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LTC1093MILDWF#PBF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1297J8 Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, CDIP8, HERMETIC SEALED, CERDIP-8, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594LS16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1093MILDWF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594LS16#TR Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC1594S16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices

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Part : BCM84851B1KFSBG-METHODE Supplier : Broadcom Manufacturer : Avnet Stock : 25,661 Best Price : - Price Each : -
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METHOD-2031

Catalog Datasheet MFG & Type PDF Document Tags

METHOD-1027

Abstract: METHOD-1026 HIGH RELIABILITY - TEST CAPABILITIES Item Test Conditions Reference 1 Solder Resistance 2 Solderability 3 Pull 4 Bend Lead @ 2 6 0 ± 5 °C for 1 0 ± 2 sec. immerse body into solder 1 /1 6 " ± 1 /3 2 " @ 2 3 0 ± 5 °C for 5 sec. 1 Kg in axial lead direction for 10 sec. 0 .5 Kg weight applied to each lead bending arc 9 0 ° ± 5 ° for 3 times. MIL-STD-750C METHOD-2031 M IL-STD-202F METHOD-208 M IL-STD-750C METHOD-2036 M IL-STD-750C METHOD-2036 M IL-STD-750C METHOD-1026 M IL-STD-750C METHOD-1027 M IL-STD-750C M
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OCR Scan
METHOD-1031 ETHOD-1036 ETH0D-1051 METHOD-1056 ETH0D-750C ETH0D-4066-2 MIL-STD-202F
Abstract: ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2 Formosa MS
Original
KBL005G KBL10G DS-242175 METHOD-1038 METHOD-1036 JESD22-A102
Abstract: at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 Formosa MS
Original
MP10005 MP1010 DS-242149 METHOD-4066-2 METHOD-1021 METHOD-1051

KBPC-6

Abstract: kbpc 2010 bridge rectifier capabilities Item Test 1. Solder Resistance Formosa MS Reference MIL-STD-750D METHOD-2031 MIL-STD
Formosa MS
Original
KBPC-6 kbpc 2010 bridge rectifier kbpc 2010 BR6005 BR610 DS-242142
Abstract: MS Reference MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD Formosa MS
Original
DS-242126

KBPC-3

Abstract: METHOD-1021 -750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD
Formosa MS
Original
KBPC-3 BR3005 BR310 DS-242120
Abstract: solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec Formosa MS
Original
DS-242124
Abstract: Formosa MS Reference MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD Formosa MS
Original
Abstract: test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O Formosa MS
Original
RB151 RB157 DS-242116
Abstract: . immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for Formosa MS
Original
KBL00 KBL10 DS-242121
Abstract: capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD Formosa MS
Original
RB151G RB157G DS-242137

w04 rectifier bridge

Abstract: marking w04 -750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec
Formosa MS
Original
w04 rectifier bridge marking w04 w04 rectifier DS-242115
Abstract: capabilities Item Test 1. Solder Resistance Formosa MS Reference MIL-STD-750D METHOD-2031 MIL-STD Formosa MS
Original
Abstract: . immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for Formosa MS
Original
RB-15

MIL-STD-750D

Abstract: -750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD
Formosa MS
Original
DS-242140

KBL06G

Abstract: KBL02G capabilities Item Test 1. Solder Resistance Formosa MS Reference MIL-STD-750D METHOD-2031 MIL-STD
Formosa MS
Original
KBL06G KBL02G marking code A50
Abstract: ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2 Formosa MS
Original
DS-242136
Abstract: ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2 Formosa MS
Original
METHOD-215
Abstract: "±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD Formosa MS
Original
Abstract: body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 Formosa MS
Original

J-STD-005

Abstract: J-STD-006 electronic grade solder alloys HIGH RELIABILITY - TEST CAPABILITIES Item Test Conditions Reference 1 Solder Resistance 2 Solderability 3 Pull 4 Bend Lead @ 2 6 0 ± 5 °C for 1 0 ± 2 sec. immerse body into solder 1 /1 6 " ± 1 /3 2 " @ 2 3 0 ± 5 °C for 5 sec. 1 Kg in axial lead direction for 10 sec. 0 .5 Kg weight applied to each lead bending arc 9 0 ° ± 5 ° for 3 times. MIL-STD-750C METHOD-2031 M IL-STD-202F METHOD-208 M IL-STD-750C METHOD-2036 M IL-STD-750C METHOD-2036 M IL-STD-750C METHOD-1026 M IL-STD-750C METHOD-1027 M IL-STD-750C M
-
Original
J-STD-005 J-STD-006 electronic grade solder alloys J-STD-006 IPC-4101 J-STD-004 solder wire 30 JC22 MIL-STD-202 MIL-PRF-19500 MILPRF-19500 MIL-STD-750 MIL-STD-750E
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