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2-1601095-2 TE Connectivity (2-1601095-2) 131-166-014=TAB,PCB,STD,SMZ visit TE Connectivity

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MO-166

Catalog Datasheet MFG & Type PDF Document Tags

MO-166

Abstract: PPF leadframe isolated. The PSOP 3 package is compliant to JEDEC outline MO-166. The PSOP 2 packages are essentially , 0.406 0.092 .002 .094 MS-013* 37 1.60 14.2 3.15 0.20 3.35 MO-166 30 , 11.0 mm (.433") 1.000 24 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm(.433") 0.800 30 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.433") 0.650 36 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3
Amkor Technology
Original
PPF leadframe MO166 tip 142 MS-012

MO-166

Abstract: PPF leadframe MO-166 MO-166 MO-166 MO-166 MO-166 www.amkor.com With respect to the information in this
Amkor Technology
Original
psop3 outline of the heat slug for JEDEC

DS320G

Abstract: MO-166 low stand-off (.002) heatslug down version, which is MS-012, MS-013, or MO-166 JEDEC compliant , 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.422") 1.000 24 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.422") 0.800 30 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.422") 0.650 36 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSSOP (units in inches unless otherwise stated
Amkor Technology
Original
DS320G PSOP amkor exposed pad heat slug for JEDEC 16P-SOP

MO-166

Abstract: MO166 15.5 15.9 0.610 0.626 0.8 1.1 h L 1.1 N 0.043 0.031 JEDEC MO-166 , dimensions: "E", "G" and "a3". (2) For subcontractors, the limit is the one quoted in jedec MO-166 N R
-
Original
powerso20 PSO20MEC

powerso-20 and pcb footprint

Abstract: powerso-36 and pcb footprint Jedec registration MO-166. STMicroelectronics developed PowerSO in order to answer the increasing , the production of power systems. PowerSO-20 and PowerSO-36 are the elements of the MO-166 family , . These packages are in mass production since 1995. PowerSO-20TM ­ Jedec Registration MO-166 This , . The new family, named PowerSO, is Jedec registered as MO-166. PowerSO-20 and PowerSO-36 are presented , -20 PowerSO-36 3/19 AN668 APPLICATION NOTE Figure 3. PowerSO-20 package (Jedec MO-166) mechanical data
STMicroelectronics
Original
powerso-20 and pcb footprint powerso-36 and pcb footprint MOUNTING OF SURFACE MOUNT COMPONENTS solder voids to263 LEAD FRAME SURFACE MOUNT fr4 metal slug SO-20TM SO-36 SO-20 SO-20/36

powerso-36 and pcb footprint

Abstract: powerso-20 and pcb footprint Jedec registration MO-166. STMicroelectronics developed PowerSO in order to answer the increasing , the production of power systems. PowerSO-20 and PowerSO-36 are the elements of the MO-166 family , . These packages are in mass production since 1995. PowerSO-20TM ­ Jedec Registration MO-166 This , . The new family, named PowerSO, is Jedec registered as MO-166. PowerSO-20 and PowerSO-36 are presented , -20 PowerSO-36 3/19 AN668 APPLICATION NOTE Figure 3. PowerSO-20 package (Jedec MO-166) mechanical data
STMicroelectronics
Original
POWERSO36 shape ST Microelectronics, mold compound PSO-36 an668 "pin compatible" audio amplifier 2400 watt PowerSO weight 1.9 gr

MO-166

Abstract: POWERSO20 15.9 0.610 0.626 h L 1.1 0.8 1.1 JEDEC MO-166 0.043 0.031 N S 0.043
STMicroelectronics
Original

MO-166

Abstract: heat slug for JEDEC Thermal Data ® POWER SO-20 Family 20, 36 leads ( JEDEC MO-166 ) 20 leads 36 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach soft solder ( tin / lead ) 15-50 µm 0.2 W/cm°C molding compound epoxy resin 2 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-c) vs. die
-
Original
MO-166 Power SO20

MO-166

Abstract: CDA 194 \ 24-PIN PSOP (JEDEC MO-166) I DF .XX = ±.01 [.254] â'¢XXX = ±.005 [.127] ANG. = ±.5' APEX Il
-
OCR Scan
CDA 194 MP8000AN R018 009j t 056 JEDEC MO 086 8000AN

MO-166

Abstract: POWERSO20 MO-166. SGS-THOMSON developed PowerSO in order to answer the increasing demand of miniaturization , systems. PowerSO-20 is the element of the MO-166 family having 20 leads at 0.050 inch pitch (1.27 mm). , power package technology as Multiwatt did 15 years ago. PowerSO-20TM ­ Jedec Registration MO-166 , , is Jedec registered as MO-166. APPLICATION NOTE PowerSO-20, which is presented in this technical , family having 20 leads with 1.27 mm (0.050 inch) pitch, named Figure 4: PowerSO20 package (Jedec MO-166
STMicroelectronics
Original
MULTIWATT15 heat sink ppt on ic microelectronics ppt D94AN015 TDA7350A MW15L

