NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
MCF5282 MCF5281 MCF5281/82 XXX0324 XXX0326 SECF035 SECF003 SECF002 SECF021 - Datasheet Archive
Silicon Revision: All Supports: MCF5281, MCF5282 Summary of MCF528x Errata All current MCF5281/82 devices are marked as L95M mask
MCF5282 MCF5282 Chip Errata Silicon Revision: All Supports: MCF5281 MCF5281, MCF5282 MCF5282 Summary of MCF528x Errata All current MCF5281/82 MCF5281/82 devices are marked as L95M mask set. The date code on the marking can be used to determine which errata have been corrected on a particular device as shown in Table 1. The datecode format is XXXYYWW, where YY represents the year and WW represents the work week. The three leading digits can be ignored. Table 1. Summary of MCF5281/82 MCF5281/82 Errata Errata Module Affected Date Errata Added Date Code Affected? XXX0326 XXX0326 SECF035 SECF035 3/18/03 Yes No No SECF003 SECF003 BDM 3/28/03 Yes Yes Yes SECF002 SECF002 EMAC 3/28/03 Yes Yes No SECF021 SECF021 Cache 3/31/03 Yes Yes No SECF004 SECF004 Flash 4/09/03 Yes Yes No SECF005 SECF005 Cache 7/21/03 Yes Yes Yes SECF001 SECF001 Cache 7/21/03 Yes Yes Yes SECF029 SECF029 FlexCAN 7/23/03 Yes Yes Yes SECF009 SECF009 FEC 4/22/04 Yes Yes Yes SECF007 SECF007 FEC 4/22/04 Yes Yes Yes SECF036 SECF036 PLL 8/23/04 Yes Yes Yes SECF010 SECF010 FEC 9/14/04 Yes Yes Yes SECF038 SECF038 QADC 3/15/05 Yes Yes Yes SECF031 SECF031 GPIO 1/6/06 Yes Yes Yes SECF037 SECF037 © PLL PLL 6/12/06 Yes Yes Yes Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 MCF5282DE MCF5282DE Rev. 7, 6/2010 Freescale Semiconductor Chip Errata Errata Module Affected Date Errata Added Date Code Affected? XXX0326 XXX0326 FEC 5/31/07 Yes Yes Yes SECF123 SECF123 FlexCAN 8/28/08 Yes Yes Yes SECF124 SECF124 Cache 2/17/09 Yes Yes Yes SECF125 SECF125 FlexCAN 4/25/09 Yes Yes Yes SECF036A SECF036A PLL 6/9/10 Yes Yes Yes Revision History The table below provides a revision history for this document. Table 2. Document Revision History Rev. No. Date Substantive Changes 3 5/2007 Added errata: SECF037 SECF037 "Phase Relationship Between CLKOUT and CLKIN Not Preserved When Using PLL" and SECF006 SECF006 "FEC Duplicate Transmission Bug" 4 8/2008 Added errata: SECF123 SECF123 "FlexCAN Writing to an Active Receive MB May Corrupt MB Contents" 5 2/2009 Added status headings for each errata. Added errata: SECF124 SECF124 "Buffered Write May Be Executed Twice" 6 4/2009 Added errata: SECF125 SECF125 "Any FlexCAN MB access during RX or TX of an extended ID""frame's CRC and EOF may cause unwanted message reception" 7 6/2010 Added errata: SECF036A SECF036A "PLL Does Not Lock in Normal PLL Mode with Crystal Reference" SECF035 SECF035: Leakage Current on VDDPLL pin Errata type: Silicon Affected component: PLL Description: The device exhibits a 65mA leakage current on the VDDPLL supply, regardless of chip configuration. Workaround: No workaround. Fix plan: Fixed in datecodes XX0324 XX0324 and later. SECF003 SECF003: BDM Load of SR Does Not Enable Stack Pointer Exchange Errata type: Silicon Affected component: BDM MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 2 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 SECF006 SECF006 The V2 core used in this device adds support for separate user and supervisor stack pointers. The hardware implements an active stack pointer and an other_stack_pointer. Whenever the operating mode of the processor changes (supervisor to user or user to supervisor), the processor hardware exchanges the active SP and the other SP. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Description: This exchange operation does not work when the processor mode is changed by a write to the SR from the BDM port. The hardware in the processor core required to process the BDM load_SR operation and enable the stack pointer exchange is missing. The exchange works properly when the SR is changed through software. Workaround: Use software for any operations that require exchanging the stack pointers. Fix plan: Currently, there are no plans to fix this. SECF002 SECF002: Unexpected Pipeline Stall on EMAC Load/Store Accumulator Instruction Errata type: Silicon Affected component: EMAC Description: An unexpected pipeline stall occurs for accumulator load and accumulator store instructions that immediately follow a load accumulator or MAC instruction. Specifically, the operand execution pipeline (OEP) experiences a 2T pipeline stall when a load/store accumulator instruction enters the pipeline immediately after any load accumulator or MAC instruction. The pipeline is supposed to stall only if there is a store accumulator instruction immediately following a load or MAC instruction that updated the specified accumulator. A simple example can be created to expose this problem: mac.l ra,rb,acc0 mac.l rc,rd,acc0 mov.l acc1,rx In the above example, the