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ML485 ML485-PCB J-STD-020 2002/95/EC JESD22-A114 /500V JESD22-C101 - Datasheet Archive
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Applications · · · · · PCS / 3G Base station
ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Applications · · · · · PCS / 3G Base station / Repeaters WCDMA / LTE WiMax / WiBro ISM / Fixed Wireless HPA Feedback Paths Product Features · · · · · · · · · Functional Block Diagram High Dynamic Range Mixer with Integrated LO Driver +35 dBm Input IP3 8 dB Conversion Loss RF: 1500 3200 MHz LO: 1400 3500 MHz IF: 50 300 MHz +5V Supply @ 40 mA 0 dBm Drive Level RoHS-compliant MSOP8 (14 mm2) General Description Pin Configuration The ML485 ML485 high linearity converter combines a passive GaAsFET mixer with an integrated LO driver in an ultrasmall lead-free/green/RoHS-compliant MSOP-8 package. The double-balanced integrated IC is able to operate across a wide 1.5-3.2 GHz frequency range to achieve +35 dBm Input IP3 while drawing a very low 40mA current. The ML485 ML485 can be used as an up-converter or downconverter in a low-side or high-side LO configuration. Pin # 1 2, 3, 6, 7 4 5 8 Backside Paddle A LO buffer amplifier is integrated on the chip to allow for operation directly from a synthesizer requiring only 0 dBm of LO drive level. The dual-stage LO driver provides a stable input power level into the mixer to allow for consistent performance over a wide range of LO power levels. The converter requires no external baluns and supports a wide range of IF frequencies. Typical applications include frequency up/down conversion, modulation and demodulation for receivers and transmitters used in 2.5G and 3G mobile infrastructure. Due to the wide frequency range of operation, the converter can also be used for WiMAX, WiBro, ISM, LTE and fixed wireless applications Symbol LO GND Vcc IF RF GND Ordering Information Part No. ML485 ML485 ML485-PCB ML485-PCB Description 1.5-3.2 GHz Mixer w/ Integrated LO Amp Fully Assembled Evaluation Board Standard T/R size = 1000 pieces on a 7" reel. Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. - 1 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Specifications Recommended Operating Conditions Absolute Maximum Ratings Parameter Rating Parameter Storage Temperature DC Voltage Input IF / RF Power, CW, +25C LO Power +27 dBm +10 dBm Min Typ Max Vcc TJ (for >106 hours MTTF) Operational Temperature -65 to +150 o C +7 V +4.75 +5 +5.25 150 +85 -40 Unit V C o C o Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: Vcc+5V, Temp=+25ºC,. (see note 1) Parameter Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit s RF Freq Range 1700-1800 1800-2200 2300-2400 2500-2700 LO Freq Range 1400-1750 1500-2150 2000-2350 2200-2650 MHz IF Freq Range 50-300 50-300 50-300 50-300 MHz 9.4 8.7 8.5 9 dB +37 +36 dBm SSB Conversion Loss Input IP3 (see note 2) +28 +34 +30 10 +35 MHz LO Leakage RF Port -5 -2 -1 -1 dBm LO Leakage IF Port -11 -18 -25 -15 dBm RFIF Isolation 13 16 14 11 dB RF Return Loss 13 13 15 16 dB IF Return Loss 14 14 14 14 dB LO Return Loss 10 10 12 13 dB Input P1dB 20 20 19.5 19.5 dBm LO Drive Level -2 Parameter 0 +4 -2 0 +4 Min Typ Max Unit Supply Voltage +5 40 0 +4 -2 0 +4 dBm V Supply Current -2 mA Thermal Resistance (see note 3) 84 o C/W Notes: 1. Specifications are shown with 0dBm LO drive and IF = 200 MHz in a down converting configuration with a low-side LO. 2. IIP3 is measured with f = 1 MHz with RFin = 0 dBm / tone. 3. Thermal resistance is specified junction to case, jc Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. - 2 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Typical Performance Plots Conversion Loss vs. RF Freq. vs. IF Freq. Input IP3 vs. RF Freq. vs. IF