MG2270P Datasheet, Circuit, PDF, Cross Reference, & Application Note Results |
| Datasheet Search Results |
1 - 17 of about 17 for MG2270P |
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MG2270P |
Atmel Corporation |
Rad Tolerant 500K Used Gates 0.5 um CMOS Sea Of Gates |
66.91 Kb, 16 Pages. |
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MG2270P-BGA169 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-BGA352 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-DQFP100 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-DQFP128 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-PLCC28 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-PLCC84 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-PQFP304 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-PQFP44 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-SOP28 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-SOP8 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-SSOP16 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-SSOP64 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-TQFP100 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-TQFP32 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-VQFP208 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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MG2270P-VQFP44 |
Atmel Corporation |
Radiation Hardened 0.5 Micron Sea of Gate |
41.99 Kb, 13 Pages. |
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| Fulltext Datasheet Results |
1 - 10 of about 10 for MG2270P |
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First line: atmel 936 transistor SMD DK Full Range Matrices 270K Available Gates Drawn CMOS, Metal Layers, Gates DPRAM Compilers Library Optimized Synthesis, Floor Plan Automatic Test Generation (ATG) Volts Operation; Single Dual Supply Mode High Speed Performances: NAND2 Propagation Delay 4.5V, 2.7V Toggle Fre Abstract: .. MG2270P 270015 189000 360 377. Function. Maximum Size bits Bits/Word Typical Characteristics 16K bits at5V. Access Time ns Used cells. RAM 32K 1-36 12 20K. DPRAM 32K 1-36 14 23K. 3. MG2RTP. 4116H 4116H .. Tags: transistor SMD DK MG2RTP atmel 936 270015 TM1019 |
93.22 Kb |
15 Pages |
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First line: MG2RTP Radiation Hardened Micron Gates MG2RTP series micron, array based, CMOS product family. Several arrays 490k cells cover system integration needs. MG2RTP manufactured using SCMOS3/2RTP, micron drawn, metal layers CMOS process, "radiation tolerant" version SCMOS3/2. MG2RTP series base Abstract: .. MG2270P 270000 202200 360 377. MG2495P MG2495P 495000 371300 484 501. MG2RTP. 3. Rev. E – July 05, 2000. Libraries The MG2RTP cell library has been designed to take full advantage of the features offered by both .. Tags: atmel 711 809 CROSS REFERENCE MG2RTP MG1RT |
41.99 Kb |
13 Pages |
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First line: UART using VHDL Full Range Matrices 490k Cells Drawn CMOS, Metal Layers, Gates DPRAM Compilers Library Optimised Synthesis, Floor Plan Automatic Test Generation (ATG) volts operation: single dual supply mode High Speed Performances: max. NAND2 propagation Delay max. min. Toggle Frequency @4.5V, @2.7 Abstract: .. MG2270P 270000 202200 360 377. MG2495P MG2495P * 495000 371300 484 501. 3 MG2RTP. Rev. F–23-Aug-01 23-Aug-01 . Libraries. The MG2RTP cell library has been designed to take full advantage of the features offered by both .. Tags: UART using VHDL atmel 711 809 CROSS REFERENCE TM1019 |
66.92 Kb |
16 Pages |
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First line: Full Range Matrices 490K Cells Utilization Ratio Allows Considering Design Complexity 350K Gates Drawn CMOS, Metal Layers, Gates DPRAM Compilers Library Optimized Synthesis, Floor Plan Automatic Test Generation (ATG) Volts Operation: Single Dual Supply Mode High Speed Performances: Max. NAND2 Propag Abstract: .. MG2270P 270000 202200 360 377. MG2495P MG2495P 1 495000 371300 484 501. Function. Maximum Size bits Bits/Word Typical Characteristics 16K bits at5V. Access Time ns Used cells. RAM 36K 1-36 8 20K. DPRAM .. Tags: atmel 936 atmel 711 809 CROSS REFERENCE TM1019 |
406.37 Kb |
14 Pages |
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First line: REVISIONS DESCRIPTION appendix devices DATE (YR-MO-DA) 00-07-03 APPROVED Monica Poelking SHEET SHEET STATUS SHEETS PMIC Abstract: .. 05 MG2270P 270,000 gates available. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements .. Tags: SMD MARKING AS 13 BAR OUTLINE CASE X FOR MICROCIRCUIT marking code LA SMD G227* datasheet abstract.. |
1011.15 Kb |
54 Pages |
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First line: Full Range Matrices 270K Gates Drawn CMOS, Metal Layers, Gates DPRAM Compilers Library Optimized Synthesis, Floor Plan Automatic Test Generation (ATG) Volts Operation; Single Dual Supply Mode High Speed Performances: NAND2 Propagation Delay 4.5V, 2.7V Toggle Frequency 4.5V, 2.7V Programmable Availab Abstract: .. MG2270P 1 270015 189000 360 377. Function. Maximum Size bits Bits/Word Typical Characteristics 16K bits at5V. Access Time ns Used cells. RAM 32K 1-36 12 20K. DPRAM 32K 1-36 14 23K. 3. 4116M 4116M –AERO .. Tags: atmel 936 270015 datasheet abstract.. |
96.53 Kb |
14 Pages |
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First line: 00B03 marking code LA SMD REVISIONS DESCRIPTION appendix devices case outline Update boileplate. footnote 1.2.2. features requirements throughout- DATE (YR-MO-DA) 00-07-03 02-02-12 03-10-27 APPROVED Monica Poelking Thomas Hess Thomas Hess SHEET SHEET STATUS SHEETS PMIC Abstract: .. 05 MG2270P 270,000 gates available. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements .. Tags: 00B03 smd code marking NE OUTLINE CASE X FOR MICROCIRCUIT marking code LA SMD G227* datasheet abstract.. |
2540.94 Kb |
56 Pages |
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First line: appendix devices case outline Update boileplate. footnote 1.2.2. features requirements throughout- Correct dimensions case outline Update boilerplate according with MIL-PRF-38535 requirement. Correct supply voltage range from -0.5 1.3. 00-07-03 02-02-12 03-10-27 07-03-06 08-03-17 Abstract: .. 05 MG2270P 270,000 gates available. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements .. Tags: OUTLINE CASE X FOR MICROCIRCUIT marking code LA SMD G227* datasheet abstract.. |
792.58 Kb |
54 Pages |
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First line: device type this drawing have been changed reflect part numbers 5962-00B03. device types have been added 1.2.2. device type case outline Changed supply voltage absolute maximum rating from 03-12-04 Abstract: .. 05 MG2270P 270,000 gates available. 06 MG2256A MG2256A FPGA conversion. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows .. Tags: mmku marking code LA SMD G227* e271 datasheet abstract.. |
151.36 Kb |
17 Pages |
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First line: 5962-03B0103VYC device type this drawing have been changed reflect part numbers 5962-00B03. device types have been added 1.2.2. device type case outline Changed supply voltage absolute maximum rating from case outline case outline Update boilerplate current requirements MIL-PRF-38535. 03-12-04 Abstract: .. 05 MG2270P 270,000 gates available. 06 MG2256A MG2256A FPGA conversion. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows .. Tags: 5962-03B0103VYC mmku MARK E5 G227* datasheet abstract.. |
264.63 Kb |
23 Pages |
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