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LPDDR2

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Agilent B4623B Bus Decoder for LPDDR, LPDDR2, or LPDDR3 Debug and Validation Data Sheet , insight using the B4623B bus decoder for LPDDR, LPDDR2, or LPDDR3 debug and validation. The B4623B , bus transactions showing associated data bursts, for all LPDDR, LPDDR2, or LPDDR3 data rates. Valid , length, CAS Latency and CAS Write Latency, Chip Selects) from default LPDDR, LPDDR2, or LPDDR3 probing configurations and/or DDR Setup Assistant tool to accelerate decode of LPDDR, LPDDR2, or LPDDR3 bus signals Agilent Technologies
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5991-1064EN
Abstract: Agilent Technologies N5413B DDR2 and LPDDR2 Compliance Test Application for Infiniium 9000 and 90000 Series Oscilloscope Data Sheet Test, debug and characterize your DDR2 and LPDDR2 designs quickly and easily The Agilent Technologies N5413B DDR2 and LPDDR2 compliance test application provides a fast and easy way to test, debug and characterize your DDR2 and LPDDR2 designs. The tests , Addendum Rev. 1.1. The tests performed by the LPDDR2 compliance test software are based on the JEDEC(1 Agilent Technologies
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JESD79-2E JESD208 DDR2-1066 JESD2092 5989-3195EN
Abstract: . 124 Figure 88: LPDDR2-466 to LPDDR2-1066 Input Signal . 125 Figure 89: LPDDR2-200 to LPDDR2-400 Input Signal , Meg x 32 x 8 banks x 4 die · Device type ­ LPDDR2-S4, 1 die in package ­ LPDDR2-S4, 2 die in package ­ LPDDR2-S4, 3 die in package ­ LPDDR2-S4, 4 die in package · FBGA "green" package ­ 134-ball FBGA (10mm x , 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1 Micron Technology
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MT42L256M32D2 MT42L128M64D2 MT42L512M32D4 MT42L256M64D4 lpddr2 DQ calibration LPDDR2 SDRAM mt42L256m16 MT42L192M64D3 253-B
Abstract: . 120 Figure 83: LPDDR2-466 to LPDDR2-1066 Input Signal . 121 Figure 84: LPDDR2-200 to LPDDR2-400 Input Signal , die · Device type ­ LPDDR2-S4, 1 die in package ­ LPDDR2-S4, 2 die in package ­ LPDDR2-S4, 3 die in package ­ LPDDR2-S4, 4 die in package · FBGA"green" package ­ 134-ball FBGA (11mm x 11.5mm) ­ 134 , containing 2,147,483,648 bits. The LPDDR2-S4 device is internally configured as an eight-bank DRAM. Each of Micron Technology
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MT42L64M64D2 MT42L128M64D4 216-ball Dual LPDDR2 LPDDR2 SDRAM micron MR63 LPDDR2 1Gb Memory MT42L128M16D1 MT42L64M32D1 MT42L128M32D2 MT42L256M32D4
Abstract: . 128 Figure 90: LPDDR2-466 to LPDDR2-1066 Input Signal . 129 Figure 91: LPDDR2-200 to LPDDR2-400 Input Signal , x 32 x 8 banks x 4 die 256M64 â'¢ Device type â'" LPDDR2-S4, 1 die in package D1 â'" LPDDR2-S4, 2 die in package D2 â'" LPDDR2-S4, 3 die in package D3 â'" LPDDR2-S4, 4 die in package D4 â , 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1 Micron Technology
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SMD MARKING CODE sdp MT42L384M32D3 256M16
Abstract: . 106 LPDDR2-466 to LPDDR2-1066 Input Signal . 107 LPDDR2-200 to LPDDR2-400 Input Signal , '" 8 Meg x 16 x 4 banks â'" 2 x 8 Meg x 16 x 4 banks â'¢ Device type â'" LPDDR2-S4, 1 die in package â'" LPDDR2-S4, 2 die in package â'¢ FBGA â'greenâ' package â'" 121-ball FBGA (6.5mm x 8mm) â , random-access memory containing 536,870,912 bits. The LPDDR2-S4 device is internally configured as an four-bank Micron Technology
