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Part : J-STD-020C Supplier : ELM Electronics Manufacturer : Chip One Exchange Stock : 8,584 Best Price : - Price Each : -
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JSTD033

Catalog Datasheet MFG & Type PDF Document Tags

J-STD-033

Abstract: JEDEC J-STD-033 , MSL, J-STD-033 1. Introduction: The following application note is a guide for handling moisture sensitive surface mount devices and is based on the IPC/JEDEC industry standard J-STD-033 available from , specification sheet and the units are Dry Packed for storage, shipping, and handling per the IPC/JEDEC J-STD-033 , sensitive devices in a low humidity environment is according to the J-STD-033 Standard, in sealed moisture , Bake-out procedure. Please refer to the complete J-STD-033 for additional details. AN-40-011 Rev.: OR
Mini-Circuits
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JEDEC J-STD-033 JSTD-033 J-STD033 JEDEC standard 033 40011 jstd J-STD-020 M129497 AN40011
Abstract: , MSL, J-STD-033 1. Introduction: The following application note is a guide for handling moisture sensitive surface mount devices and is based on the IPC/JEDEC industry standard J-STD-033 available from , specification sheet and the units are Dry Packed for storage, shipping, and handling per the IPC/JEDEC J-STD-033 , sensitive devices in a low humidity environment is according to the J-STD-033 Standard, in sealed moisture , Bake-out procedure. Please refer to the complete J-STD-033 for additional details. AN-40-011 Rev.: A Mini-Circuits
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M150261

JEDEC J-STD-033 TAPE AND REEL

Abstract: Industry Standard IPC/JEDEC J-STD-033. Table1 provides useful information for carrier tape and reels used , parts are discussed in section 4, section 5 and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 , , table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, â'Joint Industry , . Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be
RF Micro Devices
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JEDEC J-STD-033 TAPE AND REEL RFSA2534 JESD625-A MN140910

EIA-583

Abstract: JESD31 Sensitivity Classification for Nonhermetic Solid-State Surface-Mount Devices Joint IPC/JEDEC Standard J-STD-033 , identification label should be followed (see J-STD-033) for opened packages or beyond the specified storage , label for opened packages or beyond the specified storage time should be followed (see J-STD-033). If , Moisture-Sensitive Devices JEDEC Publication JEP124 (superceded by J-STD033) Military Standard MIL-STD-750, Test
Allegro MicroSystems
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JEP113 EDR4701 EIA-583 JESD31 JESD-625 JEDEC JESD31 JESD625 JESD-31 JESD22-A103 JESD22-A112 JSTD-020 JESD22-B102 MIL-STD-883

J-STD-033 PCB

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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RF5500 J-STD-033 PCB Multicore CR39 SN62 PB36 ag2 rework station diagram IPC-020b-5-1 2002/95/EC 5500010B

beta transformer LPB-5015

Abstract: LPB-5015 24 hours. These parts are provided dry-packed in accordance with J-STD-033. Tape and Reel packaging , Classification for Non-IC components) and Dry-Packed in accordance with JSTD-033 (Standard for handling, packing , provided dry-packed in accordance with J-STD-033. Tape and Reel packaging is available upon request , Dry-Packed in accordance with JSTD-033 (Standard for handling, packing, shipping and use of Moisture/Reflow
Data Device
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LPB-5000 beta transformer LPB-5015 LPB-5015 LPB 5015 LPB-5012 IPC-9503 MIL-STD-1553 MIL-STD-1553A MIL-PRF-21038 MIL-STD-202 L-12/06-0
Abstract: ) per J-STD-033. Level 2a testing specifies a floor life of 4 weeks at 30 °C and 60 % relative , recommendations please refer to J-STD-033. Conformal coated series: 591D, 592D, 592W, 195D, 695D, 594D, 595D Vishay Sprague
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J-STD-020D CWR06 CWR16 CWR26 793DX CWR11

JEDEC J-STD-033

Abstract: J-STD-033 Standard IPC/ JEDEC J-STD-033. y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF2057 jedec JESD625-a 96SCAGS89 multicore solder paste 62 JESD625A SN62 cr39

JEDEC J-STD-033

Abstract: RF2059 Standard IPC/ JEDEC J-STD-033. y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF2059 GETEK FR4

JEDEC J-STD-033

Abstract: SPT 3Mâ"¢ Humidity Indicator Cards (HICs) for IPC/JEDEC J-STD-033 IPC/JEDEC will soon release Revision B of the J-STD-033 standard for dry packaging surface mount devices. A new HIC will be required , card meets the IPC/JEDEC J-STD033A standard. Card Size: 2â' x 3â' inches Indicates: 5,10,15% Packing: 125 cards in an air-tight can. This card meets the future release of IPC/ JEDEC J-STD-033B , with IPC/JEDEC J-STD-033A. Specifications Materials: Accuracy: Tolerance: 75Â
3M Electronic Solutions
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51060HIC125 51015HIC125 3HIC125 4HIC100 6HIC200 125/C