store of acc1 (mov.l acc1,rx) should not experience any stall because that accumulator is not being updated. In the current V2 + EMAC implementation, it incorrectly stalls for two cycles. NOTE The operation of the instructions is correct. The problem is that the expected timing is not met. Workaround: No workaround. Fix plan: Fixed in datecodes XXX0327 XXX0327 and later. SECF021 SECF021: Incorrect Cache Size Errata type: Silicon MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 Freescale Semiconductor 3 Description: The device operates as if it were connected to an 8KB cache; however, the cache size is 2KB. After the 2KB cache is full, the cache controller can have erroneous hits in the cache space resulting in data and/or instruction corruption. Workaround: Do not enable the cache. Fix plan: Fixed in datecodes XXX0327 XXX0327 and later. SECF004 SECF004: Corrupted Fetches from Flash Errata type: Silicon Affected component: Flash controller Description: Leaving bit 6 in the FLASHBAR register cleared can cause corrupted fetches from the device's internal flash. For datecodes after XXX0327 XXX0327, the bit is hardwired high to prevent the corrupted accesses. Workaround: Set bit 6 in the FLASHBAR. This prevents the corrupted fetches. Fix plan: Fixed in datecodes XXX0327 XXX0327 and later. SECF005 SECF005: Possible Cache Corruption After Clearing Cache (Setting CACR[CINV]) Errata type: Silicon Affected component: Version 2 ColdFire Cache Description: The cache on the V2 ColdFire core may function as either: · a unified data and instruction cache · an instruction cache · a data cache The cache function and organization is controlled by the cache control register (CACR).The CACR[CINV] bit causes a cache clear. If the cache is configured as a unified cache and the CINV bit is set, the scope of the cache clear is controlled by two other bits in the CACR: · CACR[INVI] invalidates instruction cache only · CACR[INVD] invalidates data cache only If a write to the CACR is performed to clear the cache (CACR[CINV] = 1) and only a partial clear is done (CACR[INVI] or CACR[INVD] set), then cache corruption may occur. Workaround: All loads of the CACR that perform a cache clear operation (CACR[CINV] set) should be followed immediately by a NOP instruction. This avoids the cache corruption problem. Fix plan: Currently, there are no plans to fix this. MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 4 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Affected component: Cache SECF001 SECF001: Incorrect Operation of Cache Freeze (CACR[CFRZ]) Silicon Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Errata type: Affected component: Version 2 ColdFire Cache Description: The cache on the V2 ColdFire core is controlled by the cache control register (CACR). When the CACR[CFRZ] bit is set, the cache freeze function is enabled and no valid cache array entry is displaced. However, this feature does not always work as specified, sometimes allowing valid lines to be displaced when CACR[CFRZ] is enabled. This does not cause any corrupted accesses. However, there could be cache misses for data that was originally loaded into the cache but was subsequently deallocated, even though the CACR[CFRZ] bit was set. Also, incoherent cache states are possible when a frozen cache is cleared via the CACR[CINV] bit. Workaround: Unfreeze the cache by clearing CACR[CFRZ] when invalidating the cache using the CACR[CINV] bit Workaround: Use the internal SRAM to store critical code/data if the system cannot handle a potential cache miss Fix plan: Currently, there are no plans to fix this. SECF029 SECF029: Incorrect 32-bit Accesses to FlexCAN Registers Errata type: Silicon Affected component: FlexCAN Description: Because the FlexCAN was originally designed for 16-bit architectures, all 32-bit register accesses are broken down into two back-to-back 16-bit accesses. However, the timing for the back-to-back accesses is incorrect and leads to corruption of the second 16-bit read or write. Workaround: When reading or writing to the 32-bit RxMASK registers, use two 16-bit accesses instead of a single 32-bit access. Fix plan: Currently, there are no plans to fix this. SECF009 SECF009: FEC Receive Buffer Overrun in 10BaseT Mode Errata type: Silicon Affected component: FEC Description: When the FEC is connected to a 10BaseT network, if length of the data stored in a descriptor is not evenly divisible by 16 (not line-aligned), the FEC writes extra lines at the end of the buffer. The entire line that contains the last valid data is written and at least one extra line, but up to four lines after the end of the valid data can also be written. In most cases, this is not a problem because the extra lines of data continue falling within the limits of the buffer. However, MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 