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Part Manufacturer Description Datasheet BUY
SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments
HPA00441ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments
SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 visit Texas Instruments Buy
CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0 visit Texas Instruments Buy

JEDEC FBGA

Catalog Datasheet MFG & Type PDF Document Tags

DDR2 DIMM VHDL

Abstract: JEDEC FBGA ( SI ) FBGA DRAM TSOP FBGA DRAM FBGA ? FBGA TSOP ( ) DDR2 JEDEC FGBA DRAM FBGA DRAM FBGA PDF 09005aef8172701b , DDR2 FBGA JEDEC FBGA FBGA DRAM SI , 4 1 SI / JEDEC SI
Micron Technology
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eh 11757

Abstract: 0.3mm pitch BGA parameters such as solder ball size and board thickness is also presented. JEDEC FBGA specification , Chain patterns on the FBGA package. 2. "- - - - -" Dash traces are Daisy Chain patterns on the PCB. 3 , of a separate network for the support balls. Figure 1. FBGA 32 Mb and 64 Mb Silicon Daisy Chain , slug to the substrate. Currently AMD has three types of FBGA daisy chains: Stitched Daisy Chains , DAISY CHAIN PACKAGE TYPES PB = 80-ball Fortified Ball Grid Array (FBGA) 1.00 mm pitch, 13 x 11 mm
Advanced Micro Devices
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CY7C1371DV33

Abstract: CY7C1371DV33 Acronyms Acronym CMOS CE CEN EIA JEDEC FBGA I/O JTAG NoBL OE SRAM TCK TDI TMS TDO TQFP WE chip , enable Available in JEDEC-standard Pb-free 100-pin TQFP and 165-ball FBGA packages Three chip enables for , Configurations (continued) Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout CY7C1371DV33 1 A B C D E F G H J , -ball FBGA package). When this scan cell, called the "extest output bus tristate," is latched into the , number (31:29) Device depth (28:24) Device width (23:18) Cypress device ID (17:12) Cypress JEDEC ID Code
Cypress Semiconductor
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133-MH
Abstract: CY7C1371DV33 Acronyms Acronym CMOS CE CEN EIA JEDEC FBGA I/O JTAG NoBL OE SRAM TCK TDI TMS TDO TQFP WE chip , enable Available in JEDEC-standard Pb-free 100-pin TQFP and 165-ball FBGA packages Three chip enables for , Configurations (continued) Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout CY7C1371DV33 1 A B C D E F G H J , -ball FBGA package). When this scan cell, called the "extest output bus tristate," is latched into the , number (31:29) Device depth (28:24) Device width (23:18) Cypress device ID (17:12) Cypress JEDEC ID Code Cypress Semiconductor
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transistor smd G46

Abstract: fluke 52 k/j Thermocouple FBGA User's Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV , purposes only and may be trademarks of their respective companies. FBGA User's Guide Chapter 1 , Fine-Pitch Ball Grid Array (FBGA) - - - - - - - - - - - - - - 9 Package Construction . . . . . . . . . . . . , . FBGA Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 The Impact of Die Size Changes on FBGA Package Size . . . . . . . . . . . . . . . . . . . . . . . . . 9 The
Advanced Micro Devices
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transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey BGA-64 pad AMD reflow soldering profile BGA LBA176 22142J

ep600i

Abstract: MS-034 1152 BGA Device Package Pins EP2S15 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S30 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S60 Flip Chip FBGA 484 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,020 484 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 Flip Chip FBGA 1,508 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 1,508 Table 2
Altera
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ep600i MS-034 1152 BGA processor cross reference EPM7192 MS-030 EPC-32 DS-PKG-14

bd248

Abstract: UBGA169 ), Fineline Ball Grid Array (FBGA), Ultra FineLine Ball-Grid Array (UBGA), Pin-Grid Array (PGA), Plastic , Devices Device EP2S15 Package Pins 672 Flip Chip FBGA 484 Flip Chip FBGA EP2S60 484 Flip Chip FBGA EP2S30 Flip Chip FBGA 672 Flip Chip FBGA 484 Flip Chip FBGA Flip Chip FBGA 484 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 1,020 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,508 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508
Altera
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bd248 UBGA169 HC1S6 324 bga thermal EP1800 apex dot DS-PKG-13

PQFP 176

Abstract: 240 pin rqfp drawing -Pin MBGA - Wire Bond Added 780-Pin FBGA option 2 - Wire Bond, 256-Pin UBGA - Wire Bond, 68-Pin MBGA - , added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added , (BGA), FineLine BGA® (FBGA), Ultra FineLine BGA (UBGA), Micro FineLine BGA (MBGA), Pin-Grid Array , Enhanced configuration devices Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip
Altera
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PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 EP3C16F484 FBGA 1760 144-P 100-P 256-P 780-P 1517-P 1760-P

78 ball fbga thermal resistance

Abstract: FBGA1020 ® (FBGA) packages. