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X9409WS24IZ-2.7 Intersil Corporation QUAD 10K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 64 POSITIONS, PDSO24, 300 MIL, ROHS COMPLIANT, PLASTIC, MS-013AD, SOIC-24 visit Intersil
X9409WS24I-2.7T1 Intersil Corporation QUAD 10K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 64 POSITIONS, PDSO24, 300 MIL, PLASTIC, MS-013AD, SOIC-24 visit Intersil
X9409WS24I-2.7 Intersil Corporation QUAD 10K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 64 POSITIONS, PDSO24, 300 MIL, PLASTIC, MS-013AD, SOIC-24 visit Intersil
X9409WS24IZ-2.7T1 Intersil Corporation QUAD 10K DIGITAL POTENTIOMETER, 2-WIRE SERIAL CONTROL INTERFACE, 64 POSITIONS, PDSO24, 300 MIL, ROHS COMPLIANT, PLASTIC, MS-013AD, SOIC-24 visit Intersil
CC2500_REFDES_062 Texas Instruments CC2500 reference design (62 mil layer spacing) visit Texas Instruments
5962-9760601Q9A Texas Instruments MILITARY DIGITAL SIGNAL PROCESSORS 0-XCEPT -55 to 125 visit Texas Instruments

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MIL-DTL-55302

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Polyphenylene Sulfide, Per MIL-DTL-55302 Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Contacts: Terminal: Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Contact Finish: Gold Plate per MIL-DTL-55302 Localized finish p er MIL-DTL-55302 , cycles MIL-DTL-55302 para. 4.5.9 Temperature Cycling 5 (1) hr cycles; -65° to +125°C , MS3197-22-Y1 (Superseded by SAE-AS31971) EIA364.37 & MIL-DTL-55302 .5 oz. Minimum with a .0295 -
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L-STD-202 MS3197-22-X1

HYPERTAC CONNECTORS

Abstract: MIL-DTL-55302 proof (no micro interruptions - test: 2ns). · Conforms to MIL-DTL-55302 general requirements. · For , Plating standard + tin dipping Plating standard Plating conforming to MIL-DTL-55302 + tin dipping Plating conforming to MIL-DTL-55302 TS T HS H D S C Connector type: BST*254M1* Length = No ways x 2.54mm. 1.27 , standard + tin dipping Plating standard Plating conforming to MIL-DTL-55302 + tin dipping Plating confoming to MIL-DTL-55302 TS T HS H Connector type: BST*254M2* Length = No ways x 2.54mm. 1.27 2.54
Hypertac Hypertronics
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HYPERTAC CONNECTORS 254M3

m55302

Abstract: M55302 specifications INCH-POUND MIL-DTL-55302/25F 3 December 2003 SUPERSEDING MIL-C-55302/25E 7 June 1993 DETAIL , product described herein shall consist of this specification sheet and MIL-DTL-55302. Style 1 (internal , FSC 5935 MIL-DTL-55302/25F Dash 1/ Number of numbers contacts Dimensions Type D E , . Connectors, receptacle, .075 (1.90 mm) spacing - Continued. 2 MIL-DTL-55302/25F FIGURE 1. Connectors, receptacle, .075 (1.90 mm) spacing - Continued. 3 MIL-DTL-55302/25F Inches .003 .004
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D5138 m55302 M55302 specifications MIL-C-55302 M55302/25-14 MIL-I-81969 M55302/25 MIL-DTL-55302/25F M55302/24- M55302/27- M55302/25- MIL-DTL-55302/23 MIL-DTL-55302/24

hgm ieh

Abstract: ., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Socket Contacts: Contact Wires: Gold per ASTM B488 Type II, Class 1.27, Code C over Nickel, 0.000050 min., per MIL-DTL-55302 over , , 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 or solder dip over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Support Elements: Nickel , factory) 5000 megaohms min. â'" EIA-364-21 & MIL-DTL-55302 (par. 4.5.8) 8 milliohms max, - EIA-364-06 &
IEH
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hgm ieh MIL-M-24519 GST-40F D5948 5052-H32 QQ-A-250/8 SAE-AMS-P-81728

M55302/23-03

Abstract: M55302 INCH-POUND MIL-DTL-55302/23H 3 December 2003 SUPERSEDING MIL-C-55302/23G 7 June 1993 DETAIL , for acquiring the product described herein shall consist of this specification sheet and MIL-DTL-55302 , N/A FSC 5935 MIL-DTL-55302/23H Dash 1/ Number of numbers contacts Dimensions A B , MIL-DTL-55302/23H FIGURE 1. Connectors, plug, .075 (1.90 mm) spacing - Continued. 3 MIL-DTL-55302 , mate with connectors specified in MIL-DTL-55302/24 and MIL-DTL-55302/25. 5. Minimum pad length on
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M55302/23-03 m55302/23-28 m55302/23-12 M55302/26 M55302 1.27 GLCP-30F MIL-DTL-55302/23H M55302/23- M55302/26- MIL-A-8625 MIL-DTL-55302/25 MIL-DTL-55302/26

SAE-AS31971

Abstract: EIA-364-27 Contacts: Contacts: Terminal: Contact Finish: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper Alloy per MIL-D TL-55302. .,N sN i L ftc f/l Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel per , MIL-DTL-55302 para. 4.5.9 #1003 (EIA364.32) Temperature Cycling 5 (1) hr cycles; -65° to +125°C , Engagement Low Force #2014 (EIA364.37) & MIL-DTL-55302 Contact Separation Low Force #2014 (EIA364
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EIA-364-27 B197 EIA-364-32 EIA-364-31 EIA-364-6 ASTM-A581 SAE-AMS-2700 ASTM-B196 SAE-AMS-QQ-N-290 MIL-STD-1285 MIL-STD-202

AMS 2418

Abstract: EIA-364-31 method iv , 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Gold per ASTM B488 Type II, Class 1.27, Code C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Gold per ASTM B488, Class 0.50, Grade C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 or solder dip over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper , supported-contact factory) 5000 megaohms min. ­ EIA-364-21 & MIL-DTL-55302 (par. 4.5.8) 5 milliohms max, - EIA
IEH
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AMS 2418 EIA-364-31 method iv ams YEAR DATE CODE RSE 2418 ASTM D 3150

AMS 2418

Abstract: EIA-364-31 method iv GST-40F Gold per ASTM B488 Type II, Class 1.27, Code C over Nickel, 0.000050 min., per MIL-DTL-55302 , , 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Termination: Gold per ASTM B488, Class 0.50, Grade C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 or solder dip over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM , MIL-DTL-55302 (par. 4.5.8) 5 milliohms max, - EIA-364-06 & MIL-DTL-55302 (par. 4.5.5) 750 VAC RMS @ sea
IEH
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ASTM b734 MIL-STD-55302 LOCTITE 454 astm standards EIA-364-28 B-197 SAE-AMS2700

SAE-AS31971

Abstract: EIA-364-37 : Terminal: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish p er MIL-DTL-55302. Stainless Steel per ASTM-A581 orA582. Passivated per SAE-AMS-2700 Contact , mating cycles MIL-DTL-55302 para. 4.5.9 #1003 (EIA364.32) Temperature Cycling 5 (1) hr cycles , ) #1002 (EIA364.31) Contact Engagement Low Force #2014 (EIA364.37) & MIL-DTL-55302 Contact
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EIA-364-37 MS3197 EIA-364 SAE-AMS-2700 type 6 ASTM-A-581 INCON MIL-STP-1344

EIA-364-37

Abstract: , Per MIL-DTL-55302. Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Co nta cts: Terminal: Be Cu per MIL-D TL-55302. Copper Alloy per MIL-DTL-55302. Contact Finish: Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Hardware: Stainless Steel per ASTM-A581 , Plated per MIL-DTL-55302 Gasket Silicone Rubber per A-A-59588. Tolerance: Decimals  , .21 Durability 500 connector mating cycles MIL-DTL-55302 para. 4.5.9 Temperature Cycling 5 (1) hr
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EIA-364-26

