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MO-211

Catalog Datasheet MFG & Type PDF Document Tags

MO-211

Abstract: SPP-010 ES D- 30 DESIGNATOR F-XBGA ISSUE A DATE AUG 1998 MO-211 SHEET 1 OF 4 COMMON DIMENSIONS s Y M , 1998 MO-211 SHEET 2 OF 4 VARIATIONS e = o .40 P 1 TCH , STATE PRODUCT OUTLINE DIE SIZE BALL GRID ARRAY ISSUE A DATE AUG 1998 MO-211 SHEET 3 OF 4 , GRID ARRAY ISSUE A DATE AUG 1998 MO-211 SHEET 4 OF 4
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SPP-010

LM358

Abstract: LM2904 6. JEDEC MO-211 VARIATION BC http://www.national.com/JPN/ 22 NOTES: 1. 2 , X X 5. JEDEC MO-211 VARIATION BC 8-Bump micro SMDLead Free NS Package Number TPA08AAA
National Semiconductor
Original
LM358 LM2904 LM358 voltage comparator LM358 comparator ic LM358 comparator hysteresis lm358 led driver AN-1112 3VDC32VDC 16VDC LM358/LM2904 DS007787-14-JP LM158/LM258/LM358/LM2904

MO-211

Abstract: micro electret REGISTRATION MO-211. VARIATION BC. 4-Bump Thin micro SMD NS Package Number TPA04GKA X1 = 0.93mm X2 = , WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211
National Semiconductor
Original
LMV1012 LMV1012TP-07 LMV1012TP-15 LMV1012TP-25 LMV1012UP-15 LMV1012-15 micro electret electret condenser microphone amplifier circuit LMV1012-07 LMV1012-25 LMV1012-07/LMV1012-15/LMV1012-25

LM358

Abstract: LM358 comparator ic 6. JEDEC MO-211 VARIATION BC http://www.national.com/JPN/ 22 NOTES: 1. 2 , 3 5. JEDEC MO-211 VARIATION BC 8-Bump micro SMD Lead Free NS Package Number TPA08AAA
National Semiconductor
Original
IC LM358 lm358 current monitor lm358 smd LM358 oscillator lm358 vco LM158 LM258 15VDC 32VDC LM358/LM358A AN-450

micro electret

Abstract: MO-211 REGISTRATION MO-211. VARIATION BC. 4-Bump Thin micro SMD NS Package Number TPA04GKA X1 = 0.93mm X2 = , WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211
National Semiconductor
Original
electret microphone DS20072 mo211 LMV1012-07/ LMV1012-15/

SFC3.3-4.WCT

Abstract: underfill Guideline JEDEC MO-211, 0.50 mm Flip Chip Package Non-conductive top side coating Marking : Marking Code Packaging , MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0
Semtech
Original
SFC3.3-4.WCT underfill Guideline J-STD-020

MO-211

Abstract: SYMM
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MKT-SVA08A
Abstract: -4 Mechanical Characteristics JEDEC MO-211, 0.50 mm Pitch Flip Chip Package Non-conductive top side coating , NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63 Semtech
Original
SFC05-4
Abstract: -5 Mechanical Characteristics JEDEC MO-211, 0.50 mm Pitch Flip Chip Package Non-conductive top side coating , . CONTROLLING DIMENSIONS ARE IN MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 EUTECTIC BUMP Semtech
Original
SFC05-5

MO-211

Abstract: TFBGA48 3.5 0.15 0.1 0.12 0.1 OUTLINE VERSION SOT641-1 REFERENCES IEC JEDEC MO-211
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TFBGA48 sot641

smd CAY

Abstract: k 2225 =1615, LENGTH=2123, HEIGHT=945 REFERENCE JEDEC REGISTRATION MO-211, VARIATION BD. APPROVALS DRAWN MARTA SUCHY
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smd CAY k 2225 micro SMD-12 BLA12EFB SOMKT-BLA12XXX

1uF 250V smd

Abstract: LM20 : GND 2 PC 2 NC 1 Note: JEDEC MO-211 BA
National Semiconductor
Original
1uF 250V smd LM20 lm202 LM2025 LM20B LM74 ASC70 02LM20 LM202 LM20BLM20C LM20S SC-70

BC 945 p

Abstract: k2225 : BLP10EFB HAS WIDTH=1615, LENGTH=2123, HEIGHT=945 REFERENCE JEDEC REGISTRATION MO-211, VARIATION BD
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BC 945 p k2225 2047X IC 2073 2530Y

MO-211

Abstract: 1N2301 =2619, HEIGHT=945 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BF REVISIONS LTR DESCRIPTION E.C.N
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1N2301 L2746 D2568 BPA20EFB MKT-BLA20XXX