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MT42L32M16D1 MT42L32M32D2 MT42L16M32D1
Abstract: . 125 Figure 90: LPDDR2-466 to LPDDR2-1066 Input Signal . 126 Figure 91: LPDDR2-200 to LPDDR2-400 Input Signal , Meg x 32 x 8 banks x 3 die 192M64 ­ 16 Meg x 32 x 8 banks x 4 die 256M64 · Device type ­ LPDDR2-S4, 1 die in package D1 ­ LPDDR2-S4, 2 die in package D2 ­ LPDDR2-S4, 3 die in package D3 ­ LPDDR2-S4, 4 die , 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1 Micron Technology
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micron lpddr2 35MR11 micron LPDDR2 X32 216-ball LPDDR MT42L256M32 MT42L256M32D 128M32 256M32 384M32 512M32 128M64
Abstract: EN LPDDR2-PCM Device LPDDR2 Device LPDDR2 Mobile LPDDR2-Specific Features â'¢ â'¢ â , : 121-Ball (LPDDR2-PCM and LPDDR2) Functional Block Diagram NV-CS# NV-CKE VDD1 LPDDR2â'"PCM , Product Brief â'" 121-Ball LPDDR2-PCM and LPDDR2 MCP Features Product Brief LPDDR2-PCM and , Features Figure 1: MCP Block Diagram Micron® LPDDR2-PCM and LPDDR2 components RoHS-compliant, â'greenâ' package Shared LPDDR2-PCM and LPDDR2 interfaces Space-saving multichip package Ultra Micron Technology
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121-B MT66R7072A10AB5ZZW MT66R7072A10ACUXZW MT66R5072A10ACUXZW 128KB 10MB/
Abstract: . 99 LPDDR2-466 to LPDDR2-1066 Input Signal . 100 LPDDR2-200 to LPDDR2-400 Input Signal , banks · Device type ­ LPDDR2-S4, 1 die in package · FBGA "green" package ­ 121-ball FBGA (6.5mm x 8mm) · , containing 536,870,912 bits. The LPDDR2-S4 device is internally configured as an four-bank DRAM. Each of the , 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features · Ultra Micron Technology
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32M16 168-B
Abstract: Features The LPDDR2 DMC features are: · supports LPDDR SDRAM, LPDDR2-S2, and LPDDR2-S4 devices · supports the variants (A and B) of LPDDR2 -S2, and LPDDR2-S4 devices · soft macrocell available in , supported, see Table 2-1 on page 2-11 supports 333MHz for LPDDR2-S2, and LPDDR2-S4 devices. Copyright , memory_cfg and memory_cfg2 Register example, for LPDDR2-S2 devices . 2-32 LPDDR device initialization example . 2-32 LPDDR2-S2 ARM
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lpddr2 datasheet micron lpddr2 datasheet Datasheet LPDDR2 SDRAM Jedec JESD209 lpddr2 phy lpddr DMC-342 ID103109
Abstract: Agilent Technologies N5413B DDR2 and LPDDR2 Compliance Test Application for Infiniium 9000 and 90000 Series Oscilloscope Data Sheet Test, debug and characterize your DDR2 and LPDDR2 designs quickly and easily The Agilent Technologies N5413B DDR2 and LPDDR2 compliance test application provides a fast and easy way to test, debug and characterize your DDR2 and LPDDR2 designs. The tests , Addendum Rev. 1.1. The tests performed by the LPDDR2 compliance test software are based on the JEDEC(1 Agilent Technologies
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ddr2 ram repair JESD209 intel lpddr2 JESD209-2 ddr ram repair JESD*208
Abstract: Semiconductor, Inc. 1/? Agenda Industry Trends: IT & Mobile LPDDR2 Effect on Battery Life DDR3 , Industry Trends: IT & Mobile LPDDR2 Effect on Battery Life DDR3 Effect on Energy Saving SSD Effect on , LPDDR2 Effect on Battery Life DDR3 Effect on Energy Saving SSD Effect on Efficiency Virtualization , Memory Bandwidth Wide I/O 12.8GB/s 9.6GB/s LPDDR2 2ch. Serial IO 6.4GB/s LPDDR2 3.2GB/s , Multi Screen `13 `14 Green LPDDR2 Introduction · From Low-density MDDR to higher density LPDDR2 Samsung Electronics