Abstract: -55302. Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel per ASTM-A581 orA582. Passivated per SAE-AMS-2700 Be Cu per ASTM-B196 orB197. Nickel Plated per MIL-DTL-55302 Silicone Rubber per , .21 Durability 500 connector mating cycles MIL-DTL-55302 para. 4.5.9 EIA364.32 Temperature Cycling 5 , with a .0245 dia pin per M S319 7-22-X1 (Superseded by SAE-AS31971) EIA364.37 < & MIL-DTL-55302
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EIA-364-26 L-DTL-55302

LOCTITE 234

Abstract: ASTM d 454 Type II, Class 1.27, Code C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 , MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Termination: Gold per ASTM B488, Class 0.50, Grade C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 or solder dip over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Support , continuous (higher ratings may be supported-contact factory) 5000 megaohms min. ­ EIA-364-21 & MIL-DTL-55302
IEH
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LOCTITE 234 ASTM d 454 ASTM loctite SAE-AMS-2418 EIA-364-20 J-STD-002

B197

Abstract: TC-240-NMH GST-40F Gold per ASTM B488 Type II, Class 1.27, Code C over Nickel, 0.000050 min., per MIL-DTL-55302 , , 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 Termination: Gold per ASTM B488, Class 0.50, Grade C over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM B734 or solder dip over Nickel, 0.000050 min., per MIL-DTL-55302 over Copper per SAE AMS 2418 or ASTM , MIL-DTL-55302 (par. 4.5.8) 5 milliohms max, - EIA-364-06 & MIL-DTL-55302 (par. 4.5.5) 750 VAC RMS @ sea
IEH
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TC-240-NMH LMR-240-FR TC-240-NMH-D TC-240-NMH-RA-D LOCTITE L 428 EZ-240-TM

MS3197

Abstract: EIA-364-37 Contacts: Contacts: Terminal: Contact Finish: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel per ASTM-A581 orA582. Passivated , connector mating cycles MIL-DTL-55302 para. 4.5.9 #1003 (EIA364.32) Temperature Cycling 5 (1) hr , ) #1002 (EIA364.31) Contact Engagement Low Force #2014 (EIA364.37) & MIL-DTL-55302 Contact
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22AWG MIL-STD-1344

EIA-364-26

Abstract: EIA364-26 Contacts: Contacts: Terminal: Contact Finish: Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302, Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel per ASTM-A581 or A582. Passivated per SAE-AMS-2700 Be Cu per ASTM-B196 orB197. Nickel Plated per MIL-DTL-55302 Silicone Rubber per Superseded by , VDC EIA364.21 , Durability 500 connector mating cycles MIL-DTL-55302 para. 4.5.9 EIA364
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EIA364-26 L-STD-1285 30IORQI

AMS 2418

Abstract: · CONTACT WIRES: BeCu IAW ASTM B197 · TERMINALS: Cu ALLOY IAW MIL-DTL-55302 · INSULATOR: GLASS FILLED , : Au IAW ASTM B4888 TYPE II, CLASS 1.27, CODE C, OVER Ni 0.000050 MIN. IAW MIL-DTL-55302, OVER Cu IAW , MIL-DTL-55302, OVER Cu IAW SAE AMS 2418 · HARDWARE: CRES - PASSIVATE; Cu ALLOY - Ni OVER Cu 3. PIN
IEH
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HMK080SEA3K97E452

SAE-AS31971

Abstract: Contacts: Contacts: Terminal: Contact Finish: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel per ASTM-A581 orA582. Passivated , MIL-DTL-55302 para. 4.5.9 #1003 (EIA364.32) Temperature Cycling 5 (1) hr cycles; - 650 to +125°C , Engagement Low Force #2014 (EIA364.37) & MIL-DTL-55302 Contact Separation Low Force #2014 (EIA364
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Abstract: Rectangular Connectors MCEM Series Metal Shell Edgeboard Connectors Metal Shell Edge Board Connectors I I I I I I Meets MIL-DTL-55302 performance requirements Layouts 128 and 184 , Capacity â'" No. 24 contact 3 amperes. Two hexagonal polarizing keys (per MIL-DTL-55302 slash sheet , qualified to MIL-DTL-55302. Configuration shown is per MIL-DTL-55302/120. 43 Catalog 1308638 Revised , italic are qualified to MIL-DTL-55302. Configuration shown is per MIL-DTL-55302/121. 5â'"25 AWG Tyco Electronics
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QQ-A591

