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Part Manufacturer Description Datasheet BUY
278A36-24 Curtis Industries MARKING STRIPS visit Digikey Buy
278A36-7 Curtis Industries MARKING STRIPS visit Digikey Buy
247A10-2 Curtis Industries MARKING STRIPS visit Digikey Buy
247A11-7 Curtis Industries MARKING STRIPS visit Digikey Buy
267A218-4 Curtis Industries MARKING STRIPS visit Digikey Buy
247A11-13 Curtis Industries MARKING STRIPS visit Digikey Buy

MARK MQ

Catalog Datasheet MFG & Type PDF Document Tags

KRC281U

Abstract: SEMICONDUCTOR KRC281U MARKING SPECIFICATION USM PACKAGE 1. Marking method Laser Marking MQ 1 No. 0 1 2. Marking 2 Item Marking Description Device Mark MQ KRC281U hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Note) * Lot No. marking method Character arrangement 1 st Character 1 (A) 2 (B) 3 (C) 4 (D) 5 (E) 6 (F) 7 (G) 8 (H) 9 (I) 0 (J) 2nd Character A (1) B
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Original
Abstract: on packet or word boundaries Mark and Re-Write operation Mark and Re-Read operation Individual , to change without notice. DSC-6715/4 IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ , . 52 2 FEBRUARY 13, 2009 IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ FLOW-CONTROL , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence Integrated Device Technology
Original
IDT72P51539 IDT72P51549 IDT72P51559 IDT72P51569 BB256-1 72P51539

Diode Mark ON B14

Abstract: on packet or word boundaries Mark and Re-Write operation Mark and Re-Read operation Individual , notice. DSC-6715/3 IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ FLOW-CONTROL DEVICES (32 , . 52 2 AUGUST 4, 2005 IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ FLOW-CONTROL DEVICES , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence
Integrated Device Technology
Original
Diode Mark ON B14 72P51549 72P51559 72P51569
Abstract: word boundaries Mark and Re-Write operation Mark and Re-Read operation Individual, Active queue , notice. DSC-6716/3 IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL DEVICES (8 QUEUES , . 52 2 AUGUST 4, 2005 IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL DEVICES , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence Integrated Device Technology
Original
IDT72P51339 IDT72P51349 IDT72P51359 IDT72P51369 72P51339 72P51349
Abstract: to operate on packet or word boundaries Mark and Re-Write operation Mark and Re-Read operation , IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ FLOW-CONTROL DEVICES (32 QUEUES) 36 BIT WIDE CONFIGURATION , . 52 2 SEPTEMBER 27, 2004 IDT72P51539/72P51549/72P51559/72P51569 1.8V, MQ FLOW-CONTROL , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence Integrated Device Technology
Original
Abstract: to operate on packet or word boundaries Mark and Re-Write operation Mark and Re-Read operation , IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL DEVICES (8 QUEUES) 36 BIT WIDE CONFIGURATION 589 , . 52 2 SEPTEMBER 27, 2004 IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence Integrated Device Technology
Original
72P51359 72P51369
Abstract: on packet or word boundaries Mark and Re-Write operation Mark and Re-Read operation Individual , IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL DEVICES (8 QUEUES) 36 BIT WIDE CONFIGURATION 589 , . 52 2 FEBRUARY 4, 2004 IDT72P51339/72P51349/72P51359/72P51369 1.8V, MQ FLOW-CONTROL DEVICES , . 32 Figure 13. MARK and Re-Write Sequence . 33 Figure 14. MARK and Re-Read Sequence Integrated Device Technology
Original

rl00

Abstract: R003 Value for Current Sensing 3 mQ ~ 500 mO (E-12/3,4,5,6,7,8,50,500 mQ) Resistance Tolerance + 0.5% D ±1.0% F Terminal Resistance 3mQ~8mQ lmQ under 10 mQ ~47mQ 5mQ under 50 mQ ~ 500 mQ 20 mQ under Temperature Coefficient of Resistance 3 mQ ~ 5 mQ ±100ppm/°C 6 m Q ~ 500 m Q + 50ppm/°C Power Rating 1W (Derating Curve , lead free No mark when finish of terminals is solder Figure-2 Plastic Tape â'¢ â'¢ â'¢ Taping form â'žT , Inspection number (Lot number) The country of origin _ Double dashed line shows lead free No mark when finish
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OCR Scan
rl00 R003 71gf RL3264L4 RL00-1029- RL00-1029-1
Abstract: Hcdsonce (mQ) 1 m i) 2 mQ 3 mQ 4 mQ 5 mO Resistance codes and m ark exam ple: Resistance o .o o i a 0.002^ o .o o 3 n 0.004H 0.005Q Codes/Mark R001 R002 R003 R004 , * v /r*(P*R) Measured method: Bottom measurement (If mark on the t:>p side) o -o 1.7mra -
OCR Scan
RFL24 IL-STD-202 MXL-STD-202F-M

