MPSI050A 4203862/B - Datasheet Archive
MPSI050A SEPTEMBER 2001 REVISED AUGUST 2002 EFC (RPSIPG3) PLASTIC SINGLE-IN-LINE MODULE 0.90 (22,86) MAX.
MECHANICAL DATA MPSI050A MPSI050A SEPTEMBER 2001 REVISED AUGUST 2002 EFC (RPSIPG3) PLASTIC SINGLE-IN-LINE MODULE 0.90 (22,86) MAX. 0.94 (23,87) MAX. 0.34(8,63) MAX. Note F Pin 1 Designation Suffix S 1.000 (25,40) C/L to C/L 1 0.070 (1,77) 2 Places 0.017 (0,43) TYP. 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.006 (0,15) MAX. FRONT VIEW 0.100 (2.54) MAX. Seating Plane 0.94 (23,87) 0.450 (11,43) 0.150 (3,81) 0.245 (6,22) Note G 0.075 (1,90) 2 Places 0.125 (3,17) 1.26 (32,00) 1.100 (27,94) C/L to C/L 0.200 (5,08) Note E Note H, F 1 0.150 (3,81) Note I 0.150 (3,81) 0.040 (1,01) TYP. 0.100 (2,54) 2 Places PC LAYOUT NOTES: A. B. C. D. E. F. All linear dimensions are in inches (mm). This drawing is subject to change without notice. 2 place decimals are ±0.030 (±0,76mm). 3 place decimals are ±0.010 (±0,25mm). Recommended mechanical keep out area. The 2-pin tab is electrically isolated and can be grounded. POST OFFICE BOX 655303 4203862/B 4203862/B 08/02 G. Vias are recommended to improve copper adhesion. H. Solder mask openings to copper island for solder joints to mechanical pins. I. Power pin connections should utilize two or more vias per input, ground and output pin. · DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding thirdparty products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2002, Texas Instruments Incorporated