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samsung lpddr2 samsung* lpddr2 lpddr2 spec samsung toggle mode NAND lpddr1 lpddr2 samsung 12-DIMM- 640GB HS22V 288GB 192GB 320GB
Abstract: . 104 LPDDR2-466 to LPDDR2-1066 Input Signal . 105 LPDDR2-200 to LPDDR2-400 Input Signal , '" 8 Meg x 16 x 4 banks â'" 2 x 8 Meg x 16 x 4 banks â'¢ Device type â'" LPDDR2-S4, 1 die in package â'" LPDDR2-S4, 2 die in package â'¢ FBGA â'greenâ' package â'" 121-ball FBGA (6.5mm x 8mm) â , random-access memory containing 536,870,912 bits. The LPDDR2-S4 device is internally configured as an four-bank Micron Technology
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Abstract: . 120 Figure 83: LPDDR2-466 to LPDDR2-1066 Input Signal . 121 Figure 84: LPDDR2-200 to LPDDR2-400 Input Signal , die · Device type ­ LPDDR2-S4, 1 die in package ­ LPDDR2-S4, 2 die in package ­ LPDDR2-S4, 3 die in package ­ LPDDR2-S4, 4 die in package · FBGA"green" package ­ 134-ball FBGA (11mm x 11.5mm) ­ 134 , containing 2,147,483,648 bits. The LPDDR2-S4 device is internally configured as an eight-bank DRAM. Each of Micron Technology
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lpddr2-s4 ADQ28 LPDDR2 pin information micron lpddr LPDDR2 2Gb Memory lp-ddr2 MT42L96M64D3 MT42L192M32D3
Abstract: . 120 Figure 83: LPDDR2-466 to LPDDR2-1066 Input Signal . 121 Figure 84: LPDDR2-200 to LPDDR2-400 Input Signal , die · Device type ­ LPDDR2-S4, 1 die in package ­ LPDDR2-S4, 2 die in package ­ LPDDR2-S4, 3 die in package ­ LPDDR2-S4, 4 die in package · FBGA"green" package ­ 134-ball FBGA (11mm x 11.5mm) ­ 134 , containing 2,147,483,648 bits. The LPDDR2-S4 device is internally configured as an eight-bank DRAM. Each of Micron Technology
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mt42l128M32 MT42L128M32D MT42L mobile lpddr2 Lpddr2 Idd3n Micron LPDDR2 s4 vs s4a
Abstract: . 9 4 1. Introduction Mobile DRAM consists of mobile SDRAM, mobile DDR SDRAM and LPDDR2. Items Mobile SDR Mobile DDR LPDDR2 Max. Freq. (MHz) 133MHz 200MHz 400/533MHz Max , ] LPDDR2 is fastest in mobile DRAM, and PCB design guidelines is written to use LPDDR2 signals. These guidelines cover Mobile SDR/DDR as well as LPDDR2. 2. PCB Design Guidelines for Signals If one Mobile , In LPDDR2, DQ net consists of Single line(DQs) and Differential line(DQSs, /DQSs). In mobile SDR/DDR Samsung Electronics
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lpddr2 pcb design LPDDR2 SDRAM samsung LPDDR2 DRAM lpddr2 samsung datasheet LPDDR2 SDRAM memory
Abstract: . 102 LPDDR2-466 to LPDDR2-1066 Input Signal . 103 LPDDR2-200 to LPDDR2-400 Input Signal , ­ 8 Meg x 32 x 8 banks x 3 die ­ 8 Meg x 32 x 8 banks x 4 die · Device type ­ LPDDR2-S4, 2 die in package ­ LPDDR2-S4, 3 die in package ­ LPDDR2-S4, 4 die in package · FBGA"green" package ­ 240 , containing 2,147,483,648 bits. The LPDDR2-S4 device is internally configured as an eight-bank DRAM. Each of Micron Technology
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mt42L128M64D MT42 lpddr 16gb MARKING 1fe HSUL-12 BL 243 64M64 96M64
Abstract: /RLDRAM III, and LPDDR2 SDRAM. Core Specifics Supported Device Family(1) Zynqâ"¢-7000(2), Virtex , . DDR3 Component and DIMM, DDR2 Component and DIMM, QDRII+, RLDRAM II, RLDRAM III, and LPDDR2 SDRAM , Vivado Simulators are supported for DDR3 SDRAM, DDR2 SDRAM, QDRII+ SRAM, RLDRAM II, and LPDDR2 SDRAM , Interface Solutions User Guide (UG586) provided with the core. LPDDR2 SDRAM This section discusses the , LPDDR2 SDRAMs. LPDDR2 SDRAM Features â'¢ Component support for interface widths up to 32 bits â Xilinx
