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Part : EF-DI-JESD204-PROJ Supplier : Xilinx Manufacturer : Avnet Stock : - Best Price : $4559.00 Price Each : $4559.00
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Part : JESD-204A-E3-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
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Part : JESD-204B-E5-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-204B-E5-UT Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
Part : JESD-204B-E5G-U Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,268.5100 Price Each : $1,268.5100
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Part : JESD-207-E3-U1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $1,057.0900 Price Each : $1,057.0900
Part : JESD-207-E3-UT1 Supplier : Lattice Semiconductor Manufacturer : Symmetry Electronics Stock : - Best Price : $3,170.0501 Price Each : $3,170.0501
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JESD22-B116

Catalog Datasheet MFG & Type PDF Document Tags

JESD22-B116

Abstract: MIL-STD-883 Method 2019 Test Vehicle: QLG-00-07 74LVC16245 Test Bond Pull EIA/JESD22-B116 Die Shear Mil-Std-883, Method 2019 Ball Shear EIA/JESD22-B116 Operating Life Test (Dynamic) Mil-Std-883, Method 1005 85/85
Integrated Device Technology
Original
L0007-04 74LVC16244 74LVCH162244 EIA/JESD22-B116 MIL-STD-883 Method 2019 JESD78 EIA/JESD22-A110 EIA/JESD22-A102

jesd22-b116

Abstract: L9912-04 Bond Pull EIA/JESD22-B116 Die Shear Mil-Std-883, Method 2019 Ball Shear EIA/JESD22-B116 Operating
Integrated Device Technology
Original
L9912-04 0.8um l9912 EIA/JESD78

JESD22-B116

Abstract: MIL-STD-883 method 2019 Pull EIA/JESD22-B116 Die Shear Mil-Std-883, Method 2019 Ball Shear EIA/JESD22-B116 Operating Life Test
Integrated Device Technology
Original
MIL-STD-883 PRESSURE JESD22-A110 JESD22A110

JEDEC JESD22-B116

Abstract: SUMIKON EME -883 Method 2003 EIA/JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 45 , IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA/JESD22-B116 MIL-STD-883 Method , /JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 1/18/2002 1/18/2002 1 , /JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 3/1/2002 3/1/2002 3/1
Integrated Device Technology
Original
SB-U-00-004 SB-U-03-002 SB-U-04-043 JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 G-0110-06 EME-7351LP EME-S351LP SB-U-03-003 SB-U-03-005 SB-U-02-002

9LRS3199AKLFT

Abstract: 9LvS3199aklft 77/0 Ball Shear Test JESD22-B116 5/0 5/0 5/0 Bond Pull Test IDT Spec, MAC , Hrs) JESD22-A103 76/0 - Ball Shear Test JESD22-B116 5/0 5/0 Bond Pull Test
Integrated Device Technology
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9LRS3199AKLFT 9LRS4123AKLFT 9LRS4180AKLFT 9LRS4180BKLF 9LRS4200AKLF 9LvS3199aklft 9LRS3199 9lprs 9LRS3197 9LRS4116 A0910-01 VFQFPN-20 VFQFPN-32 VFQFPN-40 VFQFPN-48 VFQFPN-56

IDT82V1671AJ

Abstract: EME-G700 JESD22-B102D JESD22-B116 JESD22-B100-B MIL-STD-883, M2019 90/0 5/0 25/0 45/0 5/0 5/0 5/0 5/0 5/0 , MIL-STD-883, M2011 JESD22-B107C JESD22-B102D JESD22-B116 JESD22-B100-B MIL-STD-883, M2019 90/0 5 , MIL-STD-883, M2015 MIL-STD-883, M2011 JESD22-B116 JESD22-B100-B MIL-STD-883, M2019 90/0 5/0 25/0
Integrated Device Technology
Original
IDT82V1671AJ EME-G700 G700LX Ablebond 8361 EME-G770 IDT7025S35JI 32H434-400BC IDTCV137PA IDT79RC32H434-400BCG IDTCV137PAG IDT79RC32T336-150BC IDTCV139PAG

JEDEC JESD22-B116

Abstract: MIL-STD-883 Method 1010 EIA/JESD22-A102 MIL-STD-883 Method 2016 MIL-STD-883 Method 2015 EIA/JESD22-B116
Integrated Device Technology
Original
G0202-01 P01-11-01 J-STD-035 J-STD-020

JESD22-B117

Abstract: F-0203-04 2011 EIA/JESD22-B116 MIL-STD-883 Method 2016 JESD22-B117 MIL-STD-883 Method 2015 Page 3 of 4
Integrated Device Technology
Original
F-0203-04 BG121 P01-03-06 72825LB15BG J-STD-20 J-STD-35

TQFP144

Abstract: TQFP-144 Test JESD22-B116 5/0 5/0 Wire Bond Pull Test Mil-Std-883 M2001 5/0 5/0 X-Ray
Integrated Device Technology
Original
82V2048 82V2058 TQFP-144 G700LY 82V2058DA 82V2058DAG TQFP144 82V2058XDAG TQFP144 DIMENSION TQFP 144 PACKAGE A1007-07 MAC-3012

sumitomo g760

Abstract: sumitomo EME G760 JESD22-B116 5/0 5/0 5/0 5/0 5/0 Bond Pull Test MIL-STD-883 Method - 2011 5/0 5/0 , 3/0 Bake and Ball Shear Test JESD22-B116 5/0 Bond Pull Test MIL-STD-883 Method -
Integrated Device Technology
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KMC3580 sumitomo g760 sumitomo EME G760 SUMITOMO EME G770 IDT75N43102S50BCG KMC-3580 IDT75N414S125BC CABGA-256 CVBGA-52/56 FPBGA-96 FPBGA-208 PBGA-119 PBGA-272/416

9lprs

Abstract: 9lprs387 Chipmos, Taiwan 44/0 Expected completion date Ball Shear Test JESD22-B116 5/0 Wire Bond
Integrated Device Technology
Original
9LPRS139 9LPRS140 9LPRS355 9LPRS397 9LPRS488 9LPRS918 9lprs387 9lprs477 9lprs365 9LRS3165 9lprs325 A0903-04 VFQFPN-64 VFQFPN-72 JESD22-A113C 9LPR309 9LPR311

ablestik 8390

Abstract: SUMItomo EME-G700 JESD22-B107C 3/0 (Pass) Solderability Test JESD22-B102-C J-STD-002 5/0 (Pass) JESD22-B116 5
Integrated Device Technology
Original
IDT72V3672L15PQFI ablestik 8390 SUMItomo EME-G700 SUMITOMO EME G700 Sumitomo EME-G700 material EME-G700 datasheet T79RC64V474-180DZ IDT79RC64V474-200DZ IDT7050L25PQF IDT7050L35PQF IDT7050S25PQF IDT7050S35PQF

JESD22-B116

Abstract: JESD22-B102-C Test JESD22-B116 5/0 JESD22-B102-C J-STD-002 5/0 Bond Pull Test MIL-STD-883, M 2011
Integrated Device Technology
Original
IDT74FCT162244ATPV IDT74FCT162245CTPV IDT74FCT162260CTPV JESD22-B100 JESD22-B105 IDT82V3001APV JESD22-B105C IDT74FCT162823CTPV IDT74FCT16501ATPV IDT74LVCH162244APV IDTQS316212PV IDT74CBTLVR16292PV IDT74FCT162827ATPV

IDTQS3861QG

Abstract: IDT49FCT3805SOG JESD22-B116 MIL-STD-883, M 2011 J-STD-035 MIL-STD-883, M 2015 J-STD-020C 5/0 5/0 25/0 3/0 5/0 5/0 , to Solvents MIL-STD-883, M 2015 3/0 Bake & Ball Shear Test JESD22-B116 5/0 Bond
Integrated Device Technology
Original
IDTQS3VH257QG IDTQS3861QG IDT49FCT3805SOG IDT74FCT162244CTPA IDT74FCT164245TPVG IDT7204L35JG IDT71028S15Y 024S25YG IDT74FCT162244CTPVG IDT74FST163211PAG IDTCV132PVG IDTQS3VH126QG IDT71124S12YG

JESD22-B105-C

Abstract: IDT71V016SA12PH 2015 3/0 3/0 JESD22-B102-C J-STD-002 3/0 3/0 JESD22-B116 5/0 5/0 Bond Pull
Integrated Device Technology
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SR-0403-01 TSOP32 JESD22-A102-C JESD22-B105-C IDT71V016SA12PH tsop package MSL JESD22-B100B PZ28 71V016SA P03-07-02 IDT71V124 JESD22-A110-B

ics633m

Abstract: ICS9112BM-17 JESD22-B116 35/0 Bond Pull Test MIL-STD-883, M2011 35/0 X-ray Examination MIL-STD-883, M2015 , ) JESD22-A102 45/0 77/0 J-STD-020 11/0 22/0 Ball Shear Test JESD22-B116 35/0 35/0
Integrated Device Technology
Original
IDTQS3VH257S1 ics633m ICS9112BM-17 ICS9155C-02CW20 EME-G600 ICS9170-01CS08 ics5342-3 MK1704A MK2712S MK5812S MK1705A MK2716S MK5814S

557g03lf

Abstract: 557G-05ALF JESD22-B116 5/0 5/0 5/0 Wire Bond Pull Test Mil-Std-883 M2001 5/0 5/0 5/0 X-ray
Integrated Device Technology
Original
557GI-03LFT 557GI-05ALFT 5V2305PGI 5V2310PGGI 664G-02T MK2308G-1HLF 557g03lf 557G-05ALF 552G-02ILNT TSSOP-64 A0903-01 G-06T 557G-08 557G-08LF 557G-08LFT 557G-08T

NCSL Z540.3

Abstract: Mil-Std-883 Wire Bond Pull Method 2011 for the Calibration of Measuring and Test Equipment. Under EIA listings Change Add EIA/JESD22-B116 , with direction to follow the procedures in accordance with EIA/JESD22-B116, Wire Bond Shear Test
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Original
STD883 MIL-STD-962 Z540-1 NCSL Z540.3 Mil-Std-883 Wire Bond Pull Method 2011 EIA-557 z5401 Z540 CH-1211

Sumitomo EME-G600 material

Abstract: Ablestik 8290 -002 5/0 5/0 JESD22-B116 5/0 5/0 JESD22-B100-B 5/0 5/0 MIL-STD-883, M2019 5/0
Integrated Device Technology
Original
Sumitomo EME-G600 material Ablestik 8290 Ablecube EME-G600 thermal conductivity ablebond 8290 Ablebond 84-1*SR4

JEDEC JESD22-B116 free

Abstract: SUMIKON EME-G700 specification 45/0 45/0 MIL-STD-883, Method 2011 5/0 5/0 EIA/JESD22-B116 5/0 5/0
Integrated Device Technology
Original
JEDEC JESD22-B116 free SUMIKON EME-G700 ablebond 3230 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time SR-0212-02

ABLEBONd 84-1

Abstract: Ablebond 84-1 LMISR4 Test JESD22-B116 5/0 5/0 Wire Bond Pull Test Mil-Std-883 M2001 5/0 5/0 X-Ray
Bourns
Original
JESD22 TISP61089HDMR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 G600 MIL-STD-883-2019 JESD22 A101 61089H 8201M 9110LDM JESD22-A113

ABLEBONd 84-1

Abstract: JESD22-B116 Test JESD22-B116 5/0 JESD22-B102-C J-STD-002 5/0 Bond Pull Test MIL-STD-883, M 2011
Bourns
Original
JESD22-A101 LMISR4 A101 9110l TISP8200MDR-S TISP8201MDR-S
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