Freescale Semiconductor 5 For example, as shown in the figure below, if the max buffer size is programmed to 0x600 and a frame that is 0x5F8 bytes long is received, a line is written starting at buffer start + 0x5F0. The first half of the line at buffer start + 0x5F0 is valid frame data that should be processed by the FEC driver; the second half of the line is additional data that is written because the FEC only writes complete lines. This data should be ignored by the FEC driver. So far, this is correct FEC behavior as originally specified. However, the FEC repeats the last line of valid data a number of times. The line at buffer start + 0x600 is written, and as many as three additional lines beyond the end of the data buffer could be written. buffer start + 0x5E0 buffer start + 0x5F0 End of data buffer buffer start + 0x600 buffer start + 0x610 Valid frame data buffer start + 0x620 Expected extra data buffer start + 0x630 Unexpected data/ overflows the data buffer Figure 1. Buffer Overrun Example Workaround: Only use 100BaseT. Workaround: Allocate extra lines for the receive data buffers. The actual allocated memory for each buffer should be equal to the receive buffer size programmed in the FEC's EMRBR register plus four lines (16 byte-sized lines). Workaround: Program the data buffer size one line larger than the max packet size (data buffer size = EMRBR + 0x40). Fix plan: Currently, there are no plans to fix this. SECF007 SECF007: Concatenation of Received Frames in 10BaseT Mode Errata type: Silicon Affected component: FEC Description: When the FEC is connected to a 10BaseT network, sometimes the FEC combines the data from multiple frames to generate a single frame. The data from the frames is received correctly, but the frame boundary is not reported correctly. This causes the descriptor to report the length as the data length for all of the concantenated frames added together. The incorrect data length might exceed the max frame length programmed in the RCR[MAX_FL] field. When TCP is used as a transport mechanism, this errata manifests itself as lost packets and reduced throughput. Data continues to be received correctly because TCP requests retransmission of bad packets. However, UDP does MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 6 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 if the valid data ends near the end of the buffer, the extra lines written by the FEC might be outside of the data buffer. This leads to corruption of the next buffer, descriptor, data, or code stored in the adjacent memory. Workaround: Higher level Ethernet layer code should compare the length reported by the descriptor to the length included in its header. If the lengths do not match, the packet should be truncated or discarded as needed. The protocol stack must be responsible for requesting retransmission of any frames that are discarded due to the data length mismatch. Fix plan: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 not include any mechanism for packet retransmission, as it is a send and forget protocol. Consequently, while UDP should be able to identify an incorrectly received packet (because its checksum will fail), higher level software in the protocol stack must be capable of requesting retransmission to work around this errata. Currently, there are no plans to fix this. SECF036 SECF036: PLL Does Not Lock in Normal PLL Mode with External Clock Reference Errata type: Silicon Affected component: PLL Description: During a power on reset, if the CLKMOD[1:0] equals 10 (normal PLL mode with external clock reference), the PLL does not lock and the device never comes out of reset. Workaround: When configuring the PLL for normal PLL mode with external clock reference, tie CLKMOD1 to RSTI and not straight to 3.3V. This allows the PLL to correctly detect the desired operating mode and lock. Fix plan: Currently, there are no plans to fix this. SECF010 SECF010: FEC Interrupts will not Trigger on Consecutive Transmit Frames Errata type: Silicon Affected component: FEC Description: The late collision (LC), retry limit (RL), and underrun (UN) interrupts do not trigger on consecutive transmit frames. For example, if back-to-back frames cause a transmit underrun, only the first frame generates an underrun interrupt. No other underrun interrupts are generated until a frame is transmitted that does not underrun or the FEC is reset. Workaround: Because late collision, retry limit, and underrun errors are not directly correlated to a specific transmit frame, in most cases a workaround for this problem is not needed. If a workaround is required, there are two independent workarounds: · Ensure that a correct frame is transmitted after a late collision, retry limit, or underrun errors are detected. · Perform a soft reset of the FEC by