500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
LQM21PN2R2MEHD Murata Manufacturing Co Ltd FIXED IND 2.2UH 1.1A 219 MOHM visit Digikey Buy
APD0505-219 Skyworks Solutions Inc Pin Diode, 50V V(BR), Silicon, GREEN, HERMETIC SEALED, CASE 219, 1 PIN visit Digikey Buy
EPC16UC88N Altera Corporation Configuration Memory, 1MX16, Parallel, CMOS, PBGA88, MO-219, ULTRA FINE LINE, BGA-88 visit Digikey Buy
EPC16UC88 Altera Corporation Configuration Memory, 1MX16, Parallel, CMOS, PBGA88, MO-219, ULTRA FINE LINE, BGA-88 visit Digikey Buy
MX29LV640EBXEI-70G Macronix International Co Ltd Flash, 4MX16, 70ns, PBGA48, 6 X 8 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, TFBGA-48 visit Digikey Buy
MX29SL800CBXEC-90G Macronix International Co Ltd Flash, 512KX16, 90ns, PBGA48, 6 X 8 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, LFBGA-48 visit Digikey Buy

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : MMO-219F-20.250MHZ-T Supplier : MMD Components Manufacturer : Bristol Electronics Stock : 787 Best Price : - Price Each : -
Shipping cost not included. Currency conversions are estimated. 

MO-219

Catalog Datasheet MFG & Type PDF Document Tags

272-FBGA

Abstract: ADS25338 THE JEDEC REGISTERED OUTLINE MO-219 DESIGNER 272-FBGA-15.0X15.0 PACKAGE OUTLINE UNIT
-
Original
ADS25338 272-FBGA 5M-1994 LW-07020-O

MO-219

Abstract: 400FBGA DRAWING CONFORMS TO THE JEDEC REGISTERED OUTLINE MO-219 UNLESS OTHERWISE SPECIFIED TITLE 400
Samsung Electronics
Original
400-FBGA-18 ADS32075 400FBGA 400-FBGA JS-08107-O

ADS22485

Abstract: MO-219 : A.THIS DRAWING CONFIRMS TO THE JEDEC REGISTERED OUTLINE MO-219 REV. DATE ECN# 001 2007.02.12 1
-
OCR Scan
ADS22485 184-FBGA-12 JW-06001-A

jedec mo-142 dd

Abstract: jedec mo-142 with the general requirements of JEDEC publication 95 MO-219, although some dimensions may be more , .10x12-ILL.2 0.21 ± 0.05 Note: 1. Complies with the general requirements of JEDEC publication 95 MO-219, although
Silicon Storage Technology
Original
32-PIN jedec mo-142 dd jedec mo-142 MO-142 jedec mo-015 ba MS-016 MO-015 28-PIN 56-BALL 12-ILL 63-BALL

DS7409HGB

Abstract: DS7409HG options â'¢ JEDEC Standard Outlines including MO-192, MO-195, MO-216, MO-219 and MO-298 Reliability
-
Original
DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a E700G DS820C

E679

Abstract: Amkor CSP mold compound reliability ·JEDEC Standard Outlines including MO-192 and MO-219 ·Thin DA film and spacer technology
Amkor Technology
Original
E679 Amkor CSP mold compound chiparray amkor Amkor mold compound Amkor Wafer level mold compound amkor polyimide

HL832N

Abstract: ELC4785 ·Passive component integration options ·JEDEC Standard Outlines including MO-192, MO-195, MO-216, MO-219
Amkor Technology
Original
HL832N ELC4785 DS7409 amkor flip cu pillar Amkor Technology

69LD

Abstract: A81L801 reliability ·JEDEC Standard Outlines including MO-192 and MO-219 ·Thin DA film and spacer technology
AMIC Technology
Original
A81L801 69LD
Showing first 20 results.