RF2051TR13

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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RF2051 RF2051TR13 RFMD RF2051
Abstract: within _ hours of factory conditions ≤ 30°C/60% RH, or b. Stored per J-STD-033 Devices require , at 23 ± 5°C b. 3a or 3b are not met If baking is required, refer to IPC/JEDEC J-STD-033 for bake CML Microcircuits
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96SCAGS89

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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RF2053 multicore solder paste moisture handling

JESD625-a

Abstract: Multicore CR39 to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-1033 SUF-1033010A

rf2052

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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rf2052 RFMD RF2052 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RF2052
Abstract: more than 90 seconds. These parts are provided dry packed in accordance with J-STD-033. Tape and Reel , Dry-Packed in accordance with JSTD-033 (Standard for handling, packing, shipping and use of Moisture /Reflow , processing. Dried transformers must be reflowed within 24 hours. J-STD-033 preconditioning (dry-pack) can be , Classification for Non-IC components) and Dry-Packed in accordance with JSTD-033 (Standard for handling, packing Data Device
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SLP-8200

JEDEC J-STD-033

Abstract: J-STD-033 and materials used meet the requirements defined in IPC/JEDEC J-STD-033. Moisture Barrier Bag. The moisture barrier bag used for Spansion products is in compliance with IPC/ JEDEC J-STD-033. It is designed , before use. Refer to IPC/JEDEC J-STD-033 for the bake procedure if the device carrier cannot withstand
Spansion
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MIL-I-18835 ASTM 1249 molecular sieve MIL-PRF-81705D F-1249 D-3464
Abstract: , Vishay has decided to implement vacuum seal packaging with dry pack, as required for MSL 3 per J-STD-033 , to order the above listed series in a dry pack as per the J-STD-033 standard. While our capacitors Vishay Intertechnology
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RF119

Abstract: JESD625-A to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF119 RF1195 RF11950201

JEDEC J-STD-033 TAPE AND REEL

Abstract: JEDEC J-STD-033 , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-5033 SUF-5033010B

JESD625-A

Abstract: SUF-8533 , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-8533 SUF-8533010B

RF1194

Abstract: RF1194TR7 to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF1194 RF1194TR7 RF1194TR13 smt pcb ipc standard RF11940201

J-STD-020B

Abstract: J-STD-033 /JEDEC J-STD-020B and J-STD-033. WS1413 is MSL3. Thus, according to the J-STD-033 p.11 the maximum , barrier bag is 12 months at , hours J-STD-033 p.8. Removal for Failure Analysis Not following the above requirements may cause
Avago Technologies
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2000-1X/EVDO JESD22-A120 5989-2539EN AV01-0146EN

IPC-7711

Abstract: J-STD-020B a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. WS1102 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time (MET) for , moisture barrier bag is 12 months at , J-STD-033 p.8. CAUTION: Tape and reel materials typically cannot be baked at the temperature described
Agilent Technologies
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IPC-7711 WS1102-TR1 CDMA2000-1X/EVDO 5989-3045EN 5989-3663EN

JEDEC J-STD-033

Abstract: power amplifier circuit diagram with pcb layout to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. WS1113 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time (MET) for this part is 168 hours , sealed moisture barrier bag is 12 months at , conditions are 125oC for 12 hours J-STD-033 p.8. CAUTION: Tape and reel materials typically cannot be baked
Agilent Technologies
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power amplifier circuit diagram with pcb layout SMD MARKING CODE pam marking code B0 SMD diode marking code C5 power resistor 0,25 ohms encapsulated schematics for a PA amplifier class c 5989-2533EN

IPC-7721

Abstract: IPC-7711 classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. WS1311 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time (MET) for this part is , . Shelf life in a sealed moisture barrier bag is 12 months at , conditions are 125oC for 24 hours J-STD-033 p.8. CAUTION: Tape and reel materials typically cannot be baked
WAVICS
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IPC-7721 IPC 7721 1750-1780MH 2000-1X

IPC-7721

Abstract: JEDEC J-STD-033 TAPE AND REEL /JEDEC J-STD-020B and J-STD-033. WS1411 is MSL3. Thus, according to the J-STD-033 p.11 the maximum , (RH) J-STD-033 p.7. 3-1. Out-of-Bag Time Duration After unpacking the device must be soldered to the , satisfied. The baking conditions are 125oC for 24 hours J-STD-033 p.8. CAUTION: Tape and reel materials
WAVICS
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1850-1910MH WM-0407-03
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