MMBD2836/MMBD2838/MMBD7000 DS-221927 UL94-V0 MIL-STD-750 MMBD2836 MMBD2838

SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 List List. 1 Package

Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000 List List. 1 Package outline. 2 Features. 2 Mechanical data. 2 Maximum ratings . 2 Rating and characteristic curves. 3.4 Pinning information. 5 Marking. 5 Suggested solder pad layout. 5 Packing information. 6 Reel packing. 6 Suggested thermal profiles for soldering processes. 7 High reliability test capabilities.8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000 200mW Surface Mount Switching Diode-70-100V Package outline Features (B) 0.014 (0.35) 0.020 (0.51) .084(2.10) .068(1.70) Mechanical data 0.108 (2.70) 0.124 (3.10) 0.042 (1.05) · Fast speed switching. · For general purpose switching application. · High conductance. · Silicon epitaxial planar chip. · Lead-free parts meet RoHS requirments. 0.034 (0.85) SOT-23 (C) (A) 0.072 (1.80) 0.024 (0.61) 0.047 (1.19) 0.012 (0.30) 0.120 (3.00) · Epoxy:UL94-V0 UL94-V0 rated flame retardant · Case : Molded plastic, SOT-23 · Terminals : Solder plated, solderable per 0.059 (1.47) MIL-STD-750 MIL-STD-750, Method 2026 0.002 (0.05) R 0.05 (0.002) 0.01 (0.25) 0.084 (2.10) 0.035 (0.88) · Polarity : Indicated by cathode band · Mounting Position : Any · Weight : Approximated 0.008 gram Dimensions in inches and (millimeters) Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER Symbol MMBD2836 MMBD2836 MMBD2838 MMBD2838 MMBD7000 MMBD7000 UNIT Reverse Voltage VR 75 100 V Forward Current IF 100 200 mA Peak Forward Surge Current I FM Board* 1, TA = 25OC Total Device Dissipation FR-5 mW mW/ OC 1.8 Thermal Resistance Junction to Ambient R èJA 2 mA 225 PD Derate Above 25 OC O Derate Above 25 C O 556 O Substrate* , TA = 25 C Total Device Dissipation 500 PD C/W mW 300 mW/ OC 2.4 Thermal Resistance Junction to Ambient R èJA Operating Temperature Range Tj -55 ~ +150 o C Storage Temperature Range T STG -65 ~ +175 o C Reverse Breakdown Voltage(I BR = 100uAdc) Reverse Voltage Leakage Current V BR 417 75 0.1 3.0 IR - 100.0 CD 4.0 1.5 at VR = 100V O at VR = 50V, TJ =125 C Diode Capacition(VR = 0V, f = 1.0MHz) Reverse Recovery Time(IF = IR = 10mA,VR = 5.0Vdc, I R(REC) = 1.0mAdc, R L = 100OHM 100OHM) Forward Voltage at IF = 1.0mAdc V 1.0 - C/W 100 at VR = 50V µAdc pF nS 4.0 T rr 700 at IF = 10mAdc VF at IF = 50mAdc at IF = 100mAdc http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 O 1000 820 mV 1000 1200 1100 Document ID Page 2 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Rating and characteristic curves for each diode (MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000) 820 OHM +10V 2K 100uH 0.1 uF IF tr tp t 0.1 uF t tr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. Recovery Time Equivalent Test Circuit FIG.1-TYPICAL FORWARD FIG.2 - LEAKAGE CURRENT CHARACTERISTICS 10 10 T A = 150OC 150OC IA, REVERSE CURRENT,(mA) IF, FORWARD CURRENT,(mA) 100 TA = 85OC TA = 25OC 1.0 TA = -40OC -40OC 1.0 T A = 125OC 125OC 0.1 T A = 85 O C T A = 55 O C 0.01 T A = 25 O C 0.1 .2 0.001 0 .4 .6 .8 1.0 10 20 30 40 50 VR, REVERSE VOLTAGE (V) 1.2 VF, FORWARD VOLT AGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Rating and characteristic curves for each diode (MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000) FIG.3 - DIODE CAPACITANCE (MMBD2836 MMBD2836) FIG.4 - DIODE CAPACITANCE (MMBD2838 MMBD2838) 1.0 CD, DIODE CAPACITANCE,(pF) CD, DIODE CAPACITANCE,(pF) 1.75 1.50 1.25 1.00 0.75 0.9 0.8 0.7 0.6 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) FIG.5 - DIODE CAPACITANCE (MMBD7000 MMBD7000) CD, DIODE CAPACITANCE,(pF) 0.68 0.64 0.60 0.56 0.52 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000 Pinning information Type number Symbol Marking code A MMBD2836 MMBD2836 B A2X C A MMBD2838 MMBD2838 B A6 C A MMBD7000 MMBD7000 B M5C C Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 55.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 12.0 Note:Devices are packed in accor dance with EIA standar RS-481-A RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 Issued Date DS-221927 DS-221927 2009/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 MMBD2836/MMBD2838/MMBD7000 Reel packing PACKAGE SOT-23 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 REEL SIZE 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 382*262*387 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tt P TP Ramp-up TL tt L Temperature T smax T smin TS tt s Preheat 25 Ramp-down T t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP )