500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : AES-Z7-JESD3-G Supplier : Avnet Catalog Manufacturer : Avnet Stock : 23 Best Price : - Price Each : -
Part : EF-DI-JESD204-SITE Supplier : Xilinx Manufacturer : Avnet Stock : - Best Price : $6790.00 Price Each : $6790.00
Part : EFR-DI-JESD204-SITE Supplier : Xilinx Manufacturer : Avnet Stock : - Best Price : $1,412.3200 Price Each : $1,412.3200
Part : PJESD5V6LC-4T/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0644 Price Each : €0.1289
Part : PJESD5V6LC-4T/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0644 Price Each : €0.1289
Part : PJESD5V6LC-4WT/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD5V6LC-4WT/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD5V6LC-5WT/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD5V6LC-5WT/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD6V2LC-4T/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0644 Price Each : €0.1289
Part : PJESD6V2LC-4T/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0644 Price Each : €0.1289
Part : PJESD6V2LC-4WT/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD6V2LC-4WT/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD6V2LCQ5G_R1_00001 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : PJESD6V8LC-4WT/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD6V8LC-4WT/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0583 Price Each : €0.1166
Part : PJESD6V8LCQ4G_R1_00001 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : PJESDA5V6-4GT/R13 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0550 Price Each : €0.11
Part : PJESDA5V6-5LCG_R1_00001 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0506 Price Each : €0.1011
Part : PJESDA6V2-4GT/R7 Supplier : PanJit International Manufacturer : Avnet Stock : - Best Price : €0.0550 Price Each : €0.11
Part : AD-FMCJESDADC1-EBZ Supplier : Analog Devices Manufacturer : Newark element14 Stock : - Best Price : $630.50 Price Each : $630.50
Part : PK2N-2DJE-SD Supplier : Prolight Opto Technology Manufacturer : TME Electronic Components Stock : 283 Best Price : $1.37 Price Each : $1.71
Part : PK2N-2JJE-SD Supplier : Prolight Opto Technology Manufacturer : TME Electronic Components Stock : 50 Best Price : $1.01 Price Each : $1.50
Part : PK2N-2LJE-SD Supplier : Prolight Opto Technology Manufacturer : TME Electronic Components Stock : 1,271 Best Price : $0.7960 Price Each : $1.01
Part : PM2B-2LJE-SD Supplier : Prolight Opto Technology Manufacturer : TME Electronic Components Stock : 50 Best Price : $1.08 Price Each : $1.60
Part : AD-FMCJESDADC1-EBZ Supplier : Analog Devices Manufacturer : element14 Asia-Pacific Stock : - Best Price : $953.6160 Price Each : $953.6160
Part : JESD-204A-E3-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-204A-E3-UT Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
Part : JESD-204B-E3-U1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-204B-E3-UT1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
Part : JESD-204B-E5-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-204B-E5-UT Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
Part : JESD-204B-E5G-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,268.5100 Price Each : $1,268.5100
Part : JESD-204B-E5G-UT Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,804.0601 Price Each : $3,804.0601
Part : JESD-207-E3-U1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-207-E3-UT1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
Shipping cost not included. Currency conversions are estimated. 

JESD51-5

Catalog Datasheet MFG & Type PDF Document Tags

JESD51-5

Abstract: JESD-51-5 . 2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3.Per JEDEC JESD51-8, with the board , -3 and JESD51-5. 5.Thermal resistance between the die junction and the exposed pad surface; cold plate , Direct Thermal Attachment According to JESD51-5 A AGND FS IN1 V+ V+ OUT1 OUT1 DNC PGND
Freescale Semiconductor
Original
MC33886 JESD51-2 JESD-51-5 JESD-51 jesd51 8 JEDEC JESD51-8 JESD51 MC33886DHTAD 33886DH 20-TERMINAL 98ASH70702A

33186DH

Abstract: JESD51 Pattern for Direct Thermal Attachment According to JESD51-5 1.Per JEDEC JESD51-2 at natural convection, still air condition. 2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3.Per JEDEC JESD51 , per JEDEC JESD51-3 and JESD51-5. 5.Thermal resistance between the die junction and the exposed pad
Freescale Semiconductor
Original
33186DH MC33186DHTAD MC33186 98ASH70273A

