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Part Manufacturer Description Datasheet BUY
LTC1093MILDWF#PBF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1297J8 Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, CDIP8, HERMETIC SEALED, CERDIP-8, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594LS16#TR Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594LS16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1093MILDWF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594S16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices

MIL-STD-202 METHOD 208

Catalog Datasheet MFG & Type PDF Document Tags

MIL-STD-202 METHOD 208

Abstract: E54214 MIL-STD-202 Method 208 Glass Passivated C hip Junctions Plastic Package has U nderw riters Laboratory , are Solderable to MIL-STD-202 Method 208 Plastic Package has U nderw riters Laboratory Flam m ability , to MIL-STD-202 Method 208 Plastic Package has U nderw riters Laboratory Flam m ability C , are Solderable to M IL-STD-202 Method 208 Plastic Package has U nderw riters Laboratory Flam m
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E54214 MIL-STD-202 METHOD 208 B250C800 B250C800M 94v0 circuit board B 50 bridge rectifier DF005M RDF005M DF10M RDF08M B40C80DM B380C800DM
Abstract: Material Specifications: * ASTM-B33, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, Conflict Mineral Free Compliant Packaging: - Bulk in Bag Contact factory Vestal Electronic Devices
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MIL-STD-202 METHOD 208

Abstract: , RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, Conflict
Vestal Electronic Devices
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EIA-296

MIL-STD-202 METHOD 208

Abstract: MIL-F-15733 Hrs. INSERTION LOSS 1.0% AQL 100% 100% SOLDERABILITY None MIL-STD-202 Method 208 5 Samples MIL-STD-202 Method 208 5 Samples 46 AVX , Cap, Volt. Drop, Insertion Loss -3% max combined Total 10% max X-RAY None MIL-STD-202 Method 209 MIL-STD-202 Method 209 LEAK TEST Condition "A" Gross Leak Condition "A" Gross
AVX
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MIL-F-15733 MIL-F-28861 2200-10K clar C-123 MIL-C-123 MIL-STD-105
Abstract: * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, Conflict Mineral Free Compliant Packaging: - Spool (10lbs and 50lbs Vestal Electronic Devices
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Abstract: : * ASTM-B33, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C Vestal Electronic Devices
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BR100-XX-L BR200-XX-L BR200-XX-EL EIA-468

3 Pin Screw Terminal Block Connector 5mm Pitch

Abstract: thomas and betts header connector SOLDERABILITY: MIL-STD-202, Method 208 Mechanical: PITCH (TERMINAL SPACING): 5mm RECOMMENDED PCB HOLE DIA . , , zinc plated SOLDER PIN : Brass, tin/lead plated SOLDERABILITY: MIL-STD-202, Method 208 Mechanical , PIN : Brass, tin/lead plated SOLDERABILITY: MIL-STD-202, method 208 Mechanical: PITCH (TERMINAL
Thomas & Betts
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3 Pin Screw Terminal Block Connector 5mm Pitch thomas and betts header connector UL94V-0 5MDV-07-P 5MDV-08-P 5MDV-09-P 5MDV-10-P 5MDV-11-P

EIA-468

Abstract: , RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, Conflict
Vestal Electronic Devices
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Abstract: Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208, MIL-STD-1276 Type C, Conflict Mineral Free Compliant Vestal Electronic Devices
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EIA-481

MIL-STD-202 METHOD 208

Abstract: BAT46 Spice Model: BAT46 BAT46 SCHOTTKY BARRIER DIODE Features · · · · High Reverse Breakdown Voltage Low Turn-On Voltage Guard Ring Construction for Transient Protection Lead Free Finish, RoHS Compliant (Note 3) A B A Mechanical Data · · · · · · · · Case: DO-35 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Leads: Solderable per MIL-STD-202, Method 208 Terminals: Finish ¾ Matte Tin. Solderable per MIL-STD-202, Method 208
Diodes
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DS11002 BAT46-A BAT46-T 10K/A 10K/T
Abstract: may not meet MIL-STD-202, Method 208. 1.50 (.059") MAX PACKAGING SPECIFICATIONS: 24mm Tape and , lead is non-plated zinc. Non-plated zinc terminal faces may not meet MIL-STD-202, method 208. To Littelfuse
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E71611 60VDC EIA-RS481

