MMSF3300 S3300 MMSF3300R2 MMSF3300/D AN569 1E-05 1E-04 1E-03 1E-02 1E-01 SMD310 - Datasheet Archive

 

Advance Information Power MOSFET 11.5 Amps, 30 Volts N­Channel SO­8 These Power MOSFETs are capable of withstanding high

 

MMSF3300 MMSF3300 Advance Information Power MOSFET 11.5 Amps, 30 Volts N­Channel SO­8 These Power MOSFETs are capable of withstanding high energy in the avalanche and commutation modes and the drain­to­source diode has a very low reverse recovery time. WaveFETt devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc­dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. http://onsemi.com 11.5 AMPERES 30 VOLTS RDS(on) = 12.5 mW N­Channel D · Characterized Over a Wide Range of Power Ratings · Ultralow RDS(on) Provides Higher Efficiency and Extends Battery · · · · · · G Life in Portable Applications Logic Level Gate Drive ­ Can Be Driven by Logic ICs Diode Is Characterized for Use In Bridge Circuits Diode Exhibits High Speed, With Soft Recovery IDSS Specified at Elevated Temperature Avalanche Energy Specified Miniature SO­8 Surface Mount Package ­ Saves Board Space S MARKING DIAGRAM SO­8 CASE 751 STYLE 12 8 MAXIMUM RATINGS (TJ = 25°C unless otherwise specified) Parameter Drain­to­Source Voltage Drain­to­Gate Voltage Gate­to­Source Voltage Gate­to­Source Operating Voltage Operating and Storage Temperature Range Single Pulse Drain­to­Source Avalanche Energy ­ Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, L = 18.8 mH, IL(pk) = 7.3 A, VDS = 30 Vdc) Symbol Value Unit VDSS VDGR 30 Vdc 30 Vdc VGS VGS ±20 Vdc ±16 ­55 to 150 °C EAS 500 mJ 1 Vdc TJ, Tstg S3300 S3300 LYWW L Y WW = Location Code = Year = Work Week PIN ASSIGNMENT Source 1 8 Drain Source 2 7 Drain Source 3 6 Drain Gate 4 5 Drain Top View ORDERING INFORMATION Device MMSF3300R2 MMSF3300R2 Package SO­8 Shipping 2500 Tape & Reel This document contains information on a new product. Specifications and information herein are subject to change without notice. © Semiconductor Components Industries, LLC, 2000 November, 2000 ­ Rev. 5 1 Publication Order Number: MMSF3300/D MMSF3300/D MMSF3300 MMSF3300 POWER RATINGS (TJ = 25°C unless otherwise specified) Symbol Drain Current ­ Continuous @ TA = 25°C Drain Current ­ Continuous @ TA = 100°C Drain Current ­ Single Pulse (tp 10 ms) Mounted on 1 inch square FR­4 or G10 board Total Power Dissipation @ TA = 25°C Linear Derating Factor Thermal Resistance VGS = 10 Vdc ­ Junction­to­Ambient Steady State Continuous Source Current (Diode Conduction) Parameter Drain Current ­ Continuous @ TA = 25°C Drain Current ­ Continuous @ TA = 100°C Drain Current ­ Single Pulse (tp 10 ms) Mounted on minimum recommended FR­4 or G10 board Total Power Dissipation @ TA = 25°C Linear Derating Factor VGS = 10 Vdc Thermal Resistance t 10 seconds ­ Junction­to­Ambient Continuous Source Current (Diode Conduction) Parameter Drain Current ­ Continuous @ TA = 25°C Drain Current ­ Continuous @ TA = 100°C Drain Current ­ Single Pulse (tp 10 ms) Mounted on minimum recommended FR­4 or G10 board Total Power Dissipation @ TA = 25°C Linear Derating Factor Thermal Resistance VGS = 10 Vdc ­ Junction­to­Ambient Steady State Continuous Source Current (Diode Conduction) http://onsemi.com 2 50 °C/W 3.0 Adc Value Unit ID ID IDM PD 9.1 6.5 50 Adc Adc Adc 1.6 12.5 Watts mW/°C RJA 80 °C/W 2.0 Adc Value Unit ID ID IDM PD 9.1 6.5 50 Adc Adc Adc 1.6 12.5 Watts mW/°C RJA 80 °C/W 2.0 Adc Value Unit ID ID IDM PD 6.7 4.7 50 Adc Adc Adc 0.8 6.7 Watts mW/°C RJA 150 °C/W IS Parameter RJA Symbol t 10 seconds ­ Junction­to­Ambient Continuous