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MIL-STD-1835

Catalog Datasheet MFG & Type PDF Document Tags

MIL-STD-1835

Abstract: D22 PACKAGE DIAGRAM Package Diagram Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 22­Lead (400­Mil) CerDIP D8 MIL-STD-1835 D -7 , MIL-STD-1835 D-3 Config. A 3 Package Diagram 24-Lead (300-Mil) CerDIP D14 MIL-STD-1835 D- 9 Config.A 28-Lead (600-Mil) CerDIP D16 MIL-STD-1835 D-10 Config .A 4 Package Diagram 40
Cypress Semiconductor
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D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram d 1835 D5011 D2 Package 300-M 600-M 900-M 400-M

sidebraze

Abstract: MIL-STD-1835 Package Diagrams Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagrams 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029 22-Lead (400-Mil) CerDIP MIL-STD-1835 D -7 Config. A 51-80034 2 Package Diagrams 22-Lead (300-Mil) CerDIP D10 51-80030 24-Lead (600-Mil) CerDIP D12 MIL-STD-1835 D-3 Config. A 51-80038 3 Package Diagrams
Cypress Semiconductor
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sidebraze

MIL-STD-1835

Abstract: 80041 Package Diagram Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029 22-Lead (400-Mil) CerDIP MIL-STD-1835 D -7 Config. A 51-80034 2 Package Diagram 22-Lead (300-Mil) CerDIP D10 51-80030 24-Lead (600-Mil) CerDIP D12 MIL-STD-1835 D-3 Config. A 51-80038 3 Package Diagram
Cypress Semiconductor
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80041 cerdip D16 PACKAGE DIAGRAM 32-Lead 28LEAD 900-MIL

MIL-STD-1835

Abstract: CERAMIC LEADLESS CHIP CARRIER Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram 22 , 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 C-12 5 Package Diagram 24-Square Leadless Chip Carrier L63 28-Square Leadless Chip Carrier L64 MIL-STD-1835 C-4 6 Package Diagram 44-Square Leadless Chip Carrier L67
Cypress Semiconductor
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CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 L64 PACKAGE DIAGRAM 7c79

leadless chip carrier

Abstract: MIL-STD-1835 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 51-80064 22 , Carrier L53 51-80066 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 51-80067 4 Package Diagram 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 C-12 51-80068 , Carrier L63 51-80050 6 Package Diagram 28-Square Leadless Chip Carrier L64 MIL-STD-1835 C
Cypress Semiconductor
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L55 PACKAGE DIAGRAM diagram L51 transistor

transistor k70

Abstract: MIL-STD-1835 Package Diagram Cerpacks 24-Lead Square Cerpack K63 16-Lead Rectangular Cerpack K69 MIL-STD-1835 F- 5 Config. A 1 Package Diagram 18-Lead Rectangular Cerpack K70 MIL-STD-1835 F- 10 Config. A 20-Lead Rectangular Cerpack K71 MIL-STD-1835 F- 9 Config. A 2 Package Diagram 24-Lead Rectangular Cerpack K73 MIL-STD-1835 F-6 Config. A 28-Lead Rectangular Cerpack K74 MIL-STD-1835 F-11 Config. A 3 Package Diagram 32-Lead Rectangular Cerpack K75 28-Lead Rectangular Cerpack K80
Cypress Semiconductor
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transistor k70 K73 Package K70 Package K63 Package diode k70 K69 Package

44 Lead Ceramic Leadless Chip Carrier

Abstract: leadless chip carrier 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C , -Pin Rectangular Leadless Chip Carrier L53 51-80066 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 51-80067 4 Package Diagrams 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 , MIL-STD-1835 C-4 51-80051 7 Package Diagrams 44-Square Leadless Chip Carrier L67 MIL-STD-1835
Cypress Semiconductor
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44 Lead Ceramic Leadless Chip Carrier

MIL-STD-1835

Abstract: transistor k70 Package Diagram Cerpacks 24-Lead Square Cerpack K63 51-80056 16-Lead Rectangular Cerpack K69 MIL-STD-1835 F- 5 Config. A 51-80057 1 Package Diagram 18-Lead Rectangular Cerpack K70 MIL-STD-1835 F- 10 Config. A 51-80058 20-Lead Rectangular Cerpack K71 MIL-STD-1835 F- 9 Config. A 51-80059 2 Package Diagram 24-Lead Rectangular Cerpack K73 MIL-STD-1835 F-6 Config. A 51-80060 28-Lead Rectangular Cerpack K74 MIL-STD-1835 F-11 Config. A 51-80061 3 Package Diagram
Cypress Semiconductor
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11F11 80059 80061 K804 11F-11 CERPACK K73