JESD51

Abstract: JESD51-2 -7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between , Figure 1. Thermal Land Pattern for Direct Thermal Attachment per JESD51-5 A VBAT GND 1 20
Freescale Semiconductor
Original
MC33486 MC33486A MC33486ADHTAD 33486ADH RJA11 RJA12

JESD-51-5

Abstract: JESD51-5 thermal test board per JEDEC JESD51-5 and JESD51-7. 3.Per JEDEC JESD51-8, with the board temperature on , JESD51-5. 5.Thermal resistance between the die junction and the exposed pad surface; cold plate , Thermal Attachment According to JESD51-5 A Tab AGND FS IN1 V+ V+ OUT1 OUT1 FB PGND PGND
Freescale Semiconductor
Original
MC33887 HSOP 30 MC33887DHTAD 33887DH

JEDEC JESD51-8 BGA

Abstract: JESD51-8 convection environment. The 1s test board is designed per JEDEC JESD51-3 [6] and JEDEC JESD51-5 [7]. Another , two internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 [7] and JEDEC JESD51 , is designed per JEDEC JESD51-3 and JEDEC JESD51-5. 3. Per JEDEC JESD51-6 with the board horizontal. 2s2p board is designed per JEDEC EIA/JESD51-5 and JEDEC JESD51-7. 4. Thermal resistance between the , surface of the board near the package. 2s2p board is designed per JEDEC JESD51-5 and JEDEC JESD51-7. 5
Freescale Semiconductor
Original
AN2388 JEDEC JESD51-8 BGA 800E-02 G38-87 BGA PACKAGE thermal resistance Freescale 44LD QFN PACKAGE thermal resistance

JESD-51-5

Abstract: JESD51-5 convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3. Per JEDEC , test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the , Thermal Attachment According to JESD51-5 A AGND SF IN1 VBAT VBAT OUT1 OUT1 COD PGND PGND
Freescale Semiconductor
Original
MC33186DH

JESD51-5

Abstract: JESD-51-5 JESD51-5 [7]. Another thermal resistance that is commonly reported is Theta-JMA or RJMA on a board with two signal layers and two internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 , board horizontal. Single layer board is designed per JEDEC JESD51-3 and JEDEC JESD51-5. 3. Per JEDEC JESD51-6 with the board horizontal. 2s2p board is designed per JEDEC EIA/JESD51-5 and JEDEC JESD51-7. 4 , measured on the top surface of the board near the package. 2s2p board is designed per JEDEC JESD51-5 and
Motorola
Original
outline of the heat slug for JEDEC MO-166 36-Ld JEDEC-STD-020 AN2388/D

JESD51-5

Abstract: JESD-51-5 condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the , JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad , Figure 1. Thermal Land Pattern for Direct Thermal Attachment Per JEDEC JESD51-5 PTC4/OSC1 PTC3/OSC2
Freescale Semiconductor
Original
MM908E621 908E621 RJ21 connector 908E621ACDWBTAD 908E621ACDWB 54-TERMINAL RJA21 RJA22

MTTF analysis data

Abstract: JEDEC JESD51-8 BGA resistance (Theta-JA or RJA per JEDEC JESD51-5 [1]) is a one-dimensional value that measures the conduction , internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 [1] and JEDEC JESD51-7 [2]. , resistance. 2. Per JEDEC JESD51-6 with the board horizontal. 2s2p board is designed per JEDEC EIA/JESD51-5 , lead package, the adjacent lead is used. 2s2p board is designed per JEDEC JESD51-5 and JEDEC JESD51 , 9.0 REFERENCE [1] EIA/JESD51-5, "Extension of Thermal Test Board Standards for Packages with Direct
Motorola
Original
MTTF analysis data JESD51-51 98ARL10519D SOICW-32 1147 x motorola AN2409/D
Abstract: (Theta-JA or RJA per JEDEC JESD51-5 [1]) is a one-dimensional value that measures the conduction of heat , internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 [1] and JEDEC JESD51-7 [2]. , resistance. 2. Per JEDEC JESD51-6 with the board horizontal. 2s2p board is designed per JEDEC EIA/JESD51-5 , lead package, the adjacent lead is used. 2s2p board is designed per JEDEC JESD51-5 and JEDEC JESD51 , Freescale Semiconductor References 9.0 References (1) EIA/JESD51-5, â'Extension of Thermal Test Freescale Semiconductor
Original
AN2409