Source Current (Diode Conduction) Watts mW/°C IS Thermal Resistance 2.5 20 Symbol VGS = 10 Vdc Adc Adc Adc IS Total Power Dissipation @ TA = 25°C Linear Derating Factor Unit 11.5 8.2 50 Symbol Mounted on 1 inch square FR­4 or G10 board Value ID ID IDM PD IS Parameter Drain Current ­ Continuous @ TA = 25°C Drain Current ­ Continuous @ TA = 100°C Drain Current ­ Single Pulse (tp 10 ms) 1.0 Adc MMSF3300 MMSF3300 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Symbol Min Typ Max 30 ­ ­ 24 ­ ­ ­ ­ 0.004 0.5 1.0 10 ­ ­ 100 1.0 ­ 1.9 4.4 ­ ­ ­ ­ 10 16 12.5 20 gFS 3.0 18 ­ Mhos Ciss ­ 1700 ­ pF Coss ­ 600 ­ Crss ­ 200 ­ td(on) ­ 21 40 tr ­ 45 90 td(off) ­ 40 80 tf ­ 40 80 td(on) Characteristic Unit ­ 12 25 tr ­ 12 25 td(off) ­ 55 110 OFF CHARACTERISTICS Drain­to­Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 mAdc) Temperature Coefficient (Positive) V(BR)DSS Zero Gate Voltage Drain Current (VDS = 30 Vdc, VGS = 0 Vdc) (VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125°C) IGSS mV/°C µAdc IDSS Gate­Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc) Vdc nAdc ON CHARACTERISTICS (Note 1.) Gate Threshold Voltage (VDS = VGS, ID = 250 mAdc) Threshold Temperature Coefficient (Negative) VGS(th) Static Drain­to­Source On­Resistance (VGS = 10 Vdc, ID = 10 Adc) (VGS = 4.5 Vdc, ID = 5.0 Adc) RDS(on) Forward Transconductance (VDS = 15 Vdc, ID = 10 Adc) Vdc mV/°C m DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance (VDS = 24 Vd VGS = 0 Vdc, Vdc, Vd f = 1.0 MHz) Transfer Capacitance SWITCHING CHARACTERISTICS (Note 2.) Turn­On Delay Time Rise Time Turn­Off Delay Time (VDD = 25 Vdc, ID = 1.0 Adc, VGS = 4.5 Vdc, 4 5 Vdc RG = 6.0 ) Fall Time Turn­On Delay Time Rise Time Turn­Off Delay Time (VDD = 25 Vdc, ID = 1.0 Adc, VGS = 10 Vdc, Vdc RG = 6.0 ) Fall Time tf 39 45 60 Q1 ­ 5.1 ­ Q2 ­ 14 ­ ­ 13 ­ ­ ­ 0.78 0.60 1.1 ­ trr ­ 40 ­ ta ­ 21 ­ tb ­ 19 ­ QRR ­ 0.043 ­ ns 80 ­ Q3 (VDS = 15 Vdc, ID = 2.0 Adc, VGS = 10 Vdc) ­ QT Gate Charge ns nC SOURCE­DRAIN DIODE CHARACTERISTICS Forward On­Voltage (Note 1.) VSD (IS = 2.3 Adc, VGS = 0 Vdc) (IS = 2.3 Adc, VGS = 0 Vdc, TJ = 125°C) Reverse Recovery Time (IS = 3.5 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) Reverse Recovery Stored Charge 1. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 3 Vdc ns µC MMSF3300 MMSF3300 TYPICAL ELECTRICAL CHARACTERISTICS 10 V ID , DRAIN CURRENT (AMPS) 9 8 3.5 V 5 3.1 V 4 2.9 V 3 2 VGS = 2.7 V 1 0 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 VDS 10 V 9 TJ = 25°C 6.0 V 4.5 V 4.1 V 3.7 V 7 6 10 3.3 V ID, DRAIN CURRENT (AMPS) 10 8 6 TJ = 125°C 5 4 -55°C 3 2 1 0 2.00 25°C 7 2.0 ID = 5.0 A TJ = 25°C 0.20 0.15 0.10 0.05 2 3 5 6 7 8 9 4 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 10 RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) Figure 2. Transfer Characteristics 0.30 0 0.020 TJ = 25°C 0.018 0.016 0.012 10 V 0.010 0.008 0.006 0.004 0.002 0 0 IDSS , LEAKAGE (nA) RDS(on) , DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) 1000 1.0 0.5 0 25 50 75 100 4 VGS = 0 V VGS = 10 V ID = 10 A -25 2 10 6 8 12 ID, DRAIN CURRENT (AMPS) 14 16 Figure 4. On­Resistance versus Drain Current and Gate Voltage 2.0 0 -50 VGS = 4.5 V 0.014 Figure 3. On­Resistance versus Gate­To­Source Voltage 1.5 4.0 3.5 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) Figure 1. On­Region Characteristics 0.25 3.0 2.5 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 125 100 100°C 10 25°C 1 0.1 150 TJ = 125°C 5 TJ, JUNCTION TEMPERATURE (°C) Figure 5. On­Resistance Variation with Temperature 20 25 10 15 