Freq. +25 C, LO = 0 dBm, low-side LO LO = 0 dBm, low-side LO, 25C 40 38 11 IF = 51 MHz IF= 151 MHz IF= 201 MHz IF= 301 MHz 10 Input IP3 (dBm) Conversion Loss (dB) 12 9 8 7 36 34 32 IF = 51 MHZ IF = 151 MHz IF = 201 MHz IF = 301 MHz 30 28 6 26 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 RF Frequency (GHz) 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) L-R Isolation vs. LO Freq. vs.Temperature L-I Isolation vs. LO Freq. vs. Temperature Referenced with LO = 0 dBm 3.3 35 5 30 4 L-I Isolation (dB) +85 °C +25 °C - 40 °C 3 2 1 25 +85 °C +25 °C - 40 °C 20 15 10 0 5 1.5 1.7 1.9 2.1 2.3 2.5 2.7 LO Frequency (GHz) 2.9 3.1 3.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 LO Frequency (GHz) 2.9 R-I Isolation vs. LO Freq. vs. Temperature 3.1 3.3 3.1 3.3 Input P1dB vs. RF Frequency Referenced with LO = 0 dBm +25 C, IF=201 MHz, Low-side LO at 0 dBm 22 19 21 Input P1dB (dBm) 22 R-I Isolation (dB) 3.1 Referenced with LO = 0 dBm 6 L-R Isolation (dB) 2.9 16 +85 °C +25 °C - 40 °C 13 10 20 19 18 17 7 16 4 1.5 1.7 1.9 2.1 2.3 2.5 2.7 LO Frequency (GHz) Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. 2.9 3.1 3.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 RF Frequency (GHz) - 3 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Conversion Loss vs. RF Freq. vs. Temperature Conversion Loss vs. RF Freq. vs. LO Power LO = 0 dB, IF = 51 MHz, low-side LO 12 11 11 Conversion Loss (dB) Conversion Loss (dB) +25 C, IF = 51 MHz, low-side LO 12 10 9 8 +85 °C +25 °C - 40 °C 7 6 5 10 9 8 7 LO = 4 dBm LO = 0 dBm LO = -2 dBm 6 5 4 4 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 1.5 3.3 2.1 2.3 2.5 2.7 2.9 3.1 3.3 Conversion Loss vs. RF Freq. vs. LO Power LO = 0 dB, IF = 201 MHz, low-side LO +25 C, IF = 201 MHz, low-side LO 12 11 11 Conversion Loss (dB) Conversion Loss (dB) 1.9 RF Frequency (GHz) Conversion Loss vs. RF Freq. vs. Temperature 12 10 9 8 +85 °C +25 °C - 40 °C 7 6 5 10 9 8 7 LO = 4 dBm LO = 0 dBm LO = -2 dBm 6 5 4 4 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 3.3 1.5 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 3.3 +25 C, IF = 301 MHz, low-side LO LO = 0 dB, IF = 301 MHz, low-side LO 12 1.7 Conversion Loss vs. RF Freq. vs. LO Power Conversion Loss vs. RF Freq. vs. Temperature 12 11 11 Conversion Loss (dB) Conversion Loss (dB) 1.7 10 9 8 +85 °C +25 °C - 40 °C 7 6 5 10 9 8 7 LO = 4 dBm LO = 0 dBm LO = -2 dBm 6 5 4 4 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. 2.9 3.1 3.3 - 4 of 9 - 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 3.3 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Input IP3 vs. RF Freq. vs. Temperature Input IP3 vs. RF Frequency vs. LO Power LO = 0 dBm, IF = 51 MHz, low-side LO +25 C, IF = 51 MHz, low-side LO 40 38 38 +85 °C +25 °C - 40 °C 36 Input IP3 (dBm) Input IP3 (dBm) 40 34 32 30 28 LO = 4 dBm LO = 0 dBm LO = -2 dBm 36 34 32 30 28 26 26 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 1.5 3.3 1.7 1.9 2.5 2.7 2.9 3.1 3.3 Input IP3 vs. RF Frequency vs. LO Power +25 C, IF = 201 MHz, low-side LO LO = 0 dBm, IF = 201 MHz, low-side LO 40 38 38 36 36 Input IP3 (dBm) 40 Input IP3 (dBm) 2.3 RF Frequency (GHz) Input IP3 vs. RF Freq. vs. Temperature 34 32 +85 °C +25 °C - 40 °C 30 LO = 4 dBm LO = 0 dBm LO = -2 dBm 34 32 30 28 28 26 26 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) 2.9 3.1 3.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 RF Frequency (GHz) Input IP3 vs. RF Freq. vs. Temperature Input IP3 vs. RF Frequency vs. LO Power LO = 0 dBm, IF = 301 MHz, low-side LO +25 C, IF = 301 MHz, low-side LO 40 40 38 38 +85 °C +25 °C - 40 °C 36 Input IP3 (dBm) Input IP3 (dBm) 2.1 34 32 30 LO = 4 dBm LO = 0 dBm LO = -2 dBm 36 34 32 30 28 28 26 26 1.5 1.7 1.9 2.1 2.3 2.5 2.7 RF Frequency (GHz) Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. 2.9 3.1 3.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 RF Frequency (GHz) - 5 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp RF Return Loss vs. RF Frequency IF Return Loss vs. IF Frequency +25 C, LO = 0 dBm +25 C, LO = 0 dBm 0 -5 IF Return Loss (dB) RF Return Loss (dB) 0 -10 -15 -20 IF = 51 MHz IF = 201 MHz IF = 301 MHz -25 -30 1600 -5 -10 -15 IF = 1550 MHz IF = 1650 MHz IF = 1750 MHz -20 IF = 1850 MHz IF = 1950 MHz IF = 2050 MHz -25 1800 2000 2200 2400 2600 2800 3000 50 100 RF Frequency (MHz) 150 200 250 300 IF Frequency (MHz) LO Return Loss vs. LO Frequency +25 C, LO = 0 dBm LO Return Loss (dB) 0 -5 -10 -15 -20 -25 1600 1800 2000 2200 2400 2600 2800 3000 3200 LO Frequency (MHz) Spur Table Spur tables is N × fRF M × fLO mixer spurious products for 0 dBm input power, unless otherwise noted. RF Frequency = 1842 MHz, LO Frequency = 1642 MHz, All values in dBc relative to the IF Power Level. M M N 0 0 1 2 3 4 5 1 2 22 35 18 85 3 0 30 23 47 35 47 81 39 51 57 70 87 80 94 72 78 81 95 93 91 93 88 88 95 95 95 92 95 95 Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. 2 - 6 of 9 - 3 4 5 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Down Conversion Applications Circuit: ML485-PCB ML485-PCB Pin Description Pin 1 Symbol Description LO Local Oscillator Injection. Internally DC Blocked 2, 3, 6, 7 GND RF/DC Ground 4 Vcc Supply voltage. An external bypass capacitor should be used near this pin. 5 IF Intermediate Frequency 8 RF Radio Frequency RF/DC Ground. Follow recommended via pattern and ensure good solder attach for best thermal and electrical performance. Backside Paddle GND Applications Information PC Board Layout Circuit Board Material: .014" FR-4, 4 layers (other layers added for rigidity), .062" total thickness, 1 oz copper Microstrip line details: width = .026", spacing = .025" The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, Refer to Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. - 7 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Mechanical Information Package Information and Dimensions This package is lead-free/green/RoHS-compliant. The plating material on the leads is 100 Percent Matte-Tin. It is compatible with both lead-free (maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes. M42 The ML485 ML485 will be marked with an "M42" designator with a lot code marked below the part designator. "Y" represents the last digit of the year the part was manufactured. "XX" is an auto-generated number. Mounting Configuration All dimensions are in millimeters (inches). Angles are in degrees. Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. - 8 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® ML485 ML485 1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp Product Compliance Information ESD Information Solderability Compatible with the latest version of J-STD-020 J-STD-020, Lead free solder, 260° ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: This part is compliant with EU 2002/95/EC 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). Class 0 Passes/ 200 V to < 250 V Human Body Model (HBM) JEDEC Standard JESD22-A114 JESD22-A114 Class IV Passes /500V /500V Charged Device Model (CDM) JEDEC Standard JESD22-C101 JESD22-C101 This product also has the following attributes: · Lead Free · Halogen Free (Chlorine, Bromine) · Antimony Free · TBBP-A (C15H12Br402) Free · PFOS Free · SVHC Free MSL Rating Level 2 at +260 °C convection reflow JEDEC Standard J-STD-020 J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@tqs.com Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev B 09/21/10 © 2010 TriQuint Semiconductor, Inc. - 9 of 9 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network®