C-G6FA

Abstract: dc welding circuit diagram HP5-6 MQ Series High-density Packaging System Connectors for Hi-PAS Mounting HP5 â'¢ 6 Series , Connection resistance 40 mQ or less Including conductor resistance Insulation resistance 100 MO or greater , /contact, max. 18A/connector, max. 1A/contact, max. 6A/connector, max. Contact resistance 30 mQ, max. 30 mQ, max. 30 mQ, max. Insulation resistance 100 MQ or greater 100 MQ or greater 100 MQ or greater , /contact, max. 18A/connector, max. 1A/contact, max. eA/connector, max. Contact resistance 30 mQ, max. 30
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OCR Scan
C-G6FA dc welding circuit diagram C-G26FA C-G26FB U-Groove C-G18FA PCN11M CXR-26FA CX50- CX50-26FA CX75-26FA 80PF/
Abstract: resistance: 50 mQ max. â  Insulation resistance: 100 MQ min. (at 500VAC) â  Dielectric strength: 100 VAC , ) Part NO. (2) Description (3) Lot NO. (4) Quantity (5) Tester NO. (6) Reprocess NO. (7) ECE mark , Type: Z: RoHS Compliant L Special Product Number: 6: Plating Type: Au over Ni L 1: No ECE Mark -
OCR Scan
ESB38 UL94V-0 38102216Z 38101216Z

hr10a-tc-02 crimper

Abstract: HR25-7TR-8PI07 mark indicates the engagement guide key position. RECEPTACLE DIP POST CONFIGURATION DIMENSIONS Size , engagement side of the socket insert (i.e., the wiring side of the pin insert). 2. The A mark of the above , 1000 MQ or greater Contact resistance 30 mQ Solder pot inside diameter 0.5 mm dia. Shell size , Contact resistance 30 mQ Solder pot inside diameter 0.5 mm dia. NOTE: 1. The above diagrams are , mark of the above diagrams indicates the engagement guide key position. 3. The withstand voltage
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OCR Scan
hr10a-tc-02 crimper HR25-7TR-8PI07 HR25-7TJ-6P xc 250 HR25-7TP-8S HR25

5962-06B02

Abstract: qml-38535 mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.7 , F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ ATC18R_216KExxx-MQ ATC18R_216KBxxx-MQ ATC18R_216KAxxx-MQ , _216KAxxx-SR ATC18R_324KBxxx-MQ ATC18R_324KAxxx-MQ ATC18R_324YFxxx-MQ ATC18R_324KExxx-MQ ATC18R_3242Hxxx-MQ ATC18R_3242Uxxx-MQ , / ATC18R_404KAxxx-MQ ATC18R_404YFxxx-MQ ATC18R_4042Hxxx-MQ ATC18R_4042Gxxx-MQ ATC18R_4042Uxxx-MQ ATC18R_4042Vxxx-MQ
DEPARTMENT OF DEFENSE
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ATC18RHA 5962-06B02 qml-38535 216KB 5962-E113-13 5442W 324BG 5962-06B0203Q7C

qml-38535

Abstract: MQ 136 pin diagram number shall be added to the marking by the manufacturer. 3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.7 Certificate , Vendor Similar PIN 2/ 3/ ATC18R_216KExxx-MQ ATC18R_216KBxxx-MQ ATC18R_216KAxxx-MQ ATC18R , _216KAxxx-SR ATC18R_324KBxxx-MQ ATC18R_324KAxxx-MQ ATC18R_324YFxxx-MQ ATC18R_324KExxx-MQ ATC18R_3242Hxxx-MQ
DEPARTMENT OF DEFENSE
Original
MQ 136 pin diagram 5962-E396-11 544YF 5962-06B0210V4C 5442V 5962-06B0210V5C 5442K

5962-06B02

Abstract: ATC18RHA95_504 . 3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as , F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ ATC18R_216KExxx-MQ ATC18R_216KBxxx-MQ ATC18R_216KAxxx-MQ ATC18R_216KExxx-SV ATC18R_216KBxxx-SV ATC18R_216KAxxx-SV ATC18R_216KExxx-SR ATC18R_216KBxxx-SR ATC18R_216KAxxx-SR ATC18R_324KBxxx-MQ ATC18R_324KAxxx-MQ
DEPARTMENT OF DEFENSE
Original
ATC18RHA95_504 5962-06B0201QXC 5962-E098-10 5042H 5042G 5962R06B0208VNC 5962R06B0208V4C 5962-06B0208VZC

HR30-SC-211

Abstract: CONTACT RESISTANCE CONTACT SHALL BE MEASURED AT DC 1 A 15 mQ MAX. X - INSULATION RESISTANCE 100 V DC. 1000 MQ MIN. X X VOLTAGE PROOF 300 V AC. FOR 1 min. NO FLASHOVER OR BREAKDOWN , INSERTIONS AND EXTRACTIONS. CONTACT RESISTANCE: 30 mQ MAX. X â'" VIBRATION FREQUENCY: 10 -» 55 , RESISTANCE: 10 MQ MIN (AT HIGH HUMIDITY). (D INSULATION RESISTANCE: 100 MQ MIN (AT DRY). (D NO DAMAGE. CRACK , °C TIME 30 -» 10 TO 15 -» 30 -» 10 TO 15 min UNDER 5 CYCLES. © INSULATION RESISTANCE: 100 MQ
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OCR Scan
HR30-SC-211 7649-HENKEL HR30-BJ-12SC-T01 CL150-0226-B ETAD-0198 CL130-0017

awm 3239

Abstract: lexan .500 in Fig.5. QUICK REFERENCE DATA Resistance 30 MS2 to 300 MQ Tolerance (% of total resistance)  , .1) R1 2.1 1.2 2.0 1.6 MQ R2/R6 14.65 15.5 14.2 15.15 MQ R3 42.25 37.8 24.8 41.25 MQ R4 32.75 40 32.5 34.25 MQ R5 8.25 5.5 26.5 7.75 MQ R7 20 ±20% 20 ±20% 20 ±20% 20 ±20% MQ Voltages , Mft R3 50.5 33.25 54.6 49.5 Mà R4 33.25 35 30.5 32.75 MQ R5 8.25 15 4.5 8.25 MQ R7 20 ±20% 20 ±20% 20 ±20% 18 ±25% MQ Voltages Maximum application voltage (Vac) 11 11 11 11 kV V
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OCR Scan
awm 3239 lexan .500 ERSIN SOLDER TV20 E41105Y VO-150-B 10-6/K HQV-14/001 10-6/V PRV-53-8-52/45 RV-53-8-52/48

6p6s

Abstract: 7649-HENKEL CONTACT RESISTANCE CONTACT SHALL BE MEASURED AT DC 1 A 15 mQ MAX. X X INSULATION RESISTANCE 100 V DC. 1000 MQ MIN. X X VOLTAGE PROOF 300 V AC. FOR 1 m in. NO FLASHOVER OR , INSERTIONS AND EXTRACTIONS. CONTACT RESISTANCE: 30 mQ MAX. X â'" VIBRATION FREQUENCY: 10 -» 55 , STATE) EXPOSED AT 40 °C, 90 TO 95 %, 96 h. © INSULATION RESISTANCE: 10 MQ MIN (AT HIGH HUMIDITY). (D INSULATION RESISTANCE: 100 MQ MIN (AT DRY). (D NO DAMAGE. CRACK AND LOOSENESS OF PARTS. X -
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OCR Scan
ETAD-C0198 6p6s HR30-6P-6S-T01 CL150-0214-9 S-C-001 EDC3-116505-00 HR30-6PB-6S

EDC3-116604-00

Abstract: CONTACT RESISTANCE CONTACT SHALL BE MEASURED AT DC 1 A 15 mQ MAX. X - INSULATION RESISTANCE 100 V DC. 1000 MQ MIN. X X VOLTAGE PROOF 300 V AC. FOR 1 min. NO FLASHOVER OR BREAKDOWN , INSERTIONS AND EXTRACTIONS. CONTACT RESISTANCE: 30 mQ MAX. X â'" VIBRATION FREQUENCY: 10 -» 55 , RESISTANCE: 10 MQ MIN (AT HIGH HUMIDITY). (D INSULATION RESISTANCE: 100 MQ MIN (AT DRY). (D NO DAMAGE. CRACK , °C TIME 30 -» 10 TO 15 -» 30 -» 10 TO 15 min UNDER 5 CYCLES. © INSULATION RESISTANCE: 100 MQ
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OCR Scan
EDC3-116604-00 HR30-7J-10PC-T01CCL150-0231-8 AREAC11 HR30-PC-211CCL130-0016-0 HR30-0219-2 HR30-7JB-10PC

211CC

Abstract: CONTACT RESISTANCE CONTACT SHALL BE MEASURED AT DC 1 A 15 mQ MAX. X - INSULATION RESISTANCE 100 V DC. 1000 MQ MIN. X X VOLTAGE PROOF 300 V AC. FOR 1 min. NO FLASHOVER OR BREAKDOWN , INSERTIONS AND EXTRACTIONS. CONTACT RESISTANCE: 30 mQ MAX. X â'" VIBRATION FREQUENCY: 10 -» 55 , RESISTANCE: 10 MQ MIN (AT HIGH HUMIDITY). (D INSULATION RESISTANCE: 100 MQ MIN (AT DRY). (D NO DAMAGE. CRACK , °C TIME 30 -» 10 TO 15 -» 30 -» 10 TO 15 min UNDER 5 CYCLES. © INSULATION RESISTANCE: 100 MQ
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OCR Scan
211CC HR30-7J-12PC-T01CCL150-0230-5 HR30-TP CL150-0219-2 EDC3-116508-00 HR30-7JB-12PC CL130-2022-4-00
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