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JEDEC-J-STD-033

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: at , high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure Peregrine Semiconductor
Original
JEDEC J-STD-033 JEDEC-J-STD-020 JEDECJ-STD-033 IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-033
Abstract: Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Control Procedure and , temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005 Peregrine Semiconductor
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PE3335 48-QFN PE3335EK QFN48
Abstract: , reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Peregrine Semiconductor
Original
PE3336 PE3236
Abstract: temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Peregrine Semiconductor
Original
B10D1
Abstract: temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. Document No. 70-0031-03 www.psemi.com ©2003-2005 Peregrine Semiconductor
Original
VCO 1.5 GHz PE3238-44PLCC-EVAL phas locked loop PE3238 Q3236
Abstract: temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Peregrine Semiconductor
Original
Abstract: temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005 Peregrine Semiconductor Corp. All rights Peregrine Semiconductor
Original
PE3336EK PE3336-44PLCC-27A pe3336-48qfn PE3336-44PLCC-500C 3336-21 fp13
Abstract: Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Control Procedure and , temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Document Peregrine Semiconductor
Original
Abstract: are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Level and Body temperature defined by: IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD Peregrine Semiconductor
Original
Abstract: /JEDEC-J-STD-033 2. Peak package body temperature is 225 ° C. Operator must observe ESD precautions per , bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. Document No. 70-0026-04 Peregrine Semiconductor
Original
Abstract: ANTISTATIC TUBES, PARTS BAKED AND DRY PACKED IAW IPC/JEDEC-J-STD-033B MOISTURE SENSTIVITY LEVEL =3 Skyworks Solutions
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PCB design thermal pcb guidelines LGA voiding SMT reflow profile 101752G
Abstract: /JEDECJ-STD-033A. The following table provides useful information for carrier tape and reels used for shipping Skyworks Solutions
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pcb design of a radio pcb warpage in ipc standard PCB-Design guideline for mobile phone 101752I
Abstract: , table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful Pulse Electronics
Original
TM1250HSB5
Abstract: of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for RF Micro Devices
Original
390R-5 A00025 RF3805 GSM/EDGE/CDMA2000 GSM/EDGE1800 CDMA2000 IPC/JEDECJ-STD-033A RF3805TR13
Abstract: section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table RF Micro Devices
Original
920mhz RF3807G RF3807 450MH 2700MH GSM850 GSM900
Abstract: Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for RF Micro Devices
Original
RF S-parameters RF3800G RF3800 150MH 960MH RF3800PCBA-416 DS080703
Abstract: Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for RF Micro Devices
Original
CDMA2000/W-CDMA RF3800TR13 RF3800TR7 EIA-481
Abstract: , devices may be baked according to section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A RF Micro Devices
Original
msl 9350 RF3802 AMPS/GSM850/EDGE850 GSM900/EDGE900 IS-95/CDMA2000/AMPS
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