NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: at , high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. ... | Original |
1 pages, |
JEDEC-J-STD-033 JEDEC-J-STD-020 "dry bake" JEDEC J-STD-033 IPC/JEDEC-J-STD-033 IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-033 abstract |
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| Abstract: /JEDEC-J-STD-033 Operator must observe ESD precautions per ESD Control Procedure and Parts Handling and shipping , times are desired, reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005-2010 Peregrine ... | Original |
16 pages, |
PE3336G-48QFN PE3336EK PE3336 PE3236 JEDEC-J-STD-033 PE3336-44PLCC-27A PE3336-44PLCC PE3336 abstract |
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| Abstract: temperature defined by: IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. ©2005 Peregrine Semiconductor Corp. All rights ... | Original |
15 pages, |
PE3336-44PLCC-27A PE3336 PE3335 PE3236 PE3336EK PE3336 abstract |
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| Abstract: : IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD , be subjected to high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 ... | Original |
15 pages, |
QFN48 PE3335EK PE3335 JEDEC-J-STD-033 PE3335 abstract |
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| Abstract: : IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD , be subjected to high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 ... | Original |
15 pages, |
PE3236 PE3236 abstract |
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| Abstract: temperature defined by: IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator , , reference IPC/JEDEC-J-STD-033 for bake procedure. Document No. 70-0031-03 www.psemi.com ©2003-2005 ... | Original |
15 pages, |
phas locked loop VCO 1.5 GHz PE3238 PE3238 abstract |
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| Abstract: : IPC/JEDEC-J-STD-020 IPC/JEDEC-J-STD-020 For Dry Bake Procedures, see: IPC/JEDEC-J-STD-033 Operator must observe ESD , /JEDEC-J-STD-033 for bake procedure. Document No. 70-0026-04 www.psemi.com ©2003-2010 Peregrine ... | Original |
15 pages, |
Q3236 PE3236EK PE3236-44PLCC-EVAL PE3236 PE3236 abstract |
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| Abstract: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1, 5.3, 5.4, C July 18, 2002 Revise: Sections 2.2, 3.1, 4.3, 4.4, 5.0, 5.1; Figures 3-1, 4-2, 4-3; Table 4-2, D July 25, 2003 New Format Revise: Sections Introduction, Thermal-Mechanical ... | Original |
29 pages, |
PCB-Design guideline for mobile phone pcb design of a radio PCB design SMT reflow profile datasheet abstract |
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| Abstract: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1, 5.3, 5.4, C July 18, 2002 Revise: Sections 2.2, 3.1, 4.3, 4.4, 5.0, 5.1; Figures 3-1, 4-2, 4-3; Table 4-2, D July 25, 2003 New Format Revise: Sections Introduction, Thermal-Mechanical ... | Original |
29 pages, |
SMT reflow profile thermal pcb guidelines PCB design datasheet abstract |
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| Abstract: section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table ... | Original |
18 pages, |
RF3809PCK-415 RF3809PCK-412 RF3809PCK-411 RF3809PCK-410 RF3809 GSM900 DCS1800 DCS-1800MHz cdma800 RF3809 abstract |
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