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LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA visit Linear Technology - Now Part of Analog Devices
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LGA-28 land pattern

Catalog Datasheet MFG & Type PDF Document Tags

200123K

Abstract: QFN 88 land pattern APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and , Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These drawings conform with the Surface Mount Design and Land Pattern Standard (IPC-SM , the land pattern drawings in this document together with their respective Figure numbers. These , heat path for thermal performance of amplifier products. Table 1. PCB Land Pattern Drawings
Skyworks Solutions
Original

Si8235-BA-C-IS1

Abstract: LGA 32 land pattern silicon labs . . . . . . . . . . . . . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . .
Silicon Laboratories
Original

SI8233BD

Abstract: Si8237/8 . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern: 14 , . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Silicon Laboratories
Original
Abstract: . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern: 14 , . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Silicon Laboratories
Original

WBSOIC-16

Abstract: LGA land pattern . . . . . . . . . . . 40 10. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 12. Land Pattern: 16-Pin Narrow Body , . Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . .46 16. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.1. High-Side
Silicon Laboratories
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Si8232BB-B-IS

Abstract: SI8234A . . . . . . . . . . . . . . 39 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .45 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.1
Silicon Laboratories
Original

LGA land pattern

Abstract: LH2015 . . 39 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 12. Land Pattern: 14 , . . . .45 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.1. High-Side/Low-Side Driver . . . . .
Silicon Laboratories
Original

LGA-24 land pattern

Abstract: Si8233 . . . . . . . . . . . . . . 41 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , 2.25 2 10 15 20 25 VDD=12V, Vout=VDD-5V Supply Voltage (V) Figure 28. Propagation Delay vs. Load
Silicon Laboratories
Original

Si8233BB-C-IS

Abstract: LGA land pattern . . . . . . . . . . . . . . . . . . . . . . . . .40 11. Land Pattern: Wide-Body SOIC . . . . . . . , . Land Pattern: Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . 45 15. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . , Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .48 17. Land Pattern: 14 LD LGA with , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.1. RF, Magnetic, and
Silicon Laboratories
Original

SI8235

Abstract: Si8233 . . . . . . . . . . . . . . 41 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , 2.75 2.5 2.25 2 10 15 20 25 Supply Voltage (V) VDD=12V, Vout=VDD-5V Figure 28. Propagation Delay vs
Silicon Laboratories
Original

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING Lead (QFN32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71-Contact Land , . . . 99-Contact Land Grid Array (LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . 2-1 2-3 2-4 2-5 2-6 2-7 2-8 Chapter 3 71 , Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded , -Contact Land Grid Array (LGA) The Land Grid Array (LGA) package is a standard flip-chip Ball Grid Array (BGA
Freescale Semiconductor
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pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 CH370

AN3484

Abstract: MMA73x1L recommended PCB land pattern for the package. 1 13 10x0.8 6x2 6 8 14x0.6 12x1 14x0.9 Figure 2. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package OVERVIEW OF SOLDERING , pattern - 0.5 mm 0.8 mm Wider trace Cu: 0.9 x 0.6 mm sq. SM opening = PCB land pad + 0.1mm = , digital output accelerometer use the Land Grid Array (LGA) package platform. This application note , land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 5. 2. No additional
Freescale Semiconductor
Original
AN3484 MMA73x1L LGA land pattern MMA745xL LGA14 MMA73 MMA745

pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A be an identical mirror image of the bottom pattern of the IR devices, see Figure 8. The land size on , Rectifier Introduction IR BGA (Ball Grid Array) and LGA (Land Grid Array) devices are high performance , recommendations for using IR BGA devices. When using IR LGA devices, if vias are not in land pads (see Figure 4 , reference Figure 5 for different via types. If it is desired to place vias in land pads (see Figure 6 , thickness, and a via capture land of 0.64mm diameter (see Figure 5). 1.0 PCB Layout Design A
International Rectifier
Original
AN-1028 AN-1029 pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework reflow profile FOR LGA COMPONENTS JSTD033A
Abstract: openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The next figure shows an example of a 2x2 LGA part in a , to provide information about Kionixâ'™s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , generate much heat. Therefore, only electrical vias are needed. If vias are not in the land pads, capped Kionix
Original
5M-1994

MARKING T6C

Abstract: lga 1155 (4.5 × 2.5 × 1.5) Package Code NE Package Name Drawings IC Package Land Pattern , 1.5) Package Name IC Drawings Package Land Pattern 4MM 39 4-Pin Minimold (39 , Land Pattern 6MM T 6-Pin Minimold 6MM TA Note T 6-Pin Minimold 6-Pin Super , View) (Bottom View) Package Name Drawings IC Package Land Pattern 8SOP G, GR , Land Pattern 12QFN T5F 12-Pin Plastic QFN 12TQFN T5J 12-Pin Plastic TQFN 12TSQFN
NEC
Original
PX10051EJ35V0TN MARKING T6C lga 1155 package Code T6S 14SSOP M33 TRANSISTOR QFN-36 LAND PATTERN G0706

ST LGA marking code

Abstract: to provide information about Kionixâ'™s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , lands. These openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The pin 1 indicator triangle that is exposed , are needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias
Kionix
Original
ST LGA marking code
Abstract: mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , . When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , Marking and Recommended Land Pattern: Marking: Marking Explanation: ï'·ï'  Pin A1 Identifier ï'·ï'  Two digit code representing Recommended Land Pattern: the cutoff frequency as listed below , output of Land Pattern The cutoff frequency, part numbering and product marking which list the cutoff Thin Film Technology
Original
FL02M651 FL7B5BZ110S-T
Abstract: measurements. When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our , . When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , '  E0 = 14.0GHz ï'·ï'  F0 = 15.0GHz * Please call the factory for DXF output of Land Pattern The , Ground-Signal-Ground probe measurements. When mounted on the recommended land pattern, the cutoff frequency will shift , '  ï'·ï'  Cutoff frequencies between 8.0GHz and 15.0GHz* Low pass Absorptive Land Grid Array (LGA Thin Film Technology
Original
Abstract: mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The pin 1 indicator triangle that is exposed on the LGA substrate does not need to be , to provide information about Kionixâ'™s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias can be Kionix
Original

thin film filter

Abstract: T5500 ) 625-8445 / www.thin-film.com FL02M651.03 - Page 3 of 3 Marking and Recommended Land Pattern: Marking: Marking Explanation: Pin A1 Identifier Recommended Land Pattern: Two digit code representing , processing Features: Cutoff frequencies between 8.0GHz and 15.0GHz Low pass Absorptive Land Grid Array (LGA) for high bandwidth Competitive pricing Description: Thin Film Technology FL7, Land Grid , 12.0GHz D0 = 13.0GHz E0 = 14.0GHz F0 = 15.0GHz Please call the factory for DXF output of Land
Thin Film Technology
Original
thin film filter T5500
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