500 MILLION PARTS FROM 12000 MANUFACTURERS
MA111 MA221 MA222 MA223 MA222/223 N-50BU PG-10N SAS-8130 - Datasheet Archive
Switching Diodes MA221 , MA222, MA223 Silicon epitaxial planer type Unit : mm For high speed switching circuits q Extra-small
MA111 MA111 Switching Diodes MA221 MA221 , MA222 MA222, MA223 MA223 Silicon epitaxial planer type Unit : mm For high speed switching circuits q Extra-small cylindrical package, most favorable for high-density COLORED BAND INDICATES CATHODE 0.3 min. s Features 1.4±0.1 M Di ain sc te on na tin nc ue e/ d mounting 1 ue pl d in an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur so a d t d e Pr od ty ni bo yp p c. u e e uc ne t l d tl ife t/s ate cy c/ st en in cl e fo st rm ag at e. io n. q Overall dimensions similar to those of resistor and capacitor (1/8W type), q High 3.5±0.1 enabling sharing of the mounted equipment switching speed and small capacity between pins, Ct s Absolute Maximum Ratings (Ta= 25°C) Parameter Symbol MA221 MA221 Reverse voltage (DC) MA223 MA223 2 50 V 1.5 max. 75 MA221 MA221 1 : Cathode 2 : Anode Leadless Package 35 VRRM MA222 MA222 reverse voltage Unit 35 VR MA222 MA222 Repetitive peak Rating MA223 MA223 50 V 75 Average forward current IF (AV) 100 mA Peak forward current IFRM 225 mA Non-repetitive peak forward surge current IFSM * 500 mA Junction temperature Tj 200 °C Storage temperature Tstg 55 to +150 °C * t=1s s Electrical Characteristics (Ta= 25°C) Symbol co ce /D M ai nt en an Reverse current (DC) IR MA223 MA223 Reverse voltage (DC) IR Terminal capacitance Reverse recovery time VR Ct MA221 MA221 MA222/223 MA222/223 Unit 25 nA VR= 30V 0.1 µA VR=15V 25 nA VR= 50V 5 µA 25 nA 5 µA 100 VR=50V, Ta=150°C 100 VR= 75V, Ta=150°C VF MA221 MA221 typ VR= 35V, Ta=150°C MA223 MA223 Forward voltage (DC) min VR= 75V MA221 MA221 MA222 MA222 Condition Pl ea MA222 MA222 max VR=15V VR= 20V is MA221 MA221 nt in Parameter trr * IF=100mA IR= 5µA 0.95 1.2 35 VR= 0V, f=1MHz 2 10 y Rated input/output frequency : 100MHz (MA221 MA221), 250MHz (MA222 MA222, MA223 MA223) s Cathode Indication Type No. MA221 MA221 MA222 MA222 MA223 MA223 Color White Green Purple V V IF=10mA, VR=1V Irr= 0.1 · IR, RL=100 µA 100 2.2 4 pF ns MA221 MA221, MA222 MA222, MA223 MA223 Switching Diodes Common characteristics chart * trr measuring circuit VF Ta 1.6 Bias Insertion Unit N-50BU N-50BU Input Pulse Output Pulse 1.4 tp 10% A trr IF 1.2 t 90% VR Pulse Generator PG-10N PG-10N Rs=50 t tp=2ms tr=0.35ns =0.05 W.F.Analyzer SAS-8130 SAS-8130 Ri=50 Irr=0.1 · IR IF=10mA VR=1V RL=100W Forward voltage VF (V) tr IF=225mA 1.0 75mA 0.8 0.6 10mA 0.4 1mA 0.2 0 40 0 40 80 120 160 200 Ambient temperature Ta (°C) Characteristics chart of MA221 MA221 IR Ta IR VR 102 Ct VR 102 2.0 f=1MHz Ta=25°C 10 10 Reverse current IR (µA) Reverse current IR (µA) VR=35V 20V 1 101 102 1 101 25°C 102 103 0 25 50 75 Terminal capacitance Ct (pF) 100°C Ta=150°C 1.2 0.8 0.4 103 100 125 150 175 1.6 0 0 Ambient temperature Ta (°C) 5 0 10 15 20 25 30 35 40 45 4 8 12 16 20 Reverse voltage VR (V) Reverse voltage VR (V) Characteristics chart of MA222 MA222 and MA223 MA223 IR Ta 102 VR=75V 2.0 20V 10 Reverse current IR (µA) Reverse current IR (µA) 1 1 101 25°C 101 102 0 20 40 60 80 100 120 140 160 180 Ambient temperature Ta (°C) 1.6 1.2 0.8 0.4 103 102 f=1MHz Ta=25°C Ta=150°C 50V 10 Ct VR Terminal capacitance Ct (pF) 102 IR VR 0 0 10 20 30 40 50 60 70 80 90 Reverse voltage VR (V) 0 4 8 12 16 Reverse voltage VR (V) 20 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.