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Part Manufacturer Description Datasheet BUY
HI4P0506-5Z Intersil Corporation 16-CHANNEL, SGL ENDED MULTIPLEXER, PQCC28, LEAD FREE, PLASTIC, MS-018-AB, LCC-28 visit Intersil
CD22M3494MQA Intersil Corporation 16-CHANNEL, CROSS POINT SWITCH, PQCC44, PLASTIC, MS-018-AC, LCC-44 visit Intersil
HI4P0509-5 Intersil Corporation 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PQCC20, PLASTIC, MS-018-AA, LCC-20 visit Intersil
CD22M3494MQA96 Intersil Corporation 16-CHANNEL, CROSS POINT SWITCH, PQCC44, PLASTIC, MS-018-AC, LCC-44 visit Intersil
HI4P0509-5Z Intersil Corporation 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PQCC20, LEAD FREE, PLASTIC, MS-018-AA, LCC-20 visit Intersil
TLC34076-110MFN Texas Instruments PALETTE-DAC DSPL CTLR, PQCC84, PLASTIC, MS-018, LCC-84 visit Texas Instruments

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Part : DMS0187-1A Supplier : Essentra Components Catalog Manufacturer : Onlinecomponentscom Stock : - Best Price : $0.1390 Price Each : $0.1390
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MS-018

Catalog Datasheet MFG & Type PDF Document Tags

rh 115-2

Abstract: MS-018 00060 MS-018 MS-018 MS-018 MS-018 MS-018 MS-018 46 37 26 23 18 15 0.109 0.05 N
Amkor Technology
Original
MS-016 rh 115-2 amkor

MS-018

Abstract: MS016 00060 00060 00060 00060 00060 MS-018 MS-018 MS-018 MS-018 MS-018 MS-018 46 37 26 23
Amkor Technology
Original
MS016 MS-018 PLCC 68

MS-018

Abstract: rh 115-2 0.05 0.05 0.05 0.05 N/A N/A N/A N/A N/A N/A N/A 00060 00060 00060 00060 00060 00060 00061 MS-018 MS-018 MS-018 MS-018 MS-018 MS-018 MS-016 46 37 26 23 18 15 30 www.amkor.com With respect to
Amkor Technology
Original
00060
Abstract: 1 TRIM TRIO Connectors Boardmount Rectangular Connectors MSO Drilling Hole Pattern MS09 Straight Version Plug and Receptacle Size 9 MS09 MPG Right Angle Version Plug MS09MRG Right Angle Version Receptacle MSO Drilling Hole Pattern MS018 Straight Version Plug and Receptacle Size 18 MS018 MPG Right Angle Version Plug MS018 MRG Right Angle Version Receptacle Framatome Connectors USA Inc. â'¢ 25 Grumbacher Road â'¢ York, PA 17402 â'¢ TEL: (717) 767-8080 â'¢ FAX -
OCR Scan
MS034 MSO50 MS075 MSO104

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 ) Dimensions in Inches and (Millimeters) JEDEC OUTLINE MS-018 AA JEDEC STANDARD MS-018 AB 12-10 , ) JEDEC STANDARD MS-018 AC JEDEC STANDARD MS-018 AE 84J, 84 Lead, Plastic J-Leaded Chip Carrier , Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD-1835 C-J1
Atmel
Original
CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER 20P3 24DW3 40DW6

MO-026

Abstract: MS-018AA Fused Pins on One Side (Device Dependent) Package Designator EA (Reference MS-018AB) .495 12.57 , (reference JEDEC MS-018 AB) Dimensions in inches Millimeters (mm) in brackets, for reference only , (Device Dependent) Package Designator EB (Reference MS-018AB) .495 12.57 .485 12.32 .456 11.58 , .219 5.56 .191 4.85 Preliminary dimensions, for reference only (reference JEDEC MS-018 AB , (Reference MS-018AC) .695 17.65 .685 17.40 .656 16.66 2X .650 16.51 .007 [0.18] H B A A .007
Allegro MicroSystems
Original
MS-026ABC MO-026 MS-018AA JEDEC MS-026 ABC pioneer+PAL+007+B MS-018-AB MS-016AE

Allegro part numbering

Abstract: MO-229 heat-sink semi-tab (MS-018) EB ­ Square J-leaded chip carrier with 2 heat-sink semi-tabs (MS-018) EC ­ , Square J-leaded chip carrier with 4 heat-sink semi-tabs (MS-018) EE ­ Square leadless (exposed pad) 0.50 , J-leaded chip carrier (MO-047, MS-007, MS-018) EQ ­ Rect. J-leaded chip carrier (MS-016) ES ­ Square
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Original
Allegro part numbering MO-229 Allegro part "numbering" MO-220 k MS-011 MS-026 MS-012 MO-153 MO-178 MS-013 MS-001BA

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: JEDEC TSSOP 28 LEAD PACKAGE J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC OUTLINE MS-018 AA JEDEC STANDARD MS-018 AB 12-10 Packages Packages 44J, 44 Lead, Plastic J-Leaded Chip Carrier (PLCC , Inches and (Millimeters) JEDEC STANDARD MS-018 AC JEDEC STANDARD MS-018 AE 84J, 84 Lead, Plastic , Leadless Chip Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD
Atmel
Original
JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132

transistor RJp 30

Abstract: mo-229 pad layout ­ MS-018 AB 28-J Lead 22 36 6 [t] MS-018 AC 44-J Lead 22 30-50 6 [t] MO-220 WGGE 4 x 4 mm 26-Contact 35 ­ 2 [p] MS-018 AC 44-J Lead 22 30-50 6 , ) MO-229 WCCD 2 x 2 mm 6-Contact 56 95-250 2 [p] MS-018 AA 20-J Lead 41 78 35 [c] MS-018 AB 28-J Lead 37 68 30 [c] MS-018 AC 44-J Lead 30 54 25 [c
Allegro MicroSystems
Original
JESD51-7 JESD51-9 JESD51-10 JESD51-5 transistor RJp 30 mo-229 pad layout transistor RJp RJP PRODUCT jedec package MO-220 QFN 20 MO-220-wgge TS-001

MQUAD

Abstract: changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC MS-018 , MS-018 Variation AF ED QUAD 84 Copper Silver filled epoxy 1.3 mils gold wire Plastic, bi-phenyl Solder Plate ASAT - Hong Kong Refer to data book Yes Yes JEDEC MS-018 Variation AF Conversion schedule
Integrated Device Technology
Original
MQUAD I0008-05 JESD22-A112 79R3511 79R3512 79R3521 79R3522

MQUAD

Abstract: 79R3051E changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC MS-018 , MS-018 Variation AF ED QUAD 84 Copper Silver filled epoxy 1.3 mils gold wire Plastic, bi-phenyl Solder Plate ASAT - Hong Kong Refer to data book Yes Yes JEDEC MS-018 Variation AF Conversion schedule
Integrated Device Technology
Original
79R3051E 79R3081 79R3051 79R3052 79R3052E 79R3081E

SPRAGUE SEMICONDUCTOR

Abstract: UCN5810 , leaded chip carrier, one semi-tab (MS-018) EB = Plastic, leaded chip carrier, two semi-tabs (MS-018) EP = Plastic, leaded chip carrier (MS-018) EQ = Plastic, leaded chip carrier, rectangular (MS-016) JT = Plastic
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Original
SPRAGUE SEMICONDUCTOR UCN5810 MS-001 MS-010 MO-136 MS-001AB

MS-018

Abstract: MS-016 tooling use (reference MS-018 AB) Dimensions in millimeters Dimensions exclusive of mold flash, gate , ±0.38 0.51 MIN For Reference Only; not for tooling use (reference MS-018 AB) Dimensions in , Reference Only; not for tooling use (reference MS-018 AC) Dimensions in millimeters Dimensions exclusive , (reference MS-018 AC) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar , ; not for tooling use (reference MS-018 AA) Dimensions in millimeters Dimensions exclusive of mold
Allegro MicroSystems
Original

MS-018

Abstract: 5m 0565 nnnnnnnnnnnnnnnnnnnnn O uuuuuuuuuuuuuuuuuuuuu â 84 0.048 0.042 BRK D SH 2 0.048 0.042 D 1.195 1.185 0.007 T L-M N 0.180 0.165 0.120 0.090 0.004 SEATING PLANE s SH 2 © FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OOTLINE PRINT VERSION NET TE SSALE TITLEl 84 LEAD PDASTIC DEADED CHIP CARRIER BECHMENT NE 88ASB42485B REV D 20 MAY 2005 CASE NUMBER 780-01 STANBARB SEBEC MS-018 , : 98ASD42485D REV: D 20 MAY 2005 CASE NUMBER: 780-01 STANDARD: UEDEC MS-018 AE
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OCR Scan
5m 0565 007LINE 98A0B42485B 07ANBARB M0-Q18

MS-026 TQFP

Abstract: MS-016 tooling use (reference MS-018 AB) Dimensions in millimeters Dimensions exclusive of mold flash, gate , ±0.38 0.51 MIN For Reference Only; not for tooling use (reference MS-018 AB) Dimensions in , ; not for tooling use (reference MS-018 AC) Dimensions in millimeters Dimensions exclusive of mold , (reference MS-018 AC) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar , (reference MS-018 AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar
Allegro MicroSystems
Original
MS-026 TQFP

MS-016

Abstract: MS-018 COMPACT PLCC SOCKETS For Through Board Mount Series 540 · Note: End stackable. · Series 540 PLCC sockets are designed to accept JEDEC type MS-016 & MS-018 leaded plastic substrates. · Body has polarizing features for both substrate and socket insertion. · Contacts of highly reliable design safely hold the substrate in place by positive spring action. · PLCC chip extraction tool available. See page 96. No. of Pins ORDERING INFORMATION -A- -B- -C- -D- Quantity per
Mill-Max Mfg.
Original
540-44-044-24-000000 plcc socket 44 PLCC

