NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| XG-LGA-7002 | Ironwood Electronics | GHz LGA Sockets; IC Size X (mm): 5.3; IC Size Y (mm): 0.1; IC Size Tolerance (mm): 0.5; Top Pitch (mm): 7; IC Array X: 11; IC Array Y: 52; Max Pincount: n/a; IC Ball Height Min (mm): n/a; IC Ball Height Max (mm): 1.52; IC Total Height Max (mm): n/a; IC Ball Coplanarity (mm): 0.3; Pad diameter max (mm): yes; Backing Plate: GHz LGA Socket (ZIF); Part Description: LGA52; Max Package Code: no; Cavity Down: Flat; IC Top Surface: yes; Socket Lid: Swivel; Heat Sink: no | 
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: ULGA VFBGA VFBGA VFBGA VFBGA Wafer VFBGA LGA52 LGA52 LGA52 VFBGA ULGA ULGA FBGA FBGA FBGA FBGA ULGA ULGA FBGA FBGA FBGA Wafer FBGA VFBGA VFBGA VFBGA VFBGA VFBGA LGA52 LGA52 LGA52 VFBGA ULGA FBGA Capacity (MB) (2x = 2 Chip Select) Page Size (B ... | Original |
2 pages, |
NAND01GW3A2BKGD MT29F2G08ABDWP MT29F2G08ABD hynix nand flash MT29F4G08ABCHC samsung K9 SAMSUNG TSOP nand512w3a2cn K9F1G08U0B-P MT29F2G08ABCWP Micron MT29F8G08 MT29F4G08AAC MT29F4G08AACHC K9F5608U0D-P K9F5608U0D-F K9F5608U0D-P abstract |
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| Abstract: LGA52 12 x 17 mm (ZL) Fast block erase  Block erase time: 1.5 ms (typ)  Multiblock erase time (2 , LGA52 12 x 17 mm, 1 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 66 , . . . . . 11 LGA52 connections for NAND04G-B2D NAND04G-B2D and NAND08G-B2C NAND08G-B2C devices. . . . . . . . . . . . . . . . 12 LGA52 connections for the NAND08G-B4C NAND08G-B4C devices . . . . . . . . . . . . . . . . . . . . . . . . , mm, package outline . . . . . . . . . . . . 65 LGA52 12 x 17 mm, 1 mm pitch, package outline . . . . ... | Original |
69 pages, |
ONFI nand NAND08GW3B2C NAND04GR4B2D NAND04GR3B2D NAND04G-B2D nand flash ONFI 3.0 LGA-52 NAND04GW3B2D LGA52 NAND04G-B2D abstract |
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| Abstract: simultaneously TSOP48 TSOP48 12 x 20 mm (N) LGA LGA52 12 x 17 mm (ZL) Multiblock erase time (2 blocks , lead plastic thin small outline, 12 x 20 mm, package mechanical data. . . . . 52 LGA52 12 x 17 mm, 1 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 LGA52 , plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 52 LGA52 12 x 17 mm, 1 mm , available in TSOP48 TSOP48 (12 Ã- 20 mm) and LGA52 (12 x 17 x 0.65 mm) packages. It is shipped from the factory ... | Original |
56 pages, |
NAND08GW3C2B LGA52 NAND08GW3C2B abstract |
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| Abstract: on both planes simultaneously TSOP48 TSOP48 12 x 20 mm (N) LGA LGA52 12 x 17 mm (ZL) Memory , lead plastic thin small outline, 12 x 20 mm, package mechanical data. . . . . 52 LGA52 12 x 17 mm, 1 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 LGA52 , plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 52 LGA52 12 x 17 mm, 1 mm , available in TSOP48 TSOP48 (12 Ã- 20 mm) and LGA52 (12 x 17 x 0.65 mm) packages. They are shipped from the factory ... | Original |
56 pages, |
NAND08GW3C2B 4GW3 LGA52 datasheet abstract |
