NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Thermal Conductivity Test Board : JESD51-3/7 Area Array Thermal Test Board : JESD51-9 The Leader in , Resistance, ja - Natural Convection(using test chamber) : JEDEC Standard JESD51-2 - Forced Convection(using wind tunnel) : JEDEC Standard JESD51-6 Junction-to-Case Thermal Resistance, jc - Cold Plate Method ... | Original |
2 pages, |
thermal resistance JESD51 JESD51-3 JESD51-6 G30-88 JESD-51 JESD51-9 JESD51-2 datasheet abstract |
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| Abstract: JESD51-8 and JESD51-12 for more detailed specifications on this parameter. Designers can determine JB and , Packages JESD51-4: Thermal Test Chip Guideline (Wire Bond Type Chip) JESD51-5: Extension of Thermal Test , thermal-characterization parameter, measured in units of °C/W. The JESD51-12, Guidelines for Reporting and Using Package , Semiconductor Device) JESD51-1: Integrated Circuit Thermal Measurement Method-Electrical Test Method (Single Semiconductor Device) JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions-Natural ... | Original |
6 pages, |
JESD51-8 JESD51-2 JESD51-3 JESD51-5 JEDEC JESD51-8 JESD51-4 JESD-51 JESD51-7 JESD51-1 JESD51 JESD51-12 datasheet abstract |
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| Abstract: "JEDEC 1S" board. In addition to the above mentioned JEDEC specifications, JESD51-5 should be , will result in lower (better) thermal resistance values than a 1S or SEMI board. [3] EIA/JESD51-2 , provided. [2] EIA/JESD51-1 Integrated circuit thermal measurement method - electrical test method. [4] EIA/JESD51-6 Integrated circuit thermal test method environmental conditions - forced convection (moving air). [5] EIA/JESD51-3 Low effective thermal conductivity test board for leaded surface mount ... | Original |
3 pages, |
thermal resistance standards TB379 JESD51-5 JESD-51-1 G30-88 JESD-51 JESD51-1 JESD51-7 TB379 abstract |
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| Abstract: Soldermast openings NOTES: 1.Per JEDEC JESD51-2 at natural convection, still air condition. 2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3.Per JEDEC JESD51-8, with the board temperature on the center trace near the center lead. 4.Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5.Thermal resistance between the die junction and the exposed pad surface; cold plate attached , Thermal Attachment According to JESD51-5 A Tab AGND FS IN1 V+ V+ OUT1 OUT1 FB PGND PGND ... | Original |
4 pages, |
MC33887 JESD51-3 JESD51-2 jesd51 8 JESD51-7 HSOP 30 JESD51-5 JESD-51-5 MC33887DHTAD MC33887DHTAD abstract |
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| Abstract: ), (3) 9.0 RJA (1), (4) 69 RJC (5) 1.0 2.0 Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the center lead. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the , Thermal Attachment According to JESD51-5 A AGND SF IN1 VBAT VBAT OUT1 OUT1 COD PGND PGND ... | Original |
4 pages, |
MC33186 JESD51-3 JESD51-2 jesd51 8 JEDEC JESD51-8 JESD51-7 JESD51-5 JESD-51-5 MC33186DHTAD MC33186DHTAD abstract |
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| Abstract: NOTES: Soldermast openings 1.Per JEDEC JESD51-2 at natural convection, still air condition. 2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3.Per JEDEC JESD51-8, with the board temperature on the center trace near the center lead. 4.Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5.Thermal resistance between the die junction and the exposed pad surface; cold plate , Direct Thermal Attachment According to JESD51-5 A AGND FS IN1 V+ V+ OUT1 OUT1 DNC PGND ... | Original |
4 pages, |
MC33886 JESD51-7 JESD51-3 JESD51-2 jesd51 8 JESD51 JESD51-5 MC33886DHTAD MC33886DHTAD abstract |