setting ECR[RESET] when a late collision, retry limit, or underrun errors are detected. Fix plan: Currently, there are no plans to fix this. MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 Freescale Semiconductor 7 SECF038 SECF038: Possible QADC Command Conversion Word (CCW) Table Corruption Silicon Affected component: QADC Description: A CCW table location may be corrupted by writing any other CCW or results table location while any queue is active. If a CCW table or result table write occurs while either queue is active, it is possible for another CCW location to be corrupted. This bug only occurs if the write cycle is simultaneous with the queue state machine reading the next CCW location. The odds of this happening are one in the number of clocks in a conversion. Workaround: Make sure that both queues have completed or are paused before updating a CCW table or result table location. Workaround: If workaround one is not possible, the application code can monitor the CWP bits in the QASR0. After it changes, it is safe to write a CCW table or result register location. The safe time is equal to the input sample time of the next conversion (4-18 QCLKs). Workaround: If workarounds one and two are not possible, it is possible to update a CCW or result register location while a queue is active by using the following sequence: · Read status register 0 and save the CWP value · Perform the write · Read CCW locations pointed to by CWP and CWP+1 to check if they are corrupted · Fix any of the possibly corrupted locations The above sequence should be safe. If a CCW location is corrupted, it is not used until a queue wraps around back to this CCW. The user has one conversion time to perform the corruption checks and fixes. There should be plenty of time to do this without worrying about another CCW corruption. Fix plan: Currently, there are no plans to fix this. SECF031 SECF031: GPIO Inputs Behave Inappropriately with 10k Ohm Pull Downs Errata type: Silicon Affected component: Ports Description: GPIO inputs that shouldn't have internal pull-ups, behave as if internal pull-ups are enabled when pull-down resistors larger than 10k ohm are used. To achieve 5V tolerance for the I/O pads, a pull-up device is used to latch the input value of the pads while protecting internal circuitry to direct exposure to potentials above 3.6V. These pull-up devices are not disabled after stimulus is removed and a pull-down resistor value larger than 10k ohm is used. Workaround: To disable the pull-up, a pull-down resistor value of 10k Ohm or less is needed. Fix plan: Currently, there are no plans to fix this. MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 8 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Errata type: SECF037 SECF037: Phase Relationship Between CLKOUT and CLKIN Not Preserved When Using PLL Silicon Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Errata type: Affected component: PLL Description: In all PLL modes, the CLKOUT phase relationship to the input clock drifts by 25-33%. Workaround: Use bypass mode, by setting CLKMOD[1:0] to 00. The CLKOUT to CLKIN phase relationship is maintained. Fix plan: Currently, there are no plans to fix this. SECF006 SECF006: FEC Duplicate Transmission Errata type: Silicon Affected component: FEC Description: In some cases, the FEC transmits single frames more than once. The FEC fetches transmit buffer descriptors (TxBDs) and the corresponding Tx data continuously until the Tx FIFO is full. It does not determine whether the TxBD to be fetched is already being processed internally (as a result of a wrap). As the FEC nears the end of the transmission of one frame, it begins to DMA the data for the next frame. To remain one BD ahead of the DMA, it also fetches the TxBD for the next frame. It is possible that the FEC fetches from memory a BD that has already been processed but not yet written back (it is read a second time with the R bit set). In this case, the data is fetched and transmitted again. Workaround: Using at least three TxBDs fixes this problem for large frames, but not for small frames. To ensure correct operation for large or small frames, one of the following must be true: · The FEC software driver ensures that there is always at least one TxBD with the Ready bit cleared. · Every frame uses more than one TxBD and every TxBD, but the last is written back immediately after the data is fetched. The FEC software driver ensures a minimum frame size, n. The minimum number of TxBDs is then rounded up to the nearest integer (though the result cannot be less than 3). The default Tx FIFO size is 192 Bytes; this size is programmable. Fix plan: Currently, there are no plans to fix this. SECF123 SECF123: FlexCAN Writing to an Active Receive MB May Corrupt MB Contents Errata type: Silicon Affected component: FlexCAN MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 Freescale Semiconductor 9 Deactivating a FlexCAN receive message buffer (MB) may cause corruption of another active receive MB, including the ID field, if the following sequence occurs. 