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lpDDR2 SODIMM DS176
Abstract: . 127 Figure 90: LPDDR2-466 to LPDDR2-1066 Input Signal . 128 Figure 91: LPDDR2-200 to LPDDR2-400 Input Signal , '¢ Device type â'" LPDDR2-S4, 1 die in package â'" LPDDR2-S4, 2 die in package â'" LPDDR2-S4, 3 die in package â'" LPDDR2-S4, 4 die in package â'¢ FBGA â'greenâ' package â'" 134-ball FBGA (10mm x 11.5mm , 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM Micron Technology
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Abstract: . 126 Figure 90: LPDDR2-466 to LPDDR2-1066 Input Signal . 127 Figure 91: LPDDR2-200 to LPDDR2-400 Input Signal , â'¢ Device type â'" LPDDR2-S4, 1 die in package â'" LPDDR2-S4, 2 die in package â'" LPDDR2-S4, 3 die in package â'" LPDDR2-S4, 4 die in package â'¢ FBGA â'greenâ' package â'" 134-ball FBGA (10mm , Preliminaryâ'¡ 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile Micron Technology
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Abstract: , x16) K = 90-Ball BGA (LPSDR, x32) C = 90-Ball BGA (LPDDR, x32) A = 79-Ball BGA (LPDDR2, x16) I = 134-Ball BGA (LPDDR2, x32) Q = 168-Ball PoP-VFBGA (LPDDR2) R = 216-Ball PoP-VFBGA (LPDDR2) 3 = 240-Ball PoP-VFBGA (LPDDR2) 0 = Wafer (KGD) Note1: T =Dual Die Package (DDP) Note2: F = Quartic Die Package (QDP , balls through the package LPDDR2 12x12 PoP 1-channel 2x32 package ballout 1 2 3 4 5 6 A B C D E F G H J , according to the command truth table. CA is considered part of the command code. Input Data Mask: For LPDDR2 Nanya Technology
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NT6TL64M32AQ hynix lpddr2 ELPIDA mobile dram LPDDR2 Elpida LPDDR2 Memory hynix lpddr2 sdram Hynix 4Gb LPDDR2 LPDDR2 SDRAM hynix 64M32 533MH DDR1066 400MH DDR800
Abstract: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1 , . 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Table 2: Single Channel S4 Configuration Addressing , specifications without notice. 2011 Micron Technology, Inc. All rights reserved. 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Figure 1: 4Gb LPDDR2 Part Numbering MT 42 L 128M32 D1 GU -25 WT :A Micron Technology Product Family 42 = Mobile LPDDR2 SDRAM Design Revision :A = First generation Operating Micron Technology
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PS 229 micron LPDDR2 X16 marking wl4 ADQ-22 SMD MARKING code 4N
Abstract: Preliminaryâ'¡ 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM , Automotive Mobile LPDDR2 SDRAM Features Table 2: S4 Configuration Addressing Architecture 32 Meg x 16 , respective architecture. Part Numbering Figure 1: 512Mb LPDDR2 Part Numbering MT 42 L 32M32 , Product Family Operating Temperature 42 = Mobile LPDDR2 SDRAM IT = â'"40°C to +85°C Operating , -3 = 3.0ns, tCK RL = 5 D1 = LPDDR2, 1 die D2 = LPDDR2, 2 die Package Codes AB = 121-ball FBGA Micron Technology
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Abstract: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1 , without notice. 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Table 2: Single Channel S4 , LPDDR2 SDRAM S4 Features Figure 1: 4Gb LPDDR2 Part Numbering MT 42 L 128M32 D1 GU , Operating Temperature 42 = Mobile LPDDR2 SDRAM WT = â'"30°C to +85°C Operating Voltage AT = â , Addressing MC = 240-ball FBGA, 14mm x 14mm D1 = LPDDR2, 1 die EU, EV = 253-ball FBGA, 11mm x Micron Technology
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M1012
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