908E625

Abstract: 908E625ACDWB air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51 , board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed , mm Exposed Pad Figure 1. Thermal Land Pattern for Direct Thermal Attachment Per JEDEC JESD51-5
Freescale Semiconductor
Original
908E625ACDWB MM908E625 908E625 908E625ACDWBTAD 98ARL105910

dap 010

Abstract: JESD51-3 ) JEDEC EIA/JESD51-3 Figure 1 4 PCB DAP TO-263 JA DAP JEDEC EIA/JESD51-5 EIA/JESD51-7 Figure 3 4 PCB DAP DAP JEDEC EIA/JESD51-5 EIA/JESD51-7 FIGURE 1
National Semiconductor
Original
dap 010 dap11 100K adj dap 11 AN-1378 LP38511-ADJ DS300408-04-JP O-263 MRA08A

JESD51-2

Abstract: MM908E622 condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the , JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad , Figure 1. Thermal Land Pattern for Direct Thermal Attachment Per JEDEC JESD51-5 PTC4/OSC1 PTC3/OSC2
Freescale Semiconductor
Original
MM908E622 908E622ACDWBTAD 908E622ACDWB 908E622

98ARL10519D

Abstract: JESD51-5 boundary conditions. Junction-to-ambient thermal resistance (Theta-JA or RJA per JEDEC JESD51-5 [1]) is a , two signal layers and two internal planes (2s2p). The 2s2p test board is designed per JEDEC JESD51-5 , per JEDEC EIA/JESD51-5 and JEDEC JESD51-7. 3. Thermal resistance between the die and the printed , center lead. For fused lead package, the adjacent lead is used. 2s2p board is designed per JEDEC JESD51-5 , References (1) EIA/JESD51-5, "Extension of Thermal Test Board Standards for Packages with Direct Thermal
Freescale Semiconductor
Original
54ld

PAT-3

Abstract: Test-Element-Group 1785 5 2200 2750 7 2855 3570 1) 2 (ja,jt)JEDEC JESD51-5 100mm2 2 4 (ja,jt)JEDEC JESD51-5 Ver.2009-06-24 -7- 2 ja 8 TO252 SOT89 jt 4 5 ( ) 8 TO252 200
-
Original
SC88A SC82AB PAT-3 Test-Element-Group SOT23 jt SSOP10 EIA/JESD51-3/-5/-7 SC88ASC82AB

Test-Element-Group

Abstract: Thermal Test-Element-Group ) 2 (ja,jt)JEDEC JESD51-5 2 100mm 2 4 (ja,jt)JEDEC JESD51-5 Ver.2009-11-05 -7-
-
Original
Thermal Test-Element-Group QFP100-U1 JESD51-52 B1143 890 sot236 pat2

2N241

Abstract: PQFN package power freescale -7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die
Freescale Semiconductor
Original
2N241 PQFN package power freescale MC33981PNATAD MC33981 98ARL10521D 16-PIN

MC33888PNB

Abstract: RJ21 thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on , JESD51-5. 5. Thermal resistance between the die junction and the exposed pad, "infinite" heat sink
Freescale Semiconductor
Original
33888PNB MC33888 MC33888PNB RJ21 33888FB MC33888PNBTAD 36-PIN 98ARL10544D

32-PIN

Abstract: JESD51-2 JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-5 and , . 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between
Freescale Semiconductor
Original
MC33996 32-PIN MC33996DWBTAD 33996EK 98ARL10543D

