MC74VHC1G01 SC70-5/SC-88A/SOT-353 MC74VHC1G01/D SC70-5/SC-88A EIA/JESD22-A114-A - Datasheet Archive

 

Single 2-Input NAND Gate with Open Drain Output The MC74VHC1G01 is an advanced high speed CMOS 2-input NAND gate with an open

 

MC74VHC1G01 MC74VHC1G01 Single 2-Input NAND Gate with Open Drain Output The MC74VHC1G01 MC74VHC1G01 is an advanced high speed CMOS 2-input NAND gate with an open drain output fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including an open drain output which provides the ability to set output switching level. This allows the MC74VHC1G01 MC74VHC1G01 to be used to interface 5.0 V circuits to circuits of any voltage between VCC and 7.0 V using an external resistor and power supply. The MC74VHC1G01 MC74VHC1G01 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage. · · · · · High Speed: tPD = 3.7 ns (Typ) at VCC = 5.0 V http://onsemi.com MARKING DIAGRAMS 5 1 V0d SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 DF SUFFIX CASE 419A Pin 1 Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on Inputs 5 Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 62 V0d 1 SOT23-5/TSOP-5/SC59-5 DT SUFFIX CASE 483 IN B 1 5 VCC Pin 1 d = Date Code OVT IN A 2 PIN ASSIGNMENT 1 GND 3 4 OUT Y IN B 2 IN A 3 OUT Y 5 Figure 1. Pinout (Top View) GND 4 VCC FUNCTION TABLE Inputs IN A IN B & Output A Figure 2. Logic Symbol B Y L L H H OUT Y L H L H Z Z Z L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2003 December, 2003 - Rev. 13 1 Publication Order Number: MC74VHC1G01/D MC74VHC1G01/D MC74VHC1G01 MC74VHC1G01 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V -0.5 to +7.0 V VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Sink Current, per Pin ICC DC Supply Current, VCC and GND Pin TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) u2000 u200 N/A V ILATCH-UP Latch-Up Performance Above VCC and Below GND at 125°C (Note 5) $500 mA *0.5 to VCC )0.5 V -20 mA $20 mA VOUT t GND; VOUT u VCC 25 mA $25 mA *65 to )150 °C 260 °C )150 °C SC70-5/SC-88A SC70-5/SC-88A (Note 1) TSOP-5 350 230 °C/W SC70-5/SC-88A SC70-5/SC-88A TSOP-5 150 200 mW Level 1 Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A JESD22-C101-A. 5. Tested to EIA/JESD78 EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 2.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 7.0 V TA Operating Temperature Range -55 +125 °C tr , tf Input Rise and Fall Time 0 0 100 20 ns/V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80°C 117.8 TJ = 90°C 1,032,200 TJ = 100°C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 110°C Time, Years TJ = 120°C Time, Hours TJ = 130°C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74VHC1G01 MC74VHC1G01 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Test Conditions TA v 855C TA = 255C (V) Min VIH Minimum High-Level Input Voltage 2.0 3.0 4.5 5.5 1.5 2.1 3.15 3.85 VIL Maximum Low-Level Input Voltage 2.0 3.0 4.5 5.5 VOL Maximum Low-Level Output Voltage VIN = VIH or VIL Typ Max Min Max 1.5 2.1 3.15 3.85 *555C v TA v 1255C 1255C Min Max 1.5 2.1 3.15 3.85 Unit V 0.5 0.9 1.35 1.65 0.0 0.0 0.0 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 ILKG Z-State Output Leakage Current VIN = VIL VOUT = VCC or GND 5.5 $5 $10 $10 mA IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 $0.1 $1.0 $1.0 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40 mA IOFF Power Off-Output Leakage Current VOUT = 5.5 V VIN = 5.5 V 0 0.25 2.5 5 mA ÎÎ Î Î Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î ÎÎ Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î ÎÎ Î Î Î Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns TA 85°C TA = 25°C Symbol Parameter Min Test Conditions Typ Max Min Max -55 TA 125°C Min Max Unit ns tPLZ CIN Maximum Output Enable Time, Input A or B t Y I t to VCC = 3.3 ± 0.3 V RL = RI = 500 W CL = 15 pF CL = 50 pF 5.5 8.0 7.9 11.4 9.5 13.0 11.0 15.5 VCC = 5.0 ± 0.5 V RL = RI = 500 W CL = 15 pF CL = 50 pF 3.7 5.2 5.5 7.5 6.5 8.5 8.0 10.0 Maximum Output Disable Time VCC = 3.3 ± 0.3 V RL = RI = 500 W CL = 50 pF 8.0 11.4 13.0 15.5 VCC = 5.0 ± 0.5 V RL = RI = 500 W tPZL CL = 50 pF 5.2 7.5 8.5 10.0 4 10 10 10 Maximum Input Capacitance ns pF Typical @ 25°C, VCC = 5.0V 18 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74VHC1G01 MC74VHC1G01 VCC - 7 V VCC VCC A or B 50% OVT A GND RL tPLZ tPZL HIGH IMPEDANC B 50% VCC Y Figure 4. Output Voltage Mismatch Application VOL +0.3 V Figure 5. Switching Waveforms VCC VCC x 2 R1 PULSE GENERATOR DUT RT CL RL CL = 50 pF equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 6. Test Circuit MC74VHC1G01 MC74VHC1G01 VCC VCC A B MC74VHC1G03 MC74VHC1G03 1 A 2.2 kW B MC74VHC1G01 MC74VHC1G01 1.5 V 3.3 V VCC 5 2 R LED 220 W A B C 3 E = (A · B) + (C+D) D Figure 7. Complex Boolean Functions 4 GTL Figure 8. LED Driver Figure 9. GTL Driver DEVICE ORDERING INFORMATION Device Nomenclature Package Suffix Tape and Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size 01 DF T1 SC70-5/SC-88A/ SC70-5/SC-88A/ SOT-353 178 mm (7 in) 3000 Unit VHC1G 01 DF T2 SC70-5/SC-88A/ SC70-5/SC-88A/ SOT-353 178 mm (7 in) 3000 Unit VHC1G 01 DT T1 SOT23-5/TSOP-5/ SC59-5 SC59-5 178 mm (7 in) 3000 Unit Device Order Number Logic Circuit Indicator Temp Range Identifier Technology Device Function MC74VHC1G01DFT1 MC74VHC1G01DFT1 MC 74 VHC1G MC74VHC1G01DFT2 MC74VHC1G01DFT2 MC 74 MC74VHC1G01DTT1 MC74VHC1G01DTT1 MC 74 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D BRD8011/D. http://onsemi.com 4 MC74VHC1G01 MC74VHC1G01 CAVITY TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN TOP TAPE COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 10. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 $0.50 8.00 $0.30 1 1.00 MIN DIRECTION OF FEED Figure 11. SC-70-5/SC-88A/SOT-353 SC-70-5/SC-88A/SOT-353 DFT1 Reel Configuration/Orientation TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 $0.50 8.00 $0.30 1 1.00 MIN DIRECTION OF FEED Figure 12. SC-70/SC-88A/SOT-353 SC-70/SC-88A/SOT-353 DFT2 and SOT23-5/TSOP-5/SC59-5 DTT1 Reel Configuration/Orientation http://onsemi.com 5 MC74VHC1G01 MC74VHC1G01 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm $0.2 mm (0.512 in $0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 13. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm T1, T2 178 mm (7 in) 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 14. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1G01 MC74VHC1G01 PACKAGE DIMENSIONS SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 DF SUFFIX 5-LEAD PACKAGE CASE 419A-02 ISSUE G A G 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 4 DIM A B C D G H J K N S -B- S 1 2 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC - 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches Figure 15. SC-88A/SC70-5/SOT-353 SC-88A/SC70-5/SOT-353 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC - 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74VHC1G01 MC74VHC1G01 PACKAGE DIMENSIONS SOT23-5/TSOP-5/SC59-5 DT SUFFIX 5-LEAD PACKAGE CASE 483-01 ISSUE C D S 5 4 1 2 3 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. L MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 G A J C 0.05 (0.002) H M K SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches Figure 16. THIN SOT23-5/TSOP-5/SC59-5 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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