L77HDC62SD1CH3RC309
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock
L77HDC62SVFC309
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
L177HDC62SD1CH3F
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
L177HDC62SD1CO4R
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 62 Socket, 0.38um (15u\\) Gold, 4-40 Rear Threaded Insert, Without Boardlock
L177HRC62SVFM
Amphenol Communications Solutions
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 62 Socket, M3 Fixed Front Screwlock
L177HRC62SVF
Amphenol Communications Solutions
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 62 Socket, 4-40 Fixed Front Screwlock