MIL-STD-202 METHOD 208

Abstract: LF 5A 250 volt fuse . Non-plated terminal surfaces may not meet MIL-STD-202, Method 208. 10 1 ELECTRICAL CHARACTERISTICS , terminal faces may not meet MIL-STD-202, method 208. To ensure that the fuse is acceptable for the
Littelfuse
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LF 5A 250 volt fuse L 0446 277 volt fuse LF fuse

MIL-STD-202 METHOD 208

Abstract: IEC68-2-20 Conforms to requirements MIL-STD-202 Method 208 without Steam Ageing IEC-68-2-20; 235°C, 2s Conforms to requirements MIL-STD-202 Method 208 Notice 8 (Steam Ageing) IEC-68-2-20; 235°C, 2s GLASS COATED ON ALL 4 MAJOR
Mallory Capacitor
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IEC68-2-20 IEC-682-20 MPVI81

MIL-C-3098

Abstract: CR-157 resistance Per Mil-Std-202 Method 208 Per Mil-Std-202 Method 208 Per Mil-Std-202 Method 107 Test Condition B Per Mil-Std-202 Method 112 Test Condition C +105°c ± 3°c for 168 hours ( ±5ppm Max change) Per Mil-Std-202 Method 211 Test Condition A Package # HT/T0-5 Package # CRY-15 ( HC-49U Res Weld or , customer request Per Mil-Std-202 Method 305 Specified per CR # or customer request Specified per CR # or
Precision Devices
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CR-64A/U CR-60A/U CR-124A/U SM-C-413570 MIL-C-3098 CR-157 34140 transistor CR HC49U/N-R1.8432MHZT CR-10/U CR-157/U CR-76A/U
Abstract: . Non-plated terminal surfaces may not meet MIL-STD-202, Method 208. PACKAGING SPECIFICATIONS: 24mm Tape and , may not meet MIL-STD-202, method 208. To ensure that the fuse is acceptable for the application -
OCR Scan

MIL-STD-202 METHOD 208

Abstract: LF 5A 250 volt fuse surfaces may not meet MIL-STD-202, Method 208. PACKAGING SPECIFICATIONS: 24mm Tape and Reel per EIA-RS481 , lead is non-plated zinc. Non-plated zinc terminal faces may not meet MIL-STD-202, method 208. To ensure
Littelfuse
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RG02-20E

Abstract: GP02 Length at5lbs. 2.25kg Tension Tin Plated Axial Leads, Solderable p e r MIL-STD-202 Method 208 I , Axial Leads, Solderable per MIL-STD-202 Method 208 High Temperature Soldering Guaranteed 350 °C/10 , Leads, Solderable per MIL-STD-202 Method 208 High Temperature Soldering Guaranteed: 350°C/10 Second/,375
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GP25M 1NS399GP RG02-20E GP02 D0404AL 1N361 1N3614GP 1N4007GP 1N4245PG 1N4249GP 5059GP
Abstract: -020A Polarity: Cathode Band Leads: Solderable per MIL-STD-202, Method 208 Terminals: Matte Tin Finish, Solderable per MIL-STD-202, Method 208 (Note 4 on Page 2) Marking: Type Code and Cathode Band Type Code: SE · , Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Power Diodes
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B0530WS J-STD-020A DS30249 3000/T B0530WS-7 B0530WS-7-F
Abstract: MIL-STD-202, Method 208 · · 1.40 1.00 1.10 0.25 0.35 0.20 0.40 0.10 0.15 , (approximate) C Terminals: Solderable per MIL-STD-202, Method 208 (Note 5 on Page 2) E J 0.05 , 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Pd 235 mW RqJA 426 Diodes
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AEC-Q101

MIL-C-81

Abstract: : -5 5 °C to +125°C Vibration: 15 g, 10-2000 Hz, MIL-STD-202, Method 204, Condition B Shock: 100 g, 6 milliseconds, MIL-STD-202, Method 213, Condition I Moisture resistance: MIL-STD-202, Method 208 Resistant to soldering heat and flux: 235°C for 30 seconds Solderability: MIL-STD-202, Method 208
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MIL-C-81 R-360
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