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| Abstract: JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance , buried plane Figure 1. Thermal Land Pattern for Direct Thermal Attachment per JESD51-5 A VBAT ... | Original |
4 pages, |
MC33486A MC33486 JESD51-5 JESD51-2 JEDEC JESD51-8 MC33486ADHTAD RJA11 RJA12 MC33486ADHTAD abstract |
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| Abstract: dap11 0.09 ) JEDEC EIA/JESD51-3 Figure 1 4 PCB DAP TO-263 JA DAP JEDEC EIA/JESD51-5 EIA/JESD51-7 Figure 3 4 PCB DAP DAP JEDEC EIA/JESD51-5 EIA/JESD51-7 , ) Note 4: (TA) (PD) (TJ(MAX) (JA) JA 2 PCB (EIA/JESD51-3) Note 5: VADJ , 67 /W JC 2 /W JA 67 /W DAP PCB 1 0.055 (0.22 Ã- 0.25 ) JEDEC EIA/JESD51-3 ... | Original |
13 pages, |
JESD22-A114 JESD-51 dap 010 AN-1378 "thermal via" JESD51-3 LP38511-ADJ LP38511-ADJ abstract |
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| Abstract: (5) Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad, "infinite" heat sink ... | Original |
4 pages, |
trace heating junction Box JESD51-5 JESD51-2 JESD-51 98ARL10521D 33982B MC33982PNATAD MC33982PNATAD abstract |
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| Abstract: 1.0 RJCmn (5) 1.0 Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the , JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad ... | Original |
4 pages, |
JESD51-5 JESD51-2 JEDEC JESD51-8 MC33874PNATAD 33874PNA RJA11 RJA12 RJA21 RJA22 MC33874PNATAD abstract |
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| Abstract: : 1187 - " (LLP)" * JEDEC LLP - JESD51-7SOT-23 - JESD51-3 LLP 10LLP 10LLP 656LLP 656LLP LLP http ... | Original |
2 pages, |
LM2750 JESD51-3 z405 LM2750LLP LM2750LLP abstract |
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| Abstract: thermal resistance (Theta-JA or RJA per JEDEC JESD51-2 [5]) is a one-dimensional value that measures the , convection environment. The 1s test board is designed per JEDEC JESD51-3 [6] and JEDEC JESD51-5 [7]. Another , two internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 [7] and JEDEC JESD51 , board. Junction-to-board thermal resistance (Theta-JB or RJB per JEDEC EIA/JESD51-8 [9]) is also , resistance. 2. Per SEMI G38-87 G38-87 and JEDEC JESD51-2 with the single layer board horizontal. Single layer board ... | Original |
10 pages, |
QFN PACKAGE thermal resistance G38-87 JEDEC bga case outline JEDEC JESD51-8 JESD-51-5 JESD51-2 JESD51-3 MO-166 MUlti-Strand Wire AN2388 JESD51-7 jesd51 8 JESD51-5 AN2388 abstract |
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| Abstract: thermal resistance (Theta-JA or RJA per JEDEC JESD51-2 [5]) is a one-dimensional value that measures the , convection environment. The 1s test board is designed per JEDEC JESD51-3 [6] and JEDEC JESD51-5 [7]. Another , two internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 [7] and JEDEC JESD51-7 [8]. RJA and RJMA help bound the thermal performance of the HSOP package in a customer's , board. Junction-to-board thermal resistance (Theta-JB or RJB per JEDEC EIA/JESD51-8 [9]) is also ... | Original |
12 pages, |
QFN PACKAGE thermal resistance G38-87 JEDEC JESD51-8 JEDEC-STD-020 36-Ld JESD51-2 JESD51-3 JESD51-7 MO-166 JESD-51 HSOP 30 outline of the heat slug for JEDEC jesd51 8 AN2388/D AN2388/D abstract |
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| , and the board thermal resistance. 2. Per SEMI G38-87 G38-87 G38-87 G38-87 and JESD51-2 with the board horizontal. °C/W BGA the board, and the board thermal resistance. 4. Per JESD51-6 with the board horizontal. °C/W BGA package top and the junction temperature per EIA/JESD51-2. °C/W USER'S MANUAL Revised 15 September 1999 G The thermal characterization parameter is measured per JESD51-2 characteristic published by JEDEC www.datasheetarchive.com/download/23307443-484153ZC/mpc555um.zip (appg.pdf) |
Motorola | 16/02/2000 | 5718.84 Kb | ZIP | mpc555um.zip |