LMD8811/2AHRF9UG-XX-PF QW0905- 54X11 LMD8811AHRF9UG-XX-PF LMD8812AHRF9UG-XX-PF

Property of Ligitek Only DOT MATRIX DIGIT LED DISPLAY (1.2Inch) Pb Lead-Free Parts LMD8811/2AHRF9UG-XX-PF DATA SHEET DOC. NO :

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOT MATRIX DIGIT LED DISPLAY (1.2Inch) Pb Lead-Free Parts LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF DATA SHEET DOC. NO : QW0905- QW0905- LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF REV. : A DATE : 15 - Feb. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 1/10 Package Dimensions 8.0(0.315") 32.0(1.26") 4.0X7= 28.0(1.102") 32.0 (1.26") 3.0(0.118") 4.0X7=28.0(1.102") LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF LIGITEK 4.5± 0.5 0.51 TYP 2.54X11 54X11=27.94 (1.1") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 24.07 (0.948") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 2/10 Internal Circuit Diagram LMD8811AHRF9UG-XX-PF LMD8811AHRF9UG-XX-PF COLUMN 1 ROW PIN 1 24 23 21 2018 17 15 14 1 2 4 5 7 8 10 11 9 8 8 6 7 7 3 6 6 13 5 5 16 4 4 19 3 3 22 2 2 12 LMD8812AHRF9UG-XX-PF LMD8812AHRF9UG-XX-PF COLUMN ROW PIN 1 6 7 9 8 6 7 8 24 23 21 2018 17 15 14 1 2 4 5 7 8 10 11 3 6 5 13 5 4 16 4 3 19 3 2 22 2 1 12 GREEN RED LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/10 PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Electrical Connection PIN NO. LMD8811AHRF9UG-XX-PF LMD8811AHRF9UG-XX-PF PIN NO. LMD8811AHRF9UG-XX-PF LMD8811AHRF9UG-XX-PF 1 Cathode Column 5 (Green) 13 Anode Row 2 Cathode Column 5 (Red) 14 Cathode Column 4 (Red) 3 Anode Row 5 15 Cathode Column 4 (Green) 4 Cathode Column 6 (Green) 16 Anode Row 5 Cathode Column 6 (Red ) 17 Cathode Column 3 (Red) 6 Anode Row 6 18 Cathode Column 3 (Green) 7 Cathode Column 7 (Green) 19 Anode Row 8 Cathode Column 7 (Red) 20 Cathode Column 2 (Red) 9 Anode Row 7 21 Cathode Column 2 (Green) 10 Cathode Column 8 (Green) 22 Anode Row 1 11 Cathode Column 8 (Red) 23 Cathode Column 1 (Red) 12 Anode Row 8 24 Cathode Column 1 (Green) 4 3 2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 4/10 Electrical Connection PIN NO. LMD8812AHRF9UG-XX-PF LMD8812AHRF9UG-XX-PF PIN NO. LMD8812AHRF9UG-XX-PF LMD8812AHRF9UG-XX-PF 1 Anode Column 5 (Green) 13 Cathode Row 4 2 Anode Column 5 (Red) 14 Anode Column 4 (Red) 3 Cathode Row 5 15 Anode Column 4 (Green) 4 Anode Column 6 (Green) 16 Cathode Row 3 5 Anode Column 6 (Red ) 17 Anode Column 3 (Red) 6 Cathode Row 6 18 Anode Column 3 (Green) 7 Anode Column 7 (Green) 19 Cathode Row 2 8 Anode Column 7 (Red) 20 Anode Column 2 (Red) 9 Cathode Row 7 21 Anode Column 2 (Green) 10 Anode Column 8 (Green) 22 Cathode Row 1 11 Anode Column 8 (Red) 23 Anode Column 1 (Red) 12 Cathode Row 8 24 Anode Column 1 (Green) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 5/10 Absolute Maximum Ratings at Ta=25 Ratings Symbol Parameter UNIT HRF 9UG Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 60 mA Power Dissipation PD 75 75 mW Ir 10 A Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -25 ~ +85 Storage Temperature Tstg -25 ~ +85 Reverse Current @5V Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 Static Electricity or power surge will the Use of anti-electrosatic *glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Part Selection And Application Information(Ratings at 25) Electrical common D Vf(v) Iv(mcd) IV-M cathode (nm) (nm) Min. Typ. Max. Min. Typ. Material Emitted or anode CHIP PART NO AlGaInP AlGaInP Green AlGaInP Red AlGaInP LMD8811AHRF9UG-XX-PF LMD8811AHRF9UG-XX-PF Red Green LMD8812AHRF9UG-XX-PF LMD8812AHRF9UG-XX-PF Common Cathode 630 20 1.5 1.8 2.4 574 20 1.7 2.1 2.6 Common Anode 630 20 1.5 1.8 2.4 574 20 1.7 2.1 2.6 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 12.8 21.5 7.2 12.8 12.8 21.5 7.2 12.8 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/10 PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Dominant Wavelength D nm If=20mA Spectral Line Half-Width nm If=20mA Ir A Vr=5V Parameter Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 7/10 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 1.2 Forward Voltage@20mA Normalize @25 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 1.0 0.5 0 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Page 8/10 Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity @20mA Normalize @25 Forward Voltage@20mA Normaliz @25 Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity @20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ) Ambient Temperature( ) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/10 PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/10 PART NO. LMD8811/2AHRF9UG-XX-PF LMD8811/2AHRF9UG-XX-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750 MIL-STD-750: 1026 MIL-STD-883 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883 MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ±5 &-40 ±5 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202 MIL-STD-202: 107D MIL-STD-750 MIL-STD-750: 1051 MIL-STD-883 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ±5 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202 MIL-STD-202: 210A MIL-STD-750 MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202 MIL-STD-202: 208D MIL-STD-750 MIL-STD-750: 2026 MIL-STD-883 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202 MIL-STD-202:103B JIS C 7021: B-11