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SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments
SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
HPA00441ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments
SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0 visit Texas Instruments Buy

JEDEC J-STD-033

Catalog Datasheet MFG & Type PDF Document Tags

JEDEC J-STD-033 TAPE AND REEL

Abstract: Industry Standard IPC/JEDEC J-STD-033. Table1 provides useful information for carrier tape and reels used , parts are discussed in section 4, section 5 and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 , , table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, â'Joint Industry , . Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be
RF Micro Devices
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JEDEC J-STD-033 TAPE AND REEL RFSA2534 JESD625-A MN140910

JEDEC J-STD-033

Abstract: J-STD-033 and materials used meet the requirements defined in IPC/JEDEC J-STD-033. Moisture Barrier Bag. The moisture barrier bag used for Spansion products is in compliance with IPC/ JEDEC J-STD-033. It is designed , before use. Refer to IPC/JEDEC J-STD-033 for the bake procedure if the device carrier cannot withstand , MOISTURE SENSITIVITY To better classify the moisture sensitivity of Spansion products, the IPC/JEDEC joint
Spansion
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JEDEC J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 molecular sieve MIL-PRF-81705D

J-STD-033 PCB

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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RF5500 J-STD-033 PCB Multicore CR39 SN62 PB36 ag2 rework station diagram IPC-020b-5-1 2002/95/EC 5500010B

rf2052

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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rf2052 RFMD RF2052 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RF2052

RF2051TR13

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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RF2051 RF2051TR13 RFMD RF2051

JEDEC J-STD-033 TAPE AND REEL

Abstract: JEDEC J-STD-033 , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-5033 SUF-5033010B

JESD625-A

Abstract: SUF-8533 , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-8533 JESD625 SUF-8533010B

JEDEC J-STD-033

Abstract: J-STD-033 Standard IPC/ JEDEC J-STD-033. y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF2057 jedec JESD625-a 96SCAGS89 multicore solder paste 62 JESD625A SN62 cr39

JEDEC J-STD-033

Abstract: RF2059 Standard IPC/ JEDEC J-STD-033. y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF2059 GETEK FR4

RF119

Abstract: JESD625-A to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF119 RF1195 RF11950201

96SCAGS89

Abstract: JESD625-A Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape
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RF2053 multicore solder paste moisture handling

JESD625-a

Abstract: Multicore CR39 to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. Table 1 provides useful , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a
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SUF-1033 SUF-1033010A

RF1194

Abstract: RF1194TR7 to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033. y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033. RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033, "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el
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RF1194 RF1194TR7 RF1194TR13 smt pcb ipc standard RF11940201

JEDEC J-STD-033

Abstract: J-STD-033 materials. Components are dry-packed and sealed as shipped. Handle in accordance with IPC/JEDEC J-STD-033 procedure for components classified as IPC/JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 588 , IPC/JEDEC J-STD-033. ORDERING CODE Certified by BSI to IEC 60950 Third Edition (1999) (IEC CB
Profec Technologies
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P3188 TG25 P3188TR 6500VDC 60950-1-03/UL60950-1 E203175 FIN-03101

ASTM d882

Abstract: STM11 . These bags are tested to meet or exceed certain electrical and physical requirements of IPC/JEDEC J-STD-033 , *
3M Static Control Products
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ASTM d882 STM11 MIL-STD-3010 1104-B

D882 p

Abstract: N E C D882 QC traceability. Standards Meets electrical and physical requirements of IPC/JEDEC J-STD-033 , of IPC/JEDEC J-STD-033 MIL-PRF-81705 Type I, STATIC DISSIPATIVE POLYMER and EIA 583, for static
Static Control Components
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D882 p N E C D882 D882 h D882 MILPRF-81705 P H D882 MIL-PRF81705 D-882 1161-B

popcorn

Abstract: JEDEC J-STD-033 These containers cannot be subjected to high temperature. Reference IPC/JEDEC J-STD-033 for bake , ://www.jedec.org IPC/JEDEC J-STD 033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface , melting temperatures. In their joint standard J-STD-020 from June 2007 IPC and JEDEC differentiate , EU directive 2000/53/EC End-of-Life Vehicles (ELV): http://europa.eu.int IPC/JEDEC J-STD 020 , Recommended Reflow Soldering Conditions following IPC/JEDEC J-STD-020 tpk = 20 s max. 245.260 ° (CR) / 230
iC-Haus
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J-STD-020D popcorn IC-Haus Gmbh D-55294

1161B

Abstract: MIL-STD-3010 requirements of IPC/JEDEC J-STD-033, ANSI/ESD S541, EIA 625, and to be ANSI/ESD S20.20 program compliant , Amine Content Typical Values Test Method*
3M Static Control Products
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1161B IPC s20.20

DAA 2-4 wire

Abstract: JEDEC J-STD-033 TAPE AND REEL as shipped. Handle in accordance with IPC/JEDEC J-STD-033 procedure for components classified as IPC/JEDEC J-STD-020 Moisture Sensitivity Level 5a. Page 2 of 4 May 2005 P3000 600 ohm , 245ºC in accordance with IPC/JEDEC J-STD-033. ORDERING CODE Certified by BSI to IEC 950:1991/A4
Profec Technologies
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DAA 2-4 wire UL94V-0 3750V

P3081

Abstract: P3081TR materials. Components are dry-packed and sealed as shipped Handle in accordance with IPC/JEDEC J-STD-033 procedure for components classified as IPC/JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 459 , IPC/JEDEC J-STD-033. ORDERING CODE Certified by BSI to IEC 60950 Third Edition (1999) (IEC CB
Profec Technologies
Original
P3081 P2781 P3081TR CTR21
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