1. A receive MB is locked via reading the control/status word, and has a pending frame in the temporary receive serial message buffer (SMB). 2. A second frame is received that matches a second receive MB, and is queued in the second SMB. 3. The first MB is unlocked during the time between receiving the CRC field and the sixth bit of end of frame (EOF) of the second frame. 4. The second MB is deactivated within nine bus clock cycles of the sixth bit of EOF, resulting in corruption of the first MB. During standard use of the FlexCAN hardware, the errata can appear during heavy communications with several Rx MBs at a low baudrate and while using Rx extended MB's IDs. This can be easily observed by checking ID value overwrite. In all cases, CAN transmissions from the processor are not affected at any moment. Workaround: Do not write to the control/status word after initializing a receive MB. If a write (deactivation) is required to the control/status field of an active receive MB, either freeze the FlexCAN module or insert a delay of at least 27 CAN bit times plus 10 bus clock cycles between unlocking one MB and deactivating another MB. This avoids MB corruption; however, frames may still be lost. Workaround: The FlexCAN software driver ensures IDs are not changed during each reception. As soon as it has changed, return to original value. Fix plan: Currently, there are no plans to fix this. SECF124 SECF124: Buffered Write May Be Executed Twice Errata type: Silicon Affected component: Cache Description: If buffered writes are enabled using the CACR or ACR registers, the imprecise write transaction generated by a buffered write may be executed twice. Workaround: Do not enable buffered writes in the CACR or ACR registers: · CACR[8] = DBWE (default buffered write enable) must be 0 · ACRn[5] = BUFW (buffered write enable) must be 0 Fix plan: Currently, there are no plans to fix this. SECF125 SECF125: Any FlexCAN MB access during RX or TX of an extended ID frame's CRC and EOF may cause unwanted message reception Errata type: Silicon Affected component: FlexCAN MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 10 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Description: With extended ID frames, a frame may be received into a receive message buffer (MB) if a match occurs for the ID_HIGH part of the frame's extended ID, irrespective of the ID_LOW and the acceptance mask bits MID[14:0]. So unwanted messages, which should be filtered by the hardware mask register, may be received and so the ID field of the receive MB may be overwritten by the received frame's ID. Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 Description: This issue only happens to the messages with the extended ID when the match occurs for the extended ID bits 28 to 15. Messages with standard ID have no such issue. Workaround: Use only the Standard ID format for all messages, not the extended format. Workaround: If extended IDs are used, ensure that only ID bits 28 to 15 are used as the filter criteria, so that other ID bits (ID bits 14 to 0) are not used to filter messages. ID bits 14 to 0 may contain information not used for message filtering purposes. Fix plan: Currently, there are no plans to fix this. SECF036A SECF036A: PLL Does Not Lock in Normal PLL Mode with Crystal Reference Errata type: Silicon Affected component: PLL Description: During a power on reset, if the CLKMOD[1:0] equals 11 (normal PLL mode with crystal reference), the PLL does not lock and the device never comes out of reset. Workaround: When configuring the PLL for normal PLL mode with crystal reference, tie CLKMOD1 to RSTI and not straight to 3.3V. This allows the PLL to correctly detect the desired operating mode and lock. Fix plan: Currently, there are no plans to fix this. MCF5282 MCF5282 Chip Errata, Rev. 7, 6/2010 Freescale Semiconductor 11 Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, EL516 EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Document Number: MCF5282DE MCF5282DE Rev. 7, 6/2010 Information in this document is provided solely to enable system and sofware implementers to use Freescale Semiconductors products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor prodcuts are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claims alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics as their non-RoHS-complaint and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale's Environmental http://www.freescale.com/epp. Products program, go to FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MCF5281 MCF5281, MCF5282 MCF5282 How to Reach Us: