MPXH6101A MPXH6101A6U MPXH6101A6T1 MPXH6101AC6U MPXH6101AC6T1 MPXH6101A6U/6T1 - Datasheet Archive
Freescale Semiconductor + MPXH6101A Rev 7, 1/2009 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications
Pressure Freescale Semiconductor + MPXH6101A MPXH6101A Rev 7, 1/2009 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPXH6101A MPXH6101A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Freescale MAP sensor a logical and economical choice for automotive system designers. The MPXH6101A MPXH6101A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXH6101A MPXH6101A Series 15 to 105 kPa (2.18 to 15.2 psi) 0.2 to 5.0 V Output Application Examples · · · Manifold Sensing for Automotive Systems Ideally Suited for Microprocessor or Microcontroller-Based Systems Also Ideal for Non-Automotive Applications Features · · · · 1.72% Maximum Error Over 0° to 85°C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Temperature Compensated Over 40°C to +125°C Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Device Name Package Options Case No. # of Ports None Pressure Type Single Dual Gauge Differential Absolute Super Small Outline Package (MPXH6101A MPXH6101A Series) MPXH6101A6U MPXH6101A6U Rails 1317 · MPXH6101A6T1 MPXH6101A6T1 MPXH6101AC6U MPXH6101AC6U MPXH6101AC6T1 MPXH6101AC6T1 Tape and Reel Rails Tape and Reel 1317 1317A 1317A Option Surface ThroughMount Hole Device Marking · · · · MPXH6101A MPXH6101A · · · · · · · MPXH6101A MPXH6101A SUPER SMALL OUTLINE PACKAGE SURFACE MOUNT MPXH6101A6U/6T1 MPXH6101A6U/6T1 CASE 1317-04 MPXH6115AC6U/C6T1 MPXH6115AC6U/C6T1 CASE 1317A-03 © Freescale Semiconductor, Inc., 2006, 2008, 2009. All rights reserved. MPXH6101A MPXH6101A MPXH6101A MPXH6101A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 15 - 105 kPa Supply Voltage(2) VS 4.75 5 5.5 Vdc Supply Current Io - 7.0 10 mAdc (0 to 85°C) Voff 0.117 0.222 0.327 Vdc (0 to 85°C) VFSO 4.933 5.013 5.092 Vdc (0 to 85°C) VFSS - 4.8 - Vdc (0 to 85°C) - - - ±1.72 %VFSS V/P - 53 - mV/kPa tR - 15 - ms Io+ - 0.1 - mAdc - - 20 - ms - - ±0.5 - %VFSS Pressure Range (1) Minimum Pressure Offset @ VS = 5.0 Volts(3) Full Scale Output @ VS = 5.0 Volts (4) (5) Full Scale Span @ VS = 5.0 Volts Accuracy (6) Sensitivity Response Time (7) Output Source Current at Full Scale Output (8) Warm-Up Time (9) Offset Stability 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXH6101A MPXH6101A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Symbol Value Unit Maximum Pressure (P1 > P2) Rating PMAX 400 kPa Storage Temperature TSTG -40 to +125 °C TA -40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element Gain Stage #2 and Ground Reference Shift Circuitry Vout 4 Pins 1, 5, 6, 7, and 8 are NO CONNECTS for super small outline package devices. GND 3 Figure 1. Fully Integrated Pressure Sensor Schematic MPXH6101A MPXH6101A Sensors Freescale Semiconductor 3 Pressure On-Chip Temperature Compensation and Calibration Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317). Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C. The output will saturate outside of the specified pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXH6101A MPXH6101A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Die Fluoro Silicone Gel Die Coat Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) 5.0 +5 V 4.5 4.0 MPXH6101A MPXH6101A to ADC Vout Pin 4 100 nF GND Pin 3 47 pF 51 K Output (Volts) 3.5 VS Pin 2 3.0 2.5 Transfer Function: Vout = Vs* (0.01059*P-0.10941) ± Error VS = 5.0 Vdc Temperature = 0 to 85°C 15 kPa to 105 kPa MPXH6101A MPXH6101A TYP 2.0 1.5 1.0 MAX MIN 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 0 Pressure (ref: to sealed vacuum) in kPa Figure 3. Recommended Power Supply Decoupling and Output Filtering Figure 4. Output versus Absolute Pressure MPXH6101A MPXH6101A 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table: Part Number Case Type MPXH6101A6U/T1 MPXH6101A6U/T1 MPXH6101AC6U/T1 MPXH6101AC6U/T1 1317 1317A Pressure (P1) Side Identifier Stainless Steel Cap Side with Port Attached INFORMATION FOR USING THE SMALL OUTLINE PACKAGES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317) MPXH6101A MPXH6101A Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6101A MPXH6101A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6101A MPXH6101A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6101A MPXH6101A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6101A MPXH6101A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6101A MPXH6101A 10 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXH6101A MPXH6101A Rev. 7 1/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. 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