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HM1-65642B/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28 visit Intersil
24502BVA Intersil Corporation 1KX4 STANDARD SRAM, 120ns, CDIP18 visit Intersil
8403603JA Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil
HM1-65162C/883 Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil
ISL6842IBZ Intersil Corporation Improved Industry-Standard Single-Ended PWM Controller; SOIC8; Temp Range: -40° to 85°C visit Intersil Buy
ISL8500IRZ-T Intersil Corporation 2A Standard Buck PWM Regulator; DFN12; Temp Range: -40° to 85°C visit Intersil Buy

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JEDEC-J-STD-033

Catalog Datasheet MFG & Type PDF Document Tags

JEDEC J-STD-033

Abstract: JEDEC-J-STD-020 at , high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure
Peregrine Semiconductor
Original
JEDEC J-STD-033 JEDEC-J-STD-020 JEDECJ-STD-033 IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-033

JEDEC-J-STD-033

Abstract: 48-QFN Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Control Procedure and , temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005
Peregrine Semiconductor
Original
PE3335 48-QFN PE3335EK QFN48
Abstract: , reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Peregrine Semiconductor
Original
PE3336 PE3236

B10D1

Abstract: temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033
Peregrine Semiconductor
Original
B10D1

VCO 1.5 GHz

Abstract: PE3238-44PLCC-EVAL temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. Document No. 70-0031-03 www.psemi.com ©2003-2005
Peregrine Semiconductor
Original
VCO 1.5 GHz PE3238-44PLCC-EVAL phas locked loop PE3238 Q3236
Abstract: temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Peregrine Semiconductor
Original

PE3336EK

Abstract: PE3336-44PLCC-27A temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005 Peregrine Semiconductor Corp. All rights
Peregrine Semiconductor
Original
PE3336EK PE3336-44PLCC-27A pe3336-48qfn 3336-21 fp13 PE3336-44PLCC-500C
Abstract: Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Control Procedure and , temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Document Peregrine Semiconductor
Original
Abstract: /JEDEC-J-STD-033 2. Peak package body temperature is 225 ° C. Operator must observe ESD precautions per , bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Document No. 70-0026-04 Peregrine Semiconductor
Original

PE3336EK

Abstract: are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD
Peregrine Semiconductor
Original

PCB design

Abstract: thermal pcb guidelines ANTISTATIC TUBES, PARTS BAKED AND DRY PACKED IAW IPC/JEDEC-J-STD-033B MOISTURE SENSTIVITY LEVEL =3
Skyworks Solutions
Original
PCB design thermal pcb guidelines LGA voiding SMT reflow profile 101752G

SMT reflow profile

Abstract: PCB design /JEDECJ-STD-033A. The following table provides useful information for carrier tape and reels used for shipping
Skyworks Solutions
Original
pcb design of a radio PCB-Design guideline for mobile phone pcb warpage in ipc standard 101752I
Abstract: , table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful Pulse Electronics
Original
TM1250HSB5

390R-5

Abstract: A00025 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for
RF Micro Devices
Original
390R-5 A00025 RF3805 GSM/EDGE/CDMA2000 GSM/EDGE1800 CDMA2000 IPC/JEDECJ-STD-033A RF3805TR13

920mhz

Abstract: section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table
RF Micro Devices
Original
920mhz RF3807G RF3807 450MH 2700MH GSM850 GSM900

RF S-parameters

Abstract: A00025 Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for
RF Micro Devices
Original
RF S-parameters RF3800G RF3800 150MH 960MH RF3800PCBA-416 DS080703
Abstract: Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for RF Micro Devices
Original
CDMA2000/W-CDMA RF3800TR13 RF3800TR7 EIA-481

msl 9350

Abstract: , devices may be baked according to section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A
RF Micro Devices
Original
msl 9350 RF3802 AMPS/GSM850/EDGE850 GSM900/EDGE900 IS-95/CDMA2000/AMPS
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