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| Abstract: performed on both planes at the same time TSOP48 TSOP48 12 x 20 mm (N) LGA52 12 x 17 mm (N) Serial , LGA52 12 x 17 mm, 1 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 57 , lead plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 56 LGA52 12 x 17 , contact your nearest Numonyx sales office. The devices are available in TSOP48 TSOP48 (12 Ã- 20 mm) and LGA52 (12 , NC No connection DU Do not use 1. On the LGA52 package, each 8-Gbit die is accessed and ... | Original |
60 pages, |
NAND16GW3C4B NAND16GW3C4A NAND16GW3 NAND08GW3C2B 16G nand flash ULGA52 nand 16g LGA52 NAND08GW3C2B abstract |
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| Abstract: : 2.5 ms (typ) LGA52 12 x 17 mm (N) Data protection  Hardware program/erase locked during , thin small outline, 12 x 20 mm, package mechanical data. . . . . 54 LGA52 12 x 17 mm, 1 mm pitch , plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 54 LGA52 12 x 17 mm, 1 mm , nearest Numonyx Sales office. The devices are available in TSOP48 TSOP48 (12 Ã- 20 mm) and LGA52 (12 x 17 x 0.65 , Power supply VSS Ground Ground NC No connection DU Do not use 1. On the LGA52 ... | Original |
58 pages, |
NAND16GW3 NAND08GW3C2A JESD97 16G nand NAND16GW3C4A LGA52 NAND08GW3C2A abstract |
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| Abstract: erase time: 2.5 ms (typ) LGA52 12 x 17 mm (N) Data protection  Hardware program/erase locked , , Package Mechanical Data. . . 54 LGA52 12 x 17 mm, 1 mm pitch, Package Mechanical Data . . . . . . . . . . , Outline, 12 x 20 mm, Package Outline . . . . . . . . . . 54 LGA52 12 x 17 mm, 1 mm pitch, Package Outline , office. The devices are available in TSOP48 TSOP48 (12 Ã- 20 mm) and LGA52 (12 x 17 x 0.65 mm) packages. To meet , connection DU Do not use 1. On the LGA52 package, each 8-Gbit die is accessed and controlled via two ... | Original |
58 pages, |
uLGA 16G nand flash 8Gb 64 gbit nand flash bad block management in mlc IBIS Models JESD97 16G nand NAND08GW3C2A nand16gw3 NAND16GW3C4A 16gb TSOP48 outline LGA-52 NAND08GW3C2A abstract |
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| Abstract: 8-bit/16-bit*2 IC Technology Controller Package (mm x mm) 0.18um LGA-52pin 3.0 x 7.6 *1 ... | Original |
18 pages, |
toshiba flash memory 8gb FBD_PAD hynix nand flash 4Gb spi flash 1gb Micron NAND Flash MLC Die Samsung 8Gb MLC SD Samsung 8Gb MLC PS4043S nand flash HYNIX MLC phison nand flash spi flash memory 8gb hynix nand flash 2gb datasheet abstract |
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| Abstract: RELIABILITY DATA LTM4600 LTM4600 / LTM4601 LTM4601 / LTM4601A LTM4601A / LTM4602 LTM4602 / LTM4603 LTM4603 / LTM4604 LTM4604 / LTM4605 LTM4605 / LTM4606 LTM4606 / LTM4607 LTM4607 / LTM4608 LTM4608 / LTM4609 LTM4609 / LTM4611 LTM4611 / LTM4612 LTM4612 / LTM4614 LTM4614 / LTM4615 LTM4615 / LTM4616 LTM4616 / LTM4617 LTM4617 / LTM4618 LTM4618 / LTM4619 LTM4619 / LTM4620 LTM4620 / LTM4627 LTM4627 / LTM4628 LTM4628 3/14/2012 · OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS (1) EQV to +125°C NUMBER OF (2)(3) FAILURES LGA 15mmx15mm LGA 15mmx9mm 1,835 0452 1048 711 0634 0740 2,546 (4) ) · TEMP TEMP, HUMIDITY BIAS (85 (85°C/85 ... | Original |
32 pages, |
LTM4617 LTM4612 LTM4600 LTM4601 LTM4601A LTM4602 LTM4603 LTM4604 LTM4605 LTM4606 LTM4607 LTM4608 LTM4609 LTM4611 LTM4614 LTM4600 abstract |
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