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Part : AD-16SO-JEDEC Supplier : Ice Technology Manufacturer : Newark element14 Stock : - Best Price : - Price Each : -
Part : SKN 240/14 UNF JEDEC Supplier : SEMIKRON Manufacturer : Newark element14 Stock : - Best Price : $36.12 Price Each : $45.41
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JEDEC22

Catalog Datasheet MFG & Type PDF Document Tags

MOLDING MATERIAL MP8000

Abstract: Nitto PERFORMED Stress/Test Test Condition (Temp/Bias) Result P/F Temperature Cycle JEDEC22 , -STRESS: TC JEDEC22 COND. B, -55 TO 125C, PRECOND. DBAKE + 72 HRS 30C/60%RH CY7C611A-NC ASAT-B 2829585
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MP-8000 CY7C611 84-1LMISR4 JESD22 MOLDING MATERIAL MP8000 Nitto Nitto MP 8000 mp8000 Nitto MP8000 JESD22-A112

2420

Abstract: TSOP 48 thermal resistance Cys Solder Reflow P Temperature Cycle JEDEC22 Condition B, -40°C to 125°C Precontion , -STRESS: TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C, PRECONDITION 48 HRS PCT + 3 CYS SOLDER REFLOW 95072
Cypress Semiconductor
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2420 TSOP 48 thermal resistance 140C MIL-STD-883C CY7C199-ZC

CY101E383

Abstract: EME-6300H Reflow P Temperature Cycle JEDEC22 Condition B, -40°C to 125°C, Precondition: 48 Hrs. PCT, 3 , -STRESS: TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C, PRECONDITION 48 HOURS PCT 94346 CY101E383-JC KOREA-A
Cypress Semiconductor
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CY101E383 EME-6300H 9434 CY10E383 100E383A

HTSSL

Abstract: EME-6300H (JEDEC22, Condition B, -40°C to 125°C) Device Assy Lot# Fab Lot# 500 Cycles 1000 Cycles , ,100%RH 15 psig 12 Temperature Cycle JEDEC22, Cond. B -40C to 125C 500 Cycs 1000
Cypress Semiconductor
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CY7C188 HTSSL 93191 7C188A EME-630 CY7C19 150C/5 140C/5

CY7C264

Abstract: CY7C342 , -65°C to 150°C P Temperature Cycle JEDEC22 Condition B, -40°C to 125°C, Precondition: 48 Hrs , -STRESS: TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C CY7C342-JC KOREA-A 2432183 349411584 500 73 0 3 ESD
Cypress Semiconductor
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PLD201 CY7C264 CY7C342 P201 7c264 7c26 128-M 7C264 7C342

130C

Abstract: -STRESS: TC JEDEC22 COND. B, -40 TO 125C, PRECOND. 192 HRS 30C/60%RH CY62127VLL-BA CY62127VLL-BA
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130C 85C/85 C990501Q

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: CY7C374 Temperature Cycle JEDEC22 Condition B, -40°C to 125°C, Precondition: Dry-bake, 3 Cys Solder Reflow P , = STRESS: TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C, PRECONDITION DRY BAKED CY7C374-AC KOREA-A
Cypress Semiconductor
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CY7C374 CERAMIC PIN GRID ARRAY wire lead frame ceramic pin grid array package lead finish 7C374A FLASH22D CY7C374-JC CY7C374-YC

Hitachi PIX-8144

Abstract: Hitachi PIX 8144 , -65°C to 150°C Precondition: Dry Bake, 3 Cys Solder Relfow P Temperature Cycle JEDEC22 , -STRESS: CY7C025-JC CY7C025-JC TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C, PRECONDITION DRY-BAKE
Cypress Semiconductor
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CY7C0251 CY7C025 CY7C0241 CY7C024 CY7C145 CY7C144 Hitachi PIX-8144 Hitachi PIX 8144 Pix-8144 PIX 8144 hitachi 8144 CY7C025-AC

x 289

Abstract: CY7C455 0/152 Temperature Cycle (JEDEC22, Condition B, -40°C to 125°C) Device Assy Lot# Fab Lot , Cycle JEDEC22, cond. B -40C to 125C 300 Cycs. 1000 Cycs. 0/76 0/76 C 9113A X
Cypress Semiconductor
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CY7C445 CY7C455 CY7C456 CY7C457 x 289 455 pass band 2K CY7C446 CY7C447

CY7C372

Abstract: CY7C373 Reflow P Temperature Cycle JEDEC22 Condition B, -40°C to 125°C, Precondition: Dry-bake, 3 Cys , TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C, PRECONDITION DRY-BAKE 95508 CY7C373-JC KOREA-A 1517516
Cypress Semiconductor
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CY7C372 CY7C373 CY7C372/373 PLCC-CY7C372 LCC-CY7C372 PLCC-CY7C373 7C372A CY7C372-JC

CY7C128A SRAM

Abstract: 256K x 8 SRAM CY7C128A SRAM 74591 3139553 3141589 0/128 0/129 128 129 0/257 Temperature Cycle1 (JEDEC22, Condition , Temperature Cycle, Family Data3 (JEDEC22, Conditon B, -40°C to 125°C) Precondition 48 hours Pressure Cooker
Cypress Semiconductor
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CY7C128A CY7C167A CY7C168A CY7C169A CY7C170A CY7C171A CY7C128A SRAM 256K x 8 SRAM CY7C128A SRAM SUMITOMO EME G cy7c128 cross