2d 1002 6 pin

Abstract: EIA-364 : Socket Contacts: Contacts: Terminal: Contact Finish: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper Alloy per MIL-DTL-55302. Be Cu per MIL-DTL-55302. Copper Alloy per MIL-D TL-55302. Gold Plate per MIL-DTL-55302 Localized finish per MIL-DTL-55302. Stainless Steel perASTM-A581 or A582. Passivated , @ 500 VDC #3003 (EIA364.21) , Durability 500 connector mating cycles MIL-DTL-55302 para , Engagement Low Force #2014 (EIA364.37) & MIL-DTL-55302 Contact Separation Low Force #2014 (EIA364
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OCR Scan
2d 1002 6 pin

6 pin 2D 1002

Abstract: 2d 1002 6 pin : Terminal: Contact Finish: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Copper A lloy p e r MIL-D TL-55302. Be Cu p e r MIL-DTL-55302. Copper A lloy p e r MIL-DTL-55302. Gold Plate p e r MIL-DTL-55302 Localized finish p e r MIL-DTL-55302. Stainless Steel p e r ASTM-A581 orA 582. Passivated p , .20) Insulation Resistance #3003 (EIA364.21) Durability 500 connector m ating cycles MIL-DTL-55302
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6 pin 2D 1002 M55302-63 RH 2D 1002 F19-F20 IL-DTL-55302

S-311-P-822

Abstract: 311P822-MC-110-AS-D for proposals, form a part this specification to the extent specified herein: Military MIL-DTL-55302 , -002, Sect. C2, Tables 4A and 4B and MIL-DTL-55302 MIL-DTL-55302 MIL-DTL-55302 EIA-364-37 EIA-364-37 EIA-364-29 EIA-364-06 MIL-DTL-55302 EIA-364-20 EIA-364-21 EIA-364-13 EIA-364-20 EIA-364-09 EIA-364-28 EIA , 4.24 MIL-DTL-55302 EIA-364-13 EIA-364-23 EIA-364-65 EIA-364-28 Table II. Quality Conformance , EEE-INST-002, Sect. C2, Tables 4A and 4B, and MIL-DTL-55302 1/, 2/, 3/, 5/ Same as Visual EIA-364-20 EIA
Hypertac Hypertronics
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S-311-P-822 311P822-MC-110-AS-D 311P822-FC-110-AG-D 311P822-FC-110-AS-D 311P822-MC-110-AG-D 311P822-FC-110-BS-D ZK2000-002-25 ZK2000-002-27 ZK2000-002-29 ZK2000-002-31 ZK2000-002-33

hypertac connector insertion tools

Abstract: HYPERTAC CONTACT PIN a17 . 25 Special qualifications CHB connector qualified to MIL-DTL-55302 CHC connector qualified , : Without guide: 000 Contact finishing Plating standard (2) Plating conforming to MIL-DTL-55302 (2) Plating standard + tin dipping (3) Plating conforming to MIL-DTL-55302 + tin dipping (3 , finishing (2) Plating conforming to MIL-DTL-55302 H Connector marking Ref. TEL Ref. Hypertac , According to MIL-DTL-55302 . 100 000 reliable mating and unmating cycles . Reduces need for board
Hypertac
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hypertac connector insertion tools HYPERTAC CONTACT PIN a17 JN1123 Hypertac connector HYPERTAC PIN CHC144 MIL-C-39029
Abstract: 800-678-0141 â'¢ www.amphenol-aerospace.com 99 LRM (Line Replaceable Modules) Low Mating Force MIL-DTL-55302 , Brush Ruggedized 28 26 24 22 24 22 20 20 18 16 Low Mating Force MIL-DTL-55302 , (Line Replaceable Modules) Low Mating Force MIL-DTL-55302 LMD Modular Connectors LMD HOUSINGS - HOW , Low Mating Force MIL-DTL-55302 POLARIZING KEYWAY Standard Hybrids - Signal/Power/ Docking Conn , Speed High Density Low Mating Force MIL-DTL-55302 Docking Conn./ Hybrids - Signal/Power/ Standard Amphenol Aerospace
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VME64 LMS-01T-TL LMS-B1-01
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