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| Part Number | Manufacturer | Description | ||||||
| 1. |  M14C32 |
ST Microelectronics | MEMORY CARD IC 64-32 KBIT SERIAL I2C BUS EEPROM | 125.14 Kb | 14 Pg. | |||
| 2. | M14C32 |
ST Microelectronics | Memory Micromodule | 275.54 Kb | 13 Pg. | |||
| 3. | M14C32 DD |
ST Microelectronics | M14C32 Die Description | 15.37 Kb | 2 Pg. | |||
| 4. | M14C32_DD |
ST Microelectronics | M14C32 DIE DESCRIPTION | 15.37 Kb | 2 Pg. | |||
| 5. | M14C32DD |
ST Microelectronics | M14C32 Die Description | 15.36 Kb | 2 Pg. | |||
| 6. | M14C32-DD |
ST Microelectronics | M14C32 DIE DESCRIPTION | 15.37 Kb | 2 Pg. | |||
| 7. | M14C32-WD20 |
ST Microelectronics | 32 kBit Serial I2C Bus EEPROM | 125.14 Kb | 14 Pg. | |||
| 8. | M14C32-WD20 |
ST Microelectronics | Memory Card IC 64/32 Kbit Serial I C Bus EEPROM | 94.63 Kb | 14 Pg. | |||
| 9. | M14C32-WD22 |
ST Microelectronics | Memory Card IC 64/32 Kbit Serial I C Bus EEPROM | 94.63 Kb | 14 Pg. | |||
| 10. | M14C32-WD22 |
ST Microelectronics | Memory Card IC 32 Kbit Serial I2C Bus EEPROM | 125.13 Kb | 14 Pg. |
| « Previous 1 2 3 4 Next » |
| 1. |  15.37 Kb • 2 Pages |
Abstract: ... DD.M14C32/9811V1.1 1/2. M14C32 DD. M14C32 Die Description. PRODUCT M14C32. ■ WAFER SIZE 152 mm (6 inches) ■ DIE IDENTIFICATION M14C32KA_R. ■ DIE SIZE (X x Y) 2040 x 2355 μm. ■ SCRIBE LINE 100.5 x 101.7 μm ... Labels: M14C32 |
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| 2. |  49.06 Kb • 4 Pages |
Abstract: ... The M14C32 is available in wafer form (either sawn or unsawn) and in micromodule form (on film). The M14C64 is available in micro-module. Micromodule (D22) 2. 2 2. 2. Micromodule (D20) Wafer. Figure ... Labels: M14C32 |
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| 3. |  94.63 Kb • 14 Pages |
Abstract: ... The M14C32 is available in wafer form (either sawn or unsawn) and in micromodule form (on film). The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND ... Labels: M14C32, Application Notes |
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| 4. |  125.14 Kb • 14 Pages |
Abstract: ... The M14C32 is available in wafer form (either sawn or unsawn) and in micromodule form (on film). The M14C64 is available in micro-module Figure 1. Logic Diagram. AI02217. SDA. VCC. M14xxx WC. SCL. GND ... Labels: M14C32, Application Notes |
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| 5. |  69.3 Kb • 7 Pages |
Abstract: ... M14C32 32 Kbit EEPROM (4K x 8) XI≤C 0.6 μm. M14C64 64 Kbit EEPROM (8K x 8) XI≤C 0.6 μm. M14128 128 Kbit EEPROM (16K x 8) XI≤C ST’s Hi-Endurance Double Polysilicon CMOS technology which guarantees an endurance ... Labels: M14C32, Application Notes |
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| 6. |  27.73 Kb • 2 Pages |
Abstract: ... D20 ST14C02, M14C04, M14C16, M14C32. D22 M14C64, M14128, M14256. D3 ST16ST2G, ST16600, ST16601, ST16SF41, ST16SF42. D4. ST16SF44, ST16SF48, ST16SF4F, ST16CF54B, ST19SF08, ST19SF16, ST19SF32 ... Labels: M14C32 |
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| 7. |  275.54 Kb • 13 Pages |
Abstract: ... D20 ST14C02, M14C04, M14C16, M14C32. D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding ... Labels: M14C32 |
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| 8. |  1163.36 Kb • 13 Pages |
Abstract: ... D20 ST14C02, M14C04, M14C16, M14C32. D22 M14C64, M14128, M14256. C30 M35101, M35102. C20 M35101, M35102. 2/13. MICROMODULES. The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding ... Labels: M14C32 |
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