ISL6745 Application Notes

Abstract: ISL6745 Model (per JEDEC22 std. Method A114-B)-Class 2 Machine Model (Per JEDEC22 std. Method A115-A
Intersil
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ISL6745 ISL6745AU ISL6745AUZ STD-020C ISL6745 Application Notes EQ-24 FN9161 ISL6745MOSFET35

ISL6745 Application Notes

Abstract: ISL6745 Model (Per JEDEC22 std. Method A114-B)-Class 2 Machine Model (Per JEDEC22 std. Method A115-A
Intersil
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ISL6745AC-DCDC-DC 1-888-INTERSIL ISO9000

TSOP Type II

Abstract: 44LD JEDEC22, Condition B, -40°C to 125°C Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs., 30
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8361H TSOP Type II 44LD 9749 cel 9200 Cypress CY7C1021-ZSC 619708845L 619708843L 619708844L

140C

Abstract: -STRESS: TC JEDEC22 COND. B, -40 TO 125C, PRECOND. 192 HRS 30C/60%RH CY7C1021-BSC CY7C1021-BSC
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CY7C1021V33-BSC

99045

Abstract: CY37512P208-NC Level 3 192 Hrs., 30°C/ 60% RH Result P/F Temperature Cycle JEDEC22, Precondition
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CY37512P208-NC 99045 copper bond wire ASE Cypress 37512P208-NC 140C/85 150C/-55C

140C

Abstract: 7C109A -STRESS: TEMP CYCLE, JEDEC22 COND. B, -40 TO 125C CY7C199-PC CY7C199-PC INDNS-O INDNS-O 3443008
Cypress Semiconductor
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CY7C109 7C109A 2KA/10KA/150A 3/R28 EME-9300 CY7C194-VC

8355F

Abstract: JESD22 Assy Loc Duration Samp Rej Failure Mechanism TC JEDEC22, CONDITION B. -55C TO 125C, PRE COND
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8355F BA48G 49-41010M 192HRS CY62146VLL-BAIB 150C/-55

cy7c9101

Abstract: CY7B145 , JEDEC22 COND. B, -40 TO 125C, PRECONDITION 48 HRS PCT CY7C9101-JC CY7C9101-JC CY7C9101-JC CY7C9101-JC
Cypress Semiconductor
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PALC22V10 CY7B145 cy7c9101 cy7c9101* Datasheet MIL-STD-883C method 2011 12955 PALC22V10/CY7C9101/CY7B145 CY7C9101/CY7B145 PALC222V10 CY7C9101

sumitomo 131 datasheet

Abstract: HTSSL Steam Test/Autoclave/PCT 25-00047 121C,100%RH 15 psig 12 Temperature Cycle JEDEC22
Cypress Semiconductor
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sumitomo 131 datasheet sumitomo epoxy PAL22V10G PAL22VP10G PLD20G10G 6B322

tsmc cmos 0.13 um sram

Abstract: TSMC 90nm sram PERFORMED Stress/Test Test Condition (Temp/Bias) Result P/F Temperature Cycle JEDEC22 , -STRESS: TC JEDEC22 COND. B, -55 TO 125C, PRECOND. DBAKE + 72 HRS 30C/60%RH CY7C611A-NC ASAT-B 2829585
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tsmc cmos 0.13 um sram TSMC 90nm sram ford ppap EMMI microscope TSMC 0.13um process specification PPAP MANUAL for automotive industry

"32K x 32" SRAM

Abstract: 84-1MISR4 , JEDEC22 COND. B, -40 TO 125C, PRECONDITION 48 HRS PCT CY7C9101-JC CY7C9101-JC CY7C9101-JC CY7C9101-JC
Cypress Semiconductor
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84-1MISR4 CY7C1335/CY7C1337 CY7C1335/1337 7C1335A W/500 CY7C1335-AC

PPAP level submission requirement table

Abstract: INCOMING MATERIAL INSPECTION checklist, PCB Model (per JEDEC22 std. Method A114-B)-Class 2 Machine Model (Per JEDEC22 std. Method A115-A
Integrated Silicon Solution
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PPAP level submission requirement table INCOMING MATERIAL INSPECTION checklist, PCB SMD a006 foundry metals quality MANUALS result of 200 prize bond foundry INCOMING MATERIAL INSPECTION procedure 2002/95/EC 2006/122/EC J-STD-020C

CY7C185-PC

Abstract: d282c . . . . . . . . .1A ESD Classification Human Body Model (Per JEDEC22 std. Method A114-B) . Class 2 Machine Model (Per JEDEC22 std. Method A115-A). . . . .Class A Thermal Information Thermal Resistance
Cypress Semiconductor
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CY7C185 CY7C185-PC d282c contact spiking mos m34004 CY7C161/A CY7C162/A CY7C164/A CY7C166/A CY7C185/A CY7C187/A

MO-187-BA

Abstract: -STRESS: TC JEDEC22 COND. B, -40 TO 125C, PRECOND. 192 HRS 30C/60%RH CY62127VLL-BA CY62127VLL-BA
Intersil
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MO-187-BA MSOP-10
Abstract: Model (Per JEDEC22 std. Method A114-B)-Class 2 Machine Model (Per JEDEC22 std. Method A115-A Intersil
Original
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