SC82A

Abstract: QFP100-U1 1665 1665 1920 1920 1785 2775 3570 1) 2 (ja,jt)JEDEC JESD51-5 100mm2 2 4 (ja,jt)JEDEC JESD51-5 Ver.2010-05-06 -7- 2 ja 8 TO252 SOT89 jt 4 5 ( ) 8 TO252
New Japan Radio
Original
SC82A TVSP10 VSP10

SAC1205

Abstract: IPC-A-600G Internal Planes - 2s2p (designed per JEDEC EIA / JESD51-5 [14] and JEDEC EIA / JESD51-7 [15] Thermal , designed per JEDEC EIA/JESD51-3 and JEDEC EIA/JESD51-5. R JA helps estimate the thermal performance of the , internal planes (2s2p). The 2s2p test board is designed per JEDEC EIA/JESD51-5 and JEDEC EIA/JESD51-7. R , -3 and JEDEC EIA/JESD51-5. Per JEDEC JESD51-6 [19] with the board horizontal. Board conforms to JEDEC EIA/JESD51-5 and JEDEC EIA/JESD51-7. Thermal resistance between the die and the printed circuit
Freescale Semiconductor
Original
AN3846 SAC1205 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111

LVB-4213

Abstract: BU63133L8 , Junction-to-Board (Note 11) Heat sink soldered to PC board (2s2p - JESD51-5) Operating Case Bottom Temperature , connecting the LPCC heatsink to PCB internal plane are in accordance with JEDEC JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 for detailed PCB , ), 3.0" x 4.5". The thermal via construction follows JEDEC standard JESD51-5 with thermal vias connecting
Data Device
Original
LVB-4213 BU63133L8 BU-63133L8 MIL-STD-1553 BU-63133 MIL-STD-883 1-800-DDC-5757

BU63155

Abstract: BTTC B-3067 , Junction-to-Heatsink Thermal Resistance, Junction-to-Board (Note 11) Heat sink soldered to PC board (2s2p - JESD51-5 , are in accordance with JEDEC JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 for detailed PCB construction. (12) To calculate the loading , JESD51-5 with thermal vias connecting the top side mini-plane located under the heatsink to the upper
Data Device
Original
BU63155 BTTC B-3067 BTTC B-3300 mlp-2005 32-PAD TST-9017 BU-63155L3 BU-63155 MIL-STD-1553A 1553B

TSM-2233

Abstract: center tap transformer 18 0 18 , Junction-to-Board (Note 11) Heat sink soldered to PC board (2s2p - JESD51-5) Operating Case Bottom Temperature , JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 , sided, 2 plane PCB), 3.0" x 4.5". The thermal via construction follows JEDEC standard JESD51-5 with
Data Device
Original
TSM-2233 center tap transformer 18 0 18 A5976 G-6/10-0

DSA00312587

Abstract: B-3067 , Junction-to-Heatsink Thermal Resistance, Junction-to-Board (Note 11) Heat sink soldered to PC board (2s2p - JESD51-5 , are in accordance with JEDEC JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 for detailed PCB construction. (12) To calculate the loading , follows JEDEC standard JESD51-5 with thermal vias connecting the top side mini-plane located under the
Data Device
Original
DSA00312587 B-3067 LPB-5015 TLP1005 TST-9117 B-3310

LPB-5015

Abstract: TST-9107 soldered to PC board (2s2p - JESD51-5) Operating Case Bottom Temperature Operating Junction Temperature , are in accordance with JEDEC JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 for detailed PCB construction. (12) To calculate the loading , JESD51-5 with thermal vias connecting the top side mini-plane located under the heatsink to the upper
Data Device
Original
TST-9107 BTTC B-3067 Transformer HLP-6015

LVB-4223

Abstract: Resistance, Junction-to-Board (Note 11) Heat sink soldered to PC board (2s2p - JESD51-5) Operating Case , connecting the LPCC heatsink to PCB internal plane are in accordance with JEDEC JESD51-5 (2s2p). Each via is 0.3 mm diameter with 0.035 mm plating. Please refer to JEDEC standard JESD51-5 for detailed PCB , follows JEDEC standard JESD51-5 with thermal vias connecting the top side mini-plane located under the
Data Device
Original
LVB-4223 B-09/05-0
Showing first 20 results.