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 6. Drain­To­Source Leakage Current versus Voltage http://onsemi.com 4 30 MMSF3300 MMSF3300 POWER MOSFET SWITCHING The capacitance (Ciss) is read from the capacitance curve at a voltage corresponding to the off­state condition when calculating td(on) and is read at a voltage corresponding to the on­state when calculating td(off). At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. The resistive switching time variation versus gate resistance (Figure 9) shows how typical switching performance is affected by the parasitic circuit elements. If the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. The circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. Most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. Power MOSFETs may be safely operated into an inductive load; however, snubbing reduces switching losses. Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (t) are determined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculating rise and fall because drain­gate capacitance varies greatly with applied voltage. Accordingly, gate charge data is used. In most cases, a satisfactory estimate of average input current (IG(AV) can be made from a rudimentary analysis of the drive circuit so that t = Q/IG(AV) During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as the plateau voltage, VSGP. Therefore, rise and fall times may be approximated by the following: tr = Q2 x RG/(VGG ­ VGSP) tf = Q2 x RG/VGSP where VGG = the gate drive voltage, which varies from zero to VGG RG = the gate drive resistance and Q2 and VGSP are read from the gate charge curve. During the turn­on and turn­off delay times, gate current is not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an RC network. The equations are: td(on) = RG Ciss In [VGG/(VGG ­ VGSP)] td(off) = RG Ciss In (VGG/VGSP) VDS = 0 VGS = 0 4000 C, CAPACITANCE (pF) 3500 TJ = 25°C Ciss 3000 2500 Crss 2000 Ciss 1500 1000 Coss 500 0 Crss 10 5 0 5 VGS VDS 10 15 20 25 GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation http://onsemi.com 5 30 MMSF3300 MMSF3300 18 QT 1000 VDD = 25 V ID = 1.0 A VGS = 10 V TJ = 25°C 15 10 VGS 12 6 9 Q1 4 2 Q2 6 ID = 2.0 A TJ = 25°C 3 Q3 VDS 0 10 30 20 QG, TOTAL GATE CHARGE (nC) 50 40 0 t, TIME (ns) 8 0 VDS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 12 td(off) tf 100 tr td(on) 10 1 10 RG, GATE RESISTANCE (OHMS) Figure 8. Gate­To­Source and Drain­To­Source Voltage versus Total Charge 100 Figure 9. Resistive Switching Time Variation versus Gate Resistance DRAIN­TO­SOURCE DIODE CHARACTERISTICS di/dts. The diode's negative di/dt during ta is directly controlled by the device clearing the stored charge. However, the positive di/dt during tb is an uncontrollable diode characteristic and is usually the culprit that induces current ringing. Therefore, when comparing diodes, the ratio of tb/ta serves as a good indicator of recovery abruptness and thus gives a comparative estimate of probable noise generated. A ratio of 1 is considered ideal and values less than 0.5 are considered snappy. Compared to ON Semiconductor standard cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter trr), have less stored charge and a softer reverse recovery characteristic. The softness advantage of the high cell density diode means they can be forced through reverse recovery at a higher di/dt than a standard cell MOSFET diode without increasing the current ringing or the noise generated. In addition, power dissipation incurred from switching the diode will be less due to the shorter recovery