MANV250GE IEC61000-4-5 IEC61000-4-2 SKE00038AED - Datasheet Archive

 

MANV250GE Silicon planar type For surge protect Features Package Large surge reduction power Code SMini2-F3 Name Pin 1: Anode 2:

 

Zener Diodes MANV250GE MANV250GE Silicon planar type For surge protect Features Package Large surge reduction power Code SMini2-F3 Name Pin 1: Anode 2: Cathode Th an W is k y Th e a pro ou Fo an po du fo r f k y log ct r b ur o iz is ro th u e n w er fo fo ot sin in r y r a av g fo ou n a o rm r y ila ur at pa tro ble da io tie ub f ta n, n le or s pl ce th th he ea . is e ets se m ren . ay e co ha wa nt ac ve l o to ca f ou ur us r p sa ed ro le yo du s of u. ct fic lin es eu . p. Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit *1 PPP 450 W Peak pulse current *1 IPP 9 A VRM 18 V Total power dissipation *2 PT 150 mW Junction temperature Tj 150 °C Storage temperature Tstg ­55 to +150 °C Electrostatic discharge *3 ESD ±30 kV Peak pulse power Maximum peak reverse voltage Marking Symbol: RD Note) *1 : Test method: IEC61000-4-5 IEC61000-4-5 (tp = 8/20 ms, Unrepeated) *2: PT = 150 mW achieved with a printed circuit board. *3 : Test method: IEC61000-4-2 IEC61000-4-2 (C = 150 pF, R = 330 W, Contact discharge: 10 times) Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Breakdown voltage *1 Conditions Min Typ Max Unit 20.0 25.0 30.0 V VBR IR = 1 mA Reverse current IR VR = 18 V 10.0 mA Clamping voltage *2 VC IPP = 9.0 A, tp = 8/20 ms 50.0 V Terminal capacitance Ct IR = 0 V, f = 1 MHz 76 pF Th Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. *1: VZ guaranted 20 ms after current flow. *2: Pulse Waveform Percent of IPP 100 90 Front time: T1 = 1.25 × T = 8 µs ±20% Time to half value: T2 = 20 µs ±20% T2 50 10 T T1 Publication date: October 2005 t SKE00038AED SKE00038AED 1 MANV250GE MANV250GE MANV250GE MANV250GE_IF-VF 102 MANV250GE MANV250GE_IZ-VZ MANV250GE MANV250GE_IR-VR IF VF IR VR Ta = 25°C 10-3 1 Ta = 25°C Ta = 25°C 10-1 10 10-4 1 10-1 Zener current IZ (A) Reverse current IR (µA) Forward current IF (mA) IZ VZ 10-5 10-2 10-6 10-2 10-3 10-4 10-5 Th an W is k y Th e a pro ou Fo an po du fo r f k y log ct r b ur o iz is ro th u e n w er fo fo ot sin in r y r a av g fo ou n a o rm r y ila ur at pa tro ble da io tie ub f ta n, n le or s pl ce th th he ea . is e ets se m ren . ay e co ha wa nt ac ve l o to ca f ou ur us r p sa ed ro le yo du s of u. ct fic lin es eu . p. 10-3 10-4 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Forward voltage VF (V) 10-7 0 2 4 6 8 10 12 14 16 18 20 Reverse voltage VR (V) MANV250GE MANV250GE_Ct-VR Ct VR 100 Terminal capacitance Ct (pF) Ta = 25°C f = 1 MHz 10 0 5 10 15 20 Th Reverse voltage VR (V) 2 SKE00038AED SKE00038AED 10-6 5 10 15 20 25 30 Zener voltage VZ (V) 35 40 ±0.1 ±0.1 1.25 ±0.10 0.50 ±0.05 2 0 to 0.05 1 0.35 ±0.05 5° ±0.1 SMini2-F3 SKE00038AED SKE00038AED ±0.2 Th an W is k y Th e a pro ou Fo an po du fo r f k y log ct r b ur o iz is ro th u e n w er fo fo ot sin in r y r a av g fo ou n a o rm r y ila ur at pa tro ble da io tie ub f ta 0.7 n, n le or s pl ce th th he ea . is e ets se m ren . 5°a co y ew ha a nt ac ve l o to ca f ou ur us r p sa ed ro le yo du s of u. ct (0.15) fic lin 0.4 1.7 es eu 2.5 . p. Th MANV250GE MANV250GE Unit: mm 0.13 -0.02 +0.05 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. Th an W is k y Th e a pro ou Fo an po du fo r f k y log ct r b ur o iz is ro th u e n w er fo fo ot sin in r y r a av g fo ou n a o rm r y ila ur at pa tro ble da io tie ub f ta n, n le or s pl ce th th he ea . is e ets se m ren . ay e co ha wa nt ac ve l o to ca f ou ur us r p sa ed ro le yo du s of u. ct fic lin es eu . p. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: ­ Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ­ Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Th (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.