MO-211

Abstract: 387F JEDEC REGISTRATION MO-211, VARIATION BC REVISIONS REV DESCRIPTION E.C.N. DATE BV/APP'D A RELEASE
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387F 1895 MKT-TPA09XXX

MO-211

Abstract: : BLA06AFA HAS WIDTH = 1006, LENGTH = 1641, HE I GHT = 795 REFERENCE JEDEC REGISTRATION MO-211, VARIATION BB
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MKT-BLA06XXX

MO-211

Abstract: 387F (SEE TABLE, SHEET 2) . REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. BUMP NOTE 2 0 . 18 0.16
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Abstract: JEDEC MO-211 0.50 mm Flip Chip Package Non-conductive top side coating Marking : Marking Code Packaging , MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0 Semtech
Original

BC 945

Abstract: MO-211 =1615, LENGTH=1641, HEIGHT=945 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. APPROVALS DRAWN MARTA
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OCR Scan
BC 945 BLA09EFB MKT-BLA09XXX

MO-211

Abstract: 1463 =777, LENGTH^1412, HEIGHT=700 REFERENCE JEDEC REGISTRATION MO-211, VARIATION BB. APPROVALS DRAWN MARTA
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1463 BPA06AFA MKT-BPA06XXX

m-o 94V-0 LCD

Abstract: ul 94v-0 lcd display 18 pin discharge) per IEC 61000-4-2, level 4. Mechanical Characteristics JEDEC MO-211, Variation BF, 0.5 mm , 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR Sn95.5/Ag3.8/Cu0
Semtech
Original
m-o 94V-0 LCD ul 94v-0 lcd display 18 pin smd diode code E5 Diodes smd e5 SMD MARKING E5 pcb design 0,5 mm pitch 5x5 matrix 2356C TM2356C 800MH
Abstract: Working voltage: 5V Series Resistor: 10 Solid-state technology JEDEC MO-211, 0.50 mm Pitch Flip Chip , . REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0.7 FOR Pb-FREE Semtech
Original
SFC2280-10

joint

Abstract: SFC3.3-4.WCT wires. Mechanical Characteristics JEDEC MO-211, 0.50 mm Flip Chip Package Non-conductive top side , NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63
Semtech
Original
joint

marking CODE 68

Abstract: MARKING CODE SMD IC PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA. 4 , PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA. 4 , PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211. VARIATION BC. 4
National Semiconductor
Original
LMV1012-20 marking CODE 68 MARKING CODE SMD IC electret microphone ic SCHEMATIC SOUND BOARD ECM microphone smd code marking pa LMV1012XP CSP-9-111C2 CSP-9-111S2

eel 19 2005

Abstract: Working voltage: 5V Series Resistor: 68 Solid-state technology JEDEC MO-211, 0.50 mm Pitch Flip Chip , MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES Land Pattern -
Semtech
Original
eel 19 2005 SFC2280-68

AG38

Abstract: JEDEC MO-211, 0.50 mm Flip Chip Package Non-conductive top side coating Marking : Marking Code Packaging , . CONTROLLING DIMENSIONS ARE IN MILLIMETER 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn95.5/Ag3.8/Cu0.7 FOR
Semtech
Original
AG38

amplifier SMD MARKING CODE 211

Abstract: two pin condenser microphone PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA. 4 , IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211 , PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211
National Semiconductor
Original
amplifier SMD MARKING CODE 211 two pin condenser microphone two wire electret microphone condenser Miniature electret microphone Sound Design hearing LMV1012XP-15

MO-211

Abstract: J-STD-020B JEDEC MO-211, Variation BA, 0.50 mm Pitch Flip Chip Package RoHS/WEEE Compliant Marking : Marking , JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR Sn95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES
Semtech
Original
J-STD-020B 0503C TM0503C
Abstract: -4 Mechanical Characteristics JEDEC MO-211, 0.50 mm Pitch Flip Chip Package Non-conductive top side coating , MO-211. 3. Sn63/Pb37 EUTECTIC BUMP. Land Pattern 2004 Semtech Corp. 7 www.semtech.com Semtech
Original
Abstract: : 5.0V Solid-state technology uClamp0503C Mechanical Characteristics JEDEC MO-211 , REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR Sn95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES. Land Semtech
Original
Abstract: -5 Mechanical Characteristics JEDEC MO-211, 0.50 mm Pitch Flip Chip Package Non-conductive top side coating , NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63 Semtech
Original

marking A1

Abstract: F45U . Mechanical Characteristics JEDEC MO-211, 0.50 mm Pitch Flip Chip Package Non-conductive top side coating , REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES Land
Semtech
Original
marking A1 F45U
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