MS-016

Abstract: MS-018 STANDARD PLCC SOCKETS Through Board Mount Series 940 · Note: Not end stackable. RoHS · Accepts JEDEC PLCCs MS-016 & MS-018 .325 .130 leaded plastic substrates. · Internal standoffs insure proper positioning of chip carrier in socket. · Standoffs provide clearance for heat .100 .018x.010 2002/95/EC (TYP) dissipation and cleaning. · Contacts are plated with 150 " tin. RoHS 2002/95/EC · Insulator material is glass reinforced PPS. A For Electrical, Mechanical &
Mill-Max Mfg.
Original
Abstract: COMPACT PLCC SOCKETS For Through Board Mount Series 540 â'¢ Note: End stackable. â'¢ Series 540 PLCC sockets are designed to accept JEDEC type MS-016 & MS-018 leaded plastic substrates. â'¢ Contacts of highly reliable design safely hold the substrate in place by positive spring action. â'¢ PLCC chip extraction tool is available. See page 96. No. of Pins ORDERING INFORMATION -A- -B- -C- -D- Quantity per Tube 28 32* 44 52 68 84 540-44-028-24-000000 Mill-Max Mfg.
Original
Abstract: COMPACT PLCC SOCKETS For Through Board Mount Series 540 â'¢ Note: End stackable. â'¢ Series 540 PLCC sockets are designed to accept JEDEC type MS-016 & MS-018 leaded plastic substrates. â'¢ Body has polarizing features for both substrate and socket insertion. â'¢ Contacts of highly reliable design safely hold the substrate in place by positive spring action. â'¢ PLCC chip extraction tool available. See page 96. No. of Pins ORDERING INFORMATION -A- -B- -C- -D- Mill-Max Mfg.
Original

PLCC44

Abstract: 112E10 . REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT187-2 112E10 MS-018 EDR
Philips Semiconductors
Original
PLCC44 EDR-7319

LA 78141

Abstract: la 78141 equivalent subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 · DALLAS
Texas Instruments
Original
TIBPAL22VP10-20C TIBPAL22VP10-25M D2943 TIBPAL22VP10 LA 78141 la 78141 equivalent glass frit electronics TTL LA 78141 data sheet la 78141 LA 78141 data SRPS013 TIBPAL22V10A

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing AA AF AF AE AB AG BBA AC AC AB BCB Package JEDEC Outline MS-001 MS-018 MS-030 MS-001 MO-087 MS-013 MS-018 MS-001 MS-026 MS-103 MS-011 MO-087 MS-018 MS-022 MS-026 Altera Corporation 25 Altera , Ultra FineLine BGA JEDEC Outline MO-216 MO-087 MO-066 MS-018 MO-087 MS-018 MO-067 (2) MO-067 MS , ANSI Y14.5M - 1982 2. Controlling dimension: inches. 3. JEDEC reference MS-018 option AA. Altera , reference MS-018 option AB. Altera Corporation 35 Altera Device Package Information Data Sheet
Altera
Original
208 pin rqfp drawing 240 pin rqfp drawing BGA 144 192 BGA PACKAGE thermal resistance MS-034 AAL-1 bga package weight T-187 800-EPLD

ep600i

Abstract: JEDEC MS-034-AAJ-1 PLCC MS-018 AA 24 CerDIP MO-030 AF 24 PDIP MS-001 AF 28 SOIC MS-013 AE 28 PLCC MS-018 AB 28 PDIP MS-001 AG 32 TQFP MO-026 BBA 40 PDIP MS-011 AC 44 PLCC MS-018 AC 44 PQFP MO-022 AB 44 TQFP MO-026 BCB 49 Ultra FineLine BGA MS-216 BAB-2 68 PGA MO-066 AC 68 PLCC MS-018 AE 84 PLCC MS-018 AF 100 PQFP MO-022 GC-1 100 TQFP MO-026 BED
Altera
Original
ep600i JEDEC MS-034-AAJ-1 BGA Package 172 MS-034 AAF-1 EP1800 192PGA

PLCC socket pin configuration

Abstract: 28 PLCC socket pin configuration 24 PLCC 28 FN MS-018 300 × 348 214 × 319 70.9 58.8 52.7 46 Modeled 44 FN MS-018 270 × 270 235 × 235 46.2 38.6 35.4 31.6 Modeled 22 68 FN MS-018 325 × 325 280 × 280 39.3 33 30.5 27.6 Modeled 14.5 84 FN MS-018 275 × 275 188 × 185 39.7 33.9 31.8 29.4 Modeled 11.9 52 RC MS
ADAM Tech
Original
PLCC socket pin configuration 28 PLCC socket pin configuration PLCC-68-AT 52 PLCC socket pin configuration PLCC-32-AT E224053 UL94V-0 CC-44- CC-52- CC-68- CC-84-
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