NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 4835p rating : 260 A to 120°C MIL- H 5606 MIL-L 7808 MIL- L 7870A MIL-A 8243 MIL- L 23699 MIL-C 25769 ... | Original |
2 pages, |
M22520/23-01 aerospatiale 8243 mil 25769 c 7870A MIL-A-8243 FCI SOURIAU 8950-5883 NSA, ASN-E 7808 8950-6022 mil-c-25769 4835 "MIL H 5606" datasheet abstract |
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| Abstract: to MIL. L 38999 : MIL. L 7808 - MIL. L 23699 - MIL. H 5606 - MIL. A 8243 - MIL. L 25769 MIL. G 3056 - MIL. T 5624 (JP5) - hydraulic fluids - solvents to NFC 93422 : F 46, F 54, 0/180, H 515, H 542 , and fluid resistance Standards Mil C 38999 series II - QPL approved NFC 93422 HE 309 VG 96912 , spray to : MIL. STD 1344 method 1001 - 500 hours (plating B) - 48 hours (plating F-C) NFC 93422 - , green cadmium (MIL. C 38999) hard anodized - see table p 12 contact type P - male S - female ... | Original |
17 pages, |
M27488-20 8522-390A SN1891K 8599-0724 8976-730 vg 96912 MIL H 5606 8599 0730 M39029/57-354 MS27473T M39029/58-360 Souriau FCI M39029/58-363 8522-389A datasheet abstract |
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| Abstract: S±0.07 F±0.05 G±0.1 H±0.1 1 * Forced film material shall be polyamide + thermal hardened , No. B Unit: mm C D F G H W X 64 0.5 31.5 31.0 31.0 32.1 32.6 34.1 , ) Polyamide 1 mil 25 Cover adhesive 25 Surface treatment Tin-lead plating Copper foil Cu 5 1oz 35 Base adhesive Base film 25 Polyamide 1 mil 25 Reinforcement material adhesive Heat-hardened adhesive Stiffener 30 Polyamide 7 mil 175 Total 295 2. Using ... | Original |
8 pages, |
sn 0620 PCB stiffener pcb design 0,5 mm pitch FH12 8 pin zif connector 0.3mm FPC 0.5mm 30 pin fpc connector 12 pin zif connector 0.5mm FPC 0.5mm 40 pin fpc connector datasheet abstract |
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| Abstract: S±0.07 F±0.05 G±0.1 H±0.1 1 * Forced film material shall be polyamide + thermal hardened , No. B Unit: mm C D F G H W X 64 0.5 31.5 31.0 31.0 32.1 32.6 34.1 , ) Polyamide 1 mil 25 Cover adhesive 25 Surface treatment Tin-lead plating Copper foil Cu 5 1oz 35 Base adhesive Base film 25 Polyamide 1 mil 25 Reinforcement material adhesive Heat-hardened adhesive Stiffener 30 Polyamide 7 mil 175 Total 295 2. Using ... | Original |
8 pages, |
0.5mm 30 pin fpc connector datasheet FH12 8 pin zif connector 0.3mm FPC FPC CONNECTOR FPC CONNECTOR for thermal printer FUJIKURA LTD 32 PIN FPC CONNECTOR Senju 0.5mm pitch horizontal FH16H-50S-0.5SHW FH16M-96S-0.4SHW FPC cable datasheet abstract |
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| Abstract: _0.03 B±0.03 S±0.07 0.3±0.05 S±0.07 F±0.05 G±0.1 H±0.1 * Forced film material shall , No. B Unit: mm C D F G H W X 64 0.5 31.5 31.0 31.0 32.1 32.6 34.1 , Material Thickness (um) Polyamide 1 mil 25 Cover adhesive 25 Surface treatment Solder plating Copper foil Cu 5 1oz 35 Base adhesive Base film 25 Polyamide 1 mil 25 Reinforcement material adhesive Heat-hardened adhesive Stiffener 30 Polyamide 7 mil 175 Total ... | Original |
8 pages, |
0.5mm 20 pin fpc connector 0.5mm 30 pin ffc connector 30 pin flex cable lcd 32 PIN FPC CONNECTOR FH12 Fujikura LCD connector 16P 12 pin zif connector 0.5mm FPC 0.5mm pitch 6 pin flat flex cable 0.5mm 40 pin fpc connector SUMITOMO FFC 15 PIN SUMITOMO FFC 20 PIN 0.5 pitch datasheet abstract |
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| Abstract: 12±0.1 (1.7) (0.3) (5.1) (0.5) H±0.3 (L) (N) (0.85) (M) K±0.1 Ø1 .5 + , direction Unit: mm Part Number CL No. Number of Contacts H K L M N Q Part Number CL No. Number of Contacts H K L M N Q FH23-15S-0 FH23-15S-0.3SHW(51) 586-1317-0-51 15 , ) (0.5) H±0.3 J±0.1 (L) (M) (N) K±0.1 Ø1. 5 +0 0 .1 4±0.1 Flat surface , 586-1311-3-51 FH23-71S-0 FH23-71S-0.3SHW(51) H 586-1310-0-51 FH23-61S-0 FH23-61S-0.3SHAW(51) Number of Contacts ... | Original |
10 pages, |
senju solder paste FH23-39S-0.3SHW FH23-61S-0.3SHAW m 1305 Connector 0.3mm pitch Senju metal solder paste Senju SENJU 221CM5 FH23-61S-0.3SHW MIL H 5606 senju m705 solder paste datasheet abstract |
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| Abstract: 12±0.1 (1.7) (0.3) (5.1) (0.5) H±0.3 (L) (N) (0.85) (M) K±0.1 Ø1 .5 + , direction Unit: mm Part Number CL No. Number of Contacts H K L M N Q Part Number CL No. Number of Contacts H K L M N Q FH23-15S-0 FH23-15S-0.3SHW(51) 586-1317-0-51 16 , ) 1.7 +0.15 0 1.5 +0.1 0 (0.85) Unreeling direction (5.1) (0.5) H±0.3 J±0.1 (L , 21.3 44.5 586-1320-4-51 FH23-71S-0 FH23-71S-0.3SHAW(51) J 586-1311-3-51 FH23-71S-0 FH23-71S-0.3SHW(51) H ... | Original |
10 pages, |
senju m705 solder paste Senju M705 solder paste datasheet abstract |
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| Abstract: 1.75±0.1 12±0.1 (1.7) (0.3) (5.1) H±0.3 (L) (N) (0.85) (M) K±0.1 Ø1 .5 + , Number of Contacts H K L M N 07.3 05.1 04.5 07.9 05.7 05.1 21 09.1 , 0 1.5 +0.1 0 (0.85) Unreeling direction (5.1) (0.5) H±0.3 J±0.1 (L) (M , (2.45) Part Number CL No. FH23-61S-0 FH23-61S-0.3SHW H J K L M N 61 32 28.4 , Material Material Name Covering film layer. Polyamide Thickness (um) 25 1 mil thick. Cover ... | Original |
11 pages, |
FPC CONNECTOR Front lock datasheet abstract |
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| Abstract: H±0.1 1 * Forced film material shall be polyamide + thermal hardened additives. 2 Conductor width , : mm C D F G H W X 64 0.5 31.5 31.0 31.0 32.1 32.6 34.1 0.5 1.0 , ) Polyamide 1 mil 25 Cover adhesive 25 Surface treatment Tin-lead plating Copper foil Cu 5 1oz 35 Base adhesive Base film 25 Polyamide 1 mil 25 30 Reinforcement material adhesive Heat-hardened adhesive Polyamide 7 mil 175 Total Stiffener 295 2. Using ... | Original |
8 pages, |
senju solder bar Senju FH12 Connector 0.3mm pitch Connector 10 0.4mm pitch datasheet abstract |
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| Abstract: aluminum material · Equivalent MIL level qualification as 38999 Series III · Clinch nut tested: - , Cadmium olive drab (W): 2.5 h Nickel (F): 1 h Black zinc nickel (Z): 2.5 h Green zinc cobalt (ZC): 2.5 h 2 F: 48 Hrs ZC: 500 Hrs 4 3.8 3.5 F: -65°C +200°C ZC: -65°C +200°C Resistance , fluid: MIL-H-5606 (OTAN H51 5) . Synthetic hydraulic fluid: Skydrol 500 B4 · LD4 (SAE AS 1 241) . , receptacle (type 34) G E ± 0.30 2.3 Max. F ØK H C Max. A Max. Shell Size 9 1 1 1 3 ... | Original |
4 pages, |
skydrol 500-b4 MIL-A-8243 clinching nut MIL-L-7870A MIL-H-5606 hydraulic fluid skydrol mil-l-7808 m22x1 MIL H 5606 Mil-L-23699 D Material Data Sheet clinch nut mil-l-23699 skydrol ld4 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| 04* G04* G04 D10 : "Ellipse X5.0mil Y5.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0050* %ADD10C ADD10C ADD10C ADD10C, 0.0050*% G04 D11 : "Ellipse X10.0mil Y10.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD11C ADD11C ADD11C ADD11C, 0.0100*% G04 D12 : "Ellipse X2.0mil Y2.0mil H0.0mil 0 .0mil Y20.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0200* %ADD13C ADD13C ADD13C ADD13C, 0.0200*% G04 D14 : "Ellipse X25.0mil Y25.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0 www.datasheetarchive.com/download/23204762-885324ZC/p101d.zip (SLVP101D.TSK) |
Texas Instruments | 16/01/2000 | 279.54 Kb | ZIP | p101d.zip |