MO166

Abstract: MO-166 packaged in a 24 pin PSOP (JEDEC MO-166) package. The heatslug of the PA243DF package is isolated up to , package. Do not allow the temperature to exceed 85°C. The PA243DF is packaged in a 24 pin PSOP (JEDEC MO-166
Apex Microtechnology
Original
OPERATION--350V CURRENT--120 PA243 PA241 1N4148 2N4416

car high power amp circuit diagrams

Abstract: MO-166 0.626 0.8 1.1 0.031 0.043 h L 0.244 1.1 0.043 N 8°(typ.) S JEDEC MO-166 , "a3". (2) For subcontractors, the limit is the one quoted in jedec MO-166 N R N a2 b A
STMicroelectronics
Original
TDA7391PD TDA7391PD13TR car high power amp circuit diagrams car power amp circuit diagrams st car amplifier E-TDA7391PD E-TDA7391PDTR

MO-166

Abstract: car high power amp circuit diagrams 0.8 1.1 0.043 N 8°(typ.) S JEDEC MO-166 8°(max. ) T 10 0.394 PowerSO , quoted in jedec MO-166 N R N a2 b A e DETAIL A c a1 DETAIL B E e3 H
STMicroelectronics
Original
powerso-20 JESD97 l 0244
Abstract: 0.626 0.031 0.043 h L 1.1 0.8 1.1 0.043 N 8˚(typ.) S JEDEC MO-166 8Ë , ' and â'a3â'. (2) For subcontractors, the limit is the one quoted in jedec MO-166 N R N a2 STMicroelectronics
Original
L9651 ID7718
Abstract: .) S JEDEC MO-166 8˚(max. ) T 10 0.394 PowerSO-20 (1) â'D and E1â' do not , jedec MO-166 N R N a2 b A e DETAIL A c a1 DETAIL B E e3 H DETAIL A STMicroelectronics
Original
L4925 L4925PD L4925PD013TR
Abstract: application. The PA441DF is packaged in a 24 pin PSOP (JEDEC MO-166) package. The metal heat slug of the , PA443DF has two PA441 dies packaged in a 24 pin PSOP (JEDEC MO-166)package. The heatslug of the PA443DF Apex Microtechnology
Original
PA441/PA443 PA341 PA441DW PA441U/PA443U

L6234D

Abstract: PowerS020 transistors can sustain a very PIN CONNECTION (Top view) SO (16+2+2) PowerS020 (Jedec MO-166) ORDERING
-
OCR Scan
L6234 L6234D PowerS020 B334 S020 UMI E2

JESD51-5

Abstract: JESD-51-5 in Figure 2., was widened for better thermal resistance performance compared to the JEDEC MO-166 , Reference (1.) "Plastic Small Outline Heatslug Package", MO-166, JEDEC Solid State Product Outline. (2
Motorola
Original
JESD51-5 JESD-51-5 JEDEC JESD51-8 BGA JESD51-8 jesd51 8 HSOP 30 AN2388/D

JEDEC JESD51-8 BGA

Abstract: JESD51-8 compared to the JEDEC MO-166 package [See reference (1)]. The bottom side of the 20ld HSOP is slightly , 10.0Reference (1) (2) (3) (4) (5) (6) (7) (8) (9) "Plastic Small Outline Heatslug Package", MO-166
Freescale Semiconductor
Original
AN2388 800E-02 G38-87 JESD51-7 JEDEC JESD51-8 BGA PACKAGE thermal resistance Freescale 44LD
Abstract: 0.114 0.244 0.004 0.626 0.043 0.043 JEDEC MO-166 0.004 MIN. inch TYP. MAX. 0.142 0.012 0.130 0.004 0.021 , subcontractors, the limit is the one quoted in jedec MO-166 PowerSO-20 N N a2 b e A R c DETAIL B STMicroelectronics
Original
L6370 L6370L L6370D L6370D013TR

L6370

Abstract: L6370D h L 1.1 0.043 N 8°(typ.) S JEDEC MO-166 8°(max. ) T 10 0.394 , limit is the one quoted in jedec MO-166 N R N a2 b A e DETAIL A c a1 DETAIL B
STMicroelectronics
Original
MULTIWATT11

l 0244

Abstract: c16tj 1.1 0.8 1.1 0.043 N 8°(typ.) S JEDEC MO-166 8°(max. ) T 10 0.394 , limit is the one quoted in jedec MO-166 N R N a2 b A e DETAIL A c a1 DETAIL B
STMicroelectronics
Original
VNQ860-E VNQ860SP-E c16tj SO-10TM
Abstract: 0.626 0.8 1.1 0.031 0.043 h L 1.1 0.043 N 8˚(typ.) S JEDEC MO-166 , ', â'Gâ' and â'a3â'. (2) For subcontractors, the limit is the one quoted in jedec MO-166 N R STMicroelectronics
Original
L9332 L9332-DIE1

L9332

Abstract: MO-166 0.043 h L 1.1 0.043 N 8°(typ.) S JEDEC MO-166 8°(max. ) T 10 0.394 , limit is the one quoted in jedec MO-166 N R N a2 b A e DETAIL A c a1 DETAIL B
STMicroelectronics
Original
ecopack
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