CERAMIC LEADLESS CHIP CARRIER LCC 68

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 ) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-9 CONFIG A 40DW6, 40 , (Millimeters) MIL-STD-1835 D-5 CONFIG A 10-5 20J, 20 Lead, Plastic J-Leaded Chip Carrier (PLCC , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 C-J1 MIL-STD-1835 C-J2 JEDEC OUTLINE MO-087 AD , ) Dimensions in Inches and (Millimeters)* MIL-STD-1835 C-4 *Ceramic lid standard unless specified. 28LW , )* MIL-STD-1835 C-4 *Ceramic lid standard unless specified. 44LW, 44 Pad, Windowed, Ceramic Leadless
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CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC J-Lead, plcc 24DW3

MIL-STD-1835

Abstract: D-10 Package Diagrams Ceramic Windowed Dual-In-Line Packages 20-Lead (300-Mil) Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagrams 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A 28-Lead (600-Mil) Windowed CerDIP W16 MIL-STD-1835 D-10 Config. A 2 Package Diagrams 40-Lead (600-Mil) Windowed , 28-Lead (300-Mil) Windowed CerDIP W22 MIL-STD-1835 D-15 Config. A 51-80087 32-Lead (300
Cypress Semiconductor
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D-10 1835

w32 transistor

Abstract: W32 Package Package Diagram Ceramic Windowed Dual-In-Line Packages 20-Lead (300-Mil) Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagram 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A 28-Lead (600-Mil) Windowed CerDIP W16 MIL-STD-1835 D-10 Config. A 2 Package Diagram 40-Lead (600-Mil) Windowed , -Mil) Windowed CerDIP W22 MIL-STD-1835 D-15 Config. A 32-Lead (300-Mil) Windowed CerDIP W32 4 Package
Cypress Semiconductor
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w32 transistor W32 Package transistor w16 W6 Diode 600MIL CERDIP Package

CMGA3-P68

Abstract: CDFP4-F28 LOGIC Devices/MIL-STD-1835 Package Code Cross-Reference LOGIC DEVICES PACKAGE CODE DESCRIPTION MIL-STD-1835 PACKAGE DESIGNATOR MIL-STD-1835 DIMENSION REFERENCE GDIP3-T24 GDIP1-T20 D-9 D-8 CERAMIC DIP C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 24-pin, 0.3" wide 20-pin, 0.3" wide 22 , Information 4 LOGIC Devices/MIL-STD-1835 Package Code Cross-Reference LOGIC DEVICES PACKAGE CODE DESCRIPTION MIL-STD-1835 PACKAGE DESIGNATOR MIL-STD-1835 DIMENSION REFERENCE CQCC1-N28 CQCC1-N44
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CDIP1-T64 CDIP3-T28 CDFP4-F24 CDFP4-F28 CMGA3-P68 CMGA15-P84 CQCC1-N20 GDIP1-T24 GDIP4-T28 GDIP1-T28 GDIP1-T16 GDIP1-T18

CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL­STD­1835 C­12 2 Package Diagram 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­1835 C­2A 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­1835 C­4 3 Package Diagram 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­1835 C­5 4 Cypress Semiconductor
Cypress Semiconductor
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28-pin Q1 Package SFE10.7MS2G-A

CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier Q55 MIL­STD­1835 C­12 2 Package Diagram 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­1835 C­2A 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­1835 C­4 3 Package Diagram 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­1835 C­5 4 Cypress Semiconductor
Cypress Semiconductor
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51-85053-B 51-85054-B 51-85055-B

MO-142

Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC , Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C MIL-STD-1835 D-10 CONFIG A 1.49(37.9) 1.44(36.6) PIN 1 .610(15.5) .510(13.0) .098(2.49) MAX , (Millimeters) MIL-STD-1835 D-16 CONFIG A MIL-STD-1835 D-16 CONFIG A 1.68(42.7) 1.64(41.7) PIN 1 , (Flatpack) Dimensions in Inches and (Millimeters) MIL-STD-1835 F-12 CONFIG B PIN #1 ID .370(9.40 , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 F-18 CONFIG B JEDEC OUTLINE MO-115 PIN #1 ID .370
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MO-142 JEDEC MO-229 atmel 3302 tsop 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC dd 127 dd 127 d 32DW6 42DW6

