm MS-026 (JEDEC) 136E08 136E08 136E08 136E08 (IEC) 2002-06-07 SOT313-2 LQFP48 plastic MS-026 (JEDEC) 1999-12-08 SOT407-1 LQFP100 plastic low profile quad flat package www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/lqfp.html |
Philips | 15/04/2003 | 13.96 Kb | HTML | lqfp.html |
| ; body 10 x 10 x 1 mm MS-026 (JEDEC) 10/15/2003 - SOT376-1 TQFP44 TQFP44 TQFP44 TQFP44 plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm MS-026 (JEDEC) 137E08 137E08 137E08 137E08 (IEC) 3/14/2002 - SOT357-1 TQFP64 TQFP64 TQFP64 TQFP64 plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm MS-026 leads; body 12 x 12 x 1 mm MS-026 (JEDEC) 2/25/2003 - SOT386-1 TQFP100 TQFP100 TQFP100 TQFP100 plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm MS-026 (JEDEC) 137E20 137E20 137E20 137E20 (IEC) 2 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/tqfp-v2.html |
Philips | 16/06/2005 | 11.79 Kb | HTML | tqfp-v2.html |
| plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm MS-026 (JEDEC) 137E08 137E08 137E08 137E08 (IEC) 2000-01-19 SOT357-1 TQFP64 TQFP64 TQFP64 TQFP64 plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm MS-026 leads; body 12 x 12 x 1.0 mm MS-026 (JEDEC) 1999-12-27 SOT386-1 TQFP100 TQFP100 TQFP100 TQFP100 plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm MS-026 (JEDEC) 137E20 137E20 137E20 137E20 (IEC) 2000 ) Thermal enhanced (25) LQFP (15) Other (4) PLCC (10) QFP (26) SQFP (3) TQFP (5 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/tqfp-v1.html |
Philips | 05/02/2002 | 9.69 Kb | HTML | tqfp-v1.html |
| leads; body 10 x 10 x 1.0 mm MS-026 (JEDEC) 137E10 137E10 137E10 137E10 (IEC) 2002-03-14 SOT375-1 TQFP80 plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm MS-026 (JEDEC) 1999-12-27 SOT386-1 TQFP100 TQFP100 TQFP100 TQFP100 plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm MS-026 SOT376-1 TQFP44 TQFP44 TQFP44 TQFP44 plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm MS-026 (112) Thermal enhanced (44) CQFP (1) LQFP (17) Other (4) PLCC (10) QFP (28) SQFP www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/quad/zzz_other/tqfp.html |
Philips | 15/04/2003 | 9.78 Kb | HTML | tqfp.html |
| , according to JEDEC Specification reference MS- 026-BBC. 2.2 STLC1512 STLC1512 STLC1512 STLC1512 Pin Allocation The pin out for Gain 19.9 20.1 20.3 dB Ambient Temperature -40 27 85 o C Line Impedance 80 100 160 W A nominal current in normal operation. This is tested by placing a 80 W load as the line impedance and ensuring case chip will drive 80W. Slew Rate spec is to guarantee that there is no slewing limit on a `application diagram') WDB (PAOUT) -40 -60 -80 -100 3.00e+04 1.00e+05 6.00e+05 Hz dB 9 www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7442.htm |
STMicroelectronics | 07/12/2000 | 39.97 Kb | HTM | 7442.htm |
| no external components (external clock also possible). • Display data RAM: 80 characters • Character carrier âˆ' PCF2113DU/F4 PCF2113DU/F4 PCF2113DU/F4 PCF2113DU/F4 âˆ' chip in tray âˆ' PCF2113DH/F4 PCF2113DH/F4 PCF2113DH/F4 PCF2113DH/F4 LQFP100 plastic low profile quad flat package; 100 (DDRAM) 80 CHARACTERS/BYTES ADDRESS COUNTER (AC) INSTRUCTION DECODER INSTRUCTION REGISTER(IR) ROW DRIVERS . 2. When the on-chip oscillator is used this pad must be connected to VDD1. 3. In the LQFP100 version pagewidth 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 80 79 78 77 76 R 6 R 7 www.datasheetarchive.com/download/41019255-595924ZC/code.lcd.demo.board.zip (PCF2113_FAM_3.pdf) |
NXP | 16/03/2009 | 9306.17 Kb | ZIP | code.lcd.demo.board.zip |
| ) 2 80 10 10 5 10 80 dots (2 Ã- 40) 1 40 5 5 2 12 40 dots (1 Ã- 40) HOST tr 2CB SDA 40 segment drives .6 Alignment marks C1 +930.42 âˆ'870.3 C2 âˆ'829.98 âˆ'870.3 DESCRIPTION DIMENSION Gold bump dimension 52 um Ã- 80 um 41 42 50 51 Chip dimensions: approximately 2.26 Ã- 2.01 mm. Bump dimensions (except pad 1): 52 Ã- 80 www.datasheetarchive.com/download/41019255-595924ZC/code.lcd.demo.board.zip (PCF8576D_5.pdf) |
NXP | 16/03/2009 | 9306.17 Kb | ZIP | code.lcd.demo.board.zip |
| -purpose applications. 2. Features 2.1 Key features a73 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 package. a73 Description Version LPC2212FBD144 LPC2212FBD144 LPC2212FBD144 LPC2212FBD144 LQFP144 plastic low-profile quad flat package, 144 leads, body 20 Ã- 20 Ã- 1.4 mm SOT486-1 LPC2214FBD144 LPC2214FBD144 LPC2214FBD144 LPC2214FBD144 LQFP144 plastic low-profile quad flat package, 144 leads, body 20 Ã- 20 Ã- 1 .1 Pinning Fig 2. LQFP144 pinning. handbook, full pagewidth 002aaa733 LPC2212/LPC2214 LPC2212/LPC2214 LPC2212/LPC2214 LPC2212/LPC2214 1 2 3 4 5 6 7 8 9 10 11 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 www.datasheetarchive.com/download/99213260-653674ZC/silverbox-cd.zip (LPC2212_2214-01.pdf) |
Philips | 18/06/2004 | 10852.57 Kb | ZIP | silverbox-cd.zip |