time and lower switching losses. The switching characteristics of a MOSFET body diode are very important in systems using it as a freewheeling or commutating diode. Of particular interest are the reverse recovery characteristics which play a major role in determining switching losses, radiated noise, EMI and RFI. System switching losses are largely due to the nature of the body diode itself. The body diode is a minority carrier device, therefore it has a finite reverse recovery time, trr, due to the storage of minority carrier charge, QRR, as shown in the typical reverse recovery wave form of Figure 16. It is this stored charge that, when cleared from the diode, passes through a potential and defines an energy loss. Obviously, repeatedly forcing the diode through reverse recovery further increases switching losses. Therefore, one would like a diode with short trr and low QRR specifications to minimize these losses. The abruptness of diode reverse recovery effects the amount of radiated noise, voltage spikes, and current ringing. The mechanisms at work are finite irremovable circuit parasitic inductances and capacitances acted upon by high 8 I S , SOURCE CURRENT (AMPS) 7 VGS = 0 V TJ = 25°C 6 5 4 3 2 1 0 0.50 0.55 0.60 0.65 0.70 0.75 0.80 VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) Figure 10. Diode Forward Voltage versus Current http://onsemi.com 6 MMSF3300 MMSF3300 di/dt = 300 A/µs Standard Cell Density trr I S , SOURCE CURRENT High Cell Density trr tb ta t, TIME Figure 11. Reverse Recovery Time (trr) SAFE OPERATING AREA total power averaged over a complete switching cycle must not exceed (TJ(MAX) ­ TC)/(RJC). A power MOSFET designated E­FET can be safely used in switching circuits with unclamped inductive loads. For reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and must be adjusted for operating conditions differing from those specified. Although industry practice is to rate in terms of energy, avalanche energy capability is not a constant. The energy rating decreases non­linearly with an increase of peak current in avalanche and peak junction temperature. The Forward Biased Safe Operating Area curves define the maximum simultaneous drain­to­source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569 AN569, "Transient Thermal Resistance ­ General Data and Its Use." Switching between the off­state and the on­state may traverse any load line provided neither rated peak current (IDM) nor rated voltage (VDSS) is exceeded, and that the transition time (tr, tf) does not exceed 10 µs. In addition the 500 10 ms 10 EAS , SINGLE PULSE DRAIN-TO-SOURCE AVALANCHE ENERGY (mJ) ID , DRAIN CURRENT (AMPS) 100 100 ms 1 ms dc VGS = 10 V SINGLE PULSE TC = 25°C 1 0.1 0.01 RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 1 10 100 ID = 7.3 A 400 300 200 100 0 25 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 50 75 100 125 150 TJ, STARTING JUNCTION TEMPERATURE (°C) Figure 12. Maximum Rated Forward Biased Safe Operating Area Figure 13. Maximum Avalanche Energy versus Starting Junction Temperature http://onsemi.com 7 MMSF3300 MMSF3300 TYPICAL ELECTRICAL CHARACTERISTICS Rthja(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE 1000 100 DUTY CYCLE MOUNTED TO MINIMUM RECOMMENDED FOOTPRINT D = 0.5 0.2 0.1 0.05 10 0.02 0.01 1 P(pk) t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.1 1E-05 1E-05 1E-04 1E-04 1E-03 1E-03 1E-02 1E-02 1E-01 1E-01 t, TIME (seconds) 1E+00 RJA(t) = r(t) RJA D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TA = P(pk) RJA(t) 1E+01 1E+02 1E+03 Figure 14. Thermal Response ­ Various Duty Cycles 1000 100 1 2 3 4 5 MIN PAD, ja 1 INCH, ja R C R C 1.242 0.073 0.075 0.412 19.55 0.84 1.11 5.16 242 6.2 123 14.6 982 74 706 28 18,050 39.8 65.3 14,646 MIN PAD, jl R C 0.016 0.060 0.17 0.57 2.1 6.4 158 5.3 6,256 2.7 CHIP JUNCTION R1 C1 R2 R3 C2 C3 R4 R5 C4 C5 Rthja, 1 INCH PAD Rthjl, MIN PAD 10 1 AMBIENT Rthja, MIN PAD 1E-03 1E-03 1E-02 1E-02 1E-01 1E-01 1E+00 t, TIME (seconds) 1E+01 1E+02 1E+0 1 10 Figure 15. Thermal Response ­ Various Mounting/Measurement Conditions 80 60 di/dt IS POWER (W) Rthja(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE 10,000 trr ta tb TIME 0.25 IS tp 40 20 IS 0 0.01 0.1 t, TIME (seconds) Figure 16. Diode Reverse Recovery Waveform Figure 17. Single Pulse Power http://onsemi.com 8 MMSF3300 MMSF3300 INFORMATION FOR USING THE SO­8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self­align when subjected to a solder reflow process. 0.060 1.52 0.275 7.0 0.155 4.0 0.024 0.6 0.050 1.270 inches mm SO­8 POWER DISSIPATION into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 Watts. The power dissipation of the SO­8 is a function of the input pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SO­8 package, PD can be calculated as follows: PD = PD = 150°C ­ 25°C = 2.5 Watts 50°C/W The 50°C/W for the SO­8 package assumes the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.5 Watts using the footprint shown. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Cladt. Using board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. TJ(max) ­ TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values SOLDERING PRECAUTIONS · The soldering temperature and time shall not exceed 260°C for more than 10 seconds. · When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. · After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. · Mechanical stress or shock should not be applied during cooling. The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. · Always preheat the device. · The delta temperature between the preheat and soldering should be 100°C or less.* · When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. *Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 9 MMSF3300 MMSF3300 TYPICAL SOLDER HEATING PROFILE temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177­189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 18 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows STEP 1 PREHEAT ZONE 1 "RAMP" 200°C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 4 HEATING ZONES 3 & 6 "SOAK" 160°C STEP 5 STEP 6 STEP 7 HEATING VENT COOLING ZONES 4 & 7 205° TO 219°C "SPIKE" PEAK AT 170°C SOLDER JOINT 150°C 150°C 100°C 140°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 5°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 18. Typical Solder Heating Profile http://onsemi.com 10 MMSF3300 MMSF3300 PACKAGE DIMENSIONS SO­8 CASE 751­07 ISSUE V ­X­ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. A 8 5 0.25 (0.010) S B 1 M Y M 4 K ­Y­ G C N X 45 _ SEATING PLANE ­Z­ 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S XXXXXX ALYW http://onsemi.com 11 DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 STYLE 12: PIN 1. 2. 3. 4. 5. 6. 7. 8. SOURCE SOURCE SOURCE GATE DRAIN DRAIN DRAIN DRAIN INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 MMSF3300 MMSF3300 WaveFET is a trademark of Semiconductor Components Industries, LLC (SCILLC). Thermal Clad is a registered trademark of the Bergquist Company. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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