| 04* G04* G04 D10 : "Ellipse X5.0mil Y5.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0050* %ADD10C ADD10C ADD10C ADD10C, 0.0050*% G04 D11 : "Ellipse X10.0mil Y10.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD11C ADD11C ADD11C ADD11C, 0.0100*% G04 D12 : "Ellipse X2.0mil Y2.0mil H0.0mil 0 .0mil Y20.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0200* %ADD13C ADD13C ADD13C ADD13C, 0.0200*% G04 D14 : "Ellipse X25.0mil Y25.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0 www.datasheetarchive.com/download/85353708-877277ZC/p101d.zip (SLVP101D.TSK) |
Texas Instruments | 17/01/2000 | 279.54 Kb | ZIP | p101d.zip |
| UNCL-R1H Frequency Mixers LO Power Level 17 dBm Pin F G H J are given in Mini-Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL . UNCL-R1H Electrical Specifications UNCL-R1H www.datasheetarchive.com/files/mini-circuits/html2/uncl-r1h.htm |
Mini-Circuits | 18/02/2002 | 58.99 Kb | HTM | uncl-r1h.htm |
| F G H J -Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL .25 0.10 0.18 14.37 56.06 33 www.datasheetarchive.com/files/mini-circuits/html2/pdc-15-6-75.htm |
Mini-Circuits | 18/02/2002 | 56.79 Kb | HTM | pdc-15-6-75.htm |
| G H J .770 19 -Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL • Prices and .000 54.39 53.43 51.96 56.06 www.datasheetarchive.com/files/mini-circuits/html2/sra-4.htm |
Mini-Circuits | 18/02/2002 | 59.5 Kb | HTM | sra-4.htm |
| are given in Mini-Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL • Prices and Specifications subjects to change without notice F G H J .41 -33.94 -56.06 1.0 1463 www.datasheetarchive.com/files/mini-circuits/html2/ros-01500.htm |
Mini-Circuits | 18/02/2002 | 59.21 Kb | HTM | ros-01500.htm |
| G H J 2.25 57 -Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL • Prices and .000 54.39 53.43 51.96 56.06 www.datasheetarchive.com/files/mini-circuits/html2/zad-4.htm |
Mini-Circuits | 18/02/2002 | 60.92 Kb | HTM | zad-4.htm |
| -Circuits Guarantees Quality . Hi-Rel, MIL description are given in Hi-Rel and MIL F G H J .68 22.97 32.17 56.06 1060 www.datasheetarchive.com/files/mini-circuits/html2/zb8pd-22-75.htm |
Mini-Circuits | 18/02/2002 | 74.65 Kb | HTM | zb8pd-22-75.htm |
| NATIONAL 09/08/98 54F181FM-MIL JD54F181BLA JD54F181BLA JD54F181BLA JD54F181BLA NATIONAL 09/08/98 54F181FMQB 54F181FMQB 54F181FMQB 54F181FMQB. JD54F181BLA JD54F181BLA JD54F181BLA JD54F181BLA NATIONAL 09/08/98 54F182FM-MIL 54F182FMQB 54F182FMQB 54F182FMQB 54F182FMQB NATIONAL 09/08/98 54F . NATIONAL 09/08/98 54F192DM 54F192DM 54F192DM 54F192DM. 54F192DMQB 54F192DMQB 54F192DMQB 54F192DMQB. NATIONAL 09/08/98 54F194DM-MIL 54F 194LM-MIL 54F194LMQB 54F194LMQB 54F194LMQB 54F194LMQB. NATIONAL 09/08/98 54F240 54F240 54F240 54F240 MW8 40-MW854ABT2 40-MW854ABT2 40-MW854ABT2 40-MW854ABT2 NATIONAL 09/09/97 54F240DM-MIL 54ABT240J-QMLV 54ABT240J-QMLV 54ABT240J-QMLV 54ABT240J-QMLV NATIONAL 09/08/98 54F240DM-MLS 54F240DM-MLS 54F240DM-MLS 54F240DM-MLS 40J www.datasheetarchive.com/files/national/docs/wcd00041/wcd04182.txt |
National | 02/04/1998 | 347 Kb | TXT | wcd04182.txt |
| Engineer wade@eglin.af.mil (850)882-2337 carlos meindl minas s.a. manager meindl@adinet.com.uy 598 2 - ukjfo@micro.lucent.com +44 468 557436 Magazine Magazine Helmut Juchems Hardware-Engineer DATUS GmbH 10036 Alexs@swinyc.com 212 582 2345x553 Distribution . Siegfried Seliger Dipl. Ing. EPOS GmbH & Co Morrison Lane, Suite A Dallas, TX 75229-5606 wbrosche@xcicorp.com 972-481-9600 Magazine EE Times Comments Consultant ICL Hungary Kosarfono utca 6 X/39. BUDAPEST H-1191 piros@icl.hu +36-1-457-9573 Web http www.datasheetarchive.com/files/scenix/htdocs/logs2/mailing_log |
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