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A 1.28(32.5) 1.24(31.5) PIN , ) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-5 CONFIG B 20J, 20 Lead, Plastic J-Leaded Chip Carrier , Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD-1835 C-J1 , , Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)* MIL-STD-1835 C-4 MIL-STD-1835 C-4 *Ceramic lid standard unless specified. *Ceramic lid standard unless specified
Atmel
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CERAMIC LEADLESS CHIP CARRIER LCC 124 20P3 TQFP 144 PACKAGE DIMENSION

leadless chip carrier

Abstract: Q61 Package -Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL­STD­1835 C­12 51-80103 3 Package Diagrams 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­1835 C­2A 51-80101 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­1835 C­4 51-80102 4 Package Diagrams 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­1835 C­5 51-80104 5 Cypress Semiconductor
Cypress Semiconductor
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Q61 Package

MIL-STD-1835

Abstract: leadless chip carrier -Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL-STD-1835 C-12 51-80103-*A 3 Package Diagrams 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­1835 C­2A 51-80101 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­1835 C­4 51-80102 4 Package Diagrams 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­1835 C­5 51-80104 5 Cypress Semiconductor
Cypress Semiconductor
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0555B

Abstract: footprint jedec MS-026 TQFP AEB and (Millimeters) JEDEC STANDARD MS-026 BFB MIL-STD-1835 D-16 CONFIG C 22.25(0.876) 21.75 , Array Package (LAP) Dimensions in Millimeters and (Inches)* MIL-STD-1835 D-5 CONFIG C SIDE VIEW , ) MIL-STD-1835 D-2 CONFIG A 19.1 (.752) 18.9 (.744) .830(21.1) .770(19.6) 1.3 (.051) 1.0 (.039 , and (Millimeters) MIL-STD-1835 D-8 CONFIG A MIL-STD-1835 D-9 CONFIG A .985(25.0) .935(23.7 , and (Millimeters) MIL-STD-1835 D-3 CONFIG A MIL-STD-1835 D-10 CONFIG A 1.29(32.8) 1.24(31.5
Atmel
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0555B footprint jedec MS-026 TQFP AEB jedec mo-142 footprint footprint jedec MS-026 TQFP 128 TSOP 1238 20D3 100-L 144-L

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: JEDEC TSSOP 28 LEAD PACKAGE , Non-Windowed Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D , Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-5 CONFIG B 20J, 20 Lead , Leadless Chip Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD-1835 , )* MIL-STD-1835 C-4 MIL-STD-1835 C-4 *Ceramic lid standard unless specified. *Ceramic lid standard , Inches and (Millimeters) MIL-STD-1835 C-5 JEDEC STANDARD MS-001 BA *Ceramic lid standard unless
Atmel
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JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132

atmel 0328

Abstract: jedec mo-142 footprint ) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C *Controlling dimension: millimeters 40B , (Millimeters) MIL-STD-1835 D-5 CONFIG C 6 Packages Packages Packaging Information 352B, 352 , , Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-2 CONFIG A , Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-8 CONFIG A .985 , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A 1.28(32.5) 1.24(31.5) PIN 1 PIN 1
Atmel
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atmel 0328 footprint jedec MS-026 LQFP 100RQ 47 16s 8p3 footprint jedec MS-026 TQFP 144 footprint jedec MS-026 LQFP 64 pin 120C1 0555H

footprint jedec MS-026 TQFP

Abstract: atmel 0328 Braze) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C 6 *Controlling dimension: millimeters MIL-STD-1835 D-5 CONFIG C Packages Packages Packaging Information 352B , Package (Cerdip) Dimensions in Inches and (Millimeters) 19.1 (.752) 18.9 (.744) MIL-STD-1835 D , and (Millimeters) MIL-STD-1835 D-8 CONFIG A MIL-STD-1835 D-9 CONFIG A .985(25.0) .935(23.7 , ) MIL-STD-1835 D-3 CONFIG A MIL-STD-1835 D-10 CONFIG A 1.29(32.8) 1.24(31.5) 1.49(37.9) 1.44(36.6
Atmel
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0555D footprint jedec MS-026 TQFP PQFP chip size ATMEL 740 MS-026-AED 8 lead side brazed ATMEL 342

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP (Side Braze) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C 6 40B, 40 , ) MIL-STD-1835 D-5 CONFIG C Packages Packages Packaging Information 352B, 352-ball Ball Grid Array , ) MIL-STD-1835 D-2 CONFIG A MIL-STD-1835 D-8 CONFIG A .830(21.1) .770(19.6) .985(25.0) .935(23.7 , and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-3 CONFIG A 1.29(32.8) 1.24(31.5 , and (Millimeters) MIL-STD-1835 D-10 CONFIG A MIL-STD-1835 D-16 CONFIG A 1.49(37.9) 1.44(36.6
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13-2L 28P6 48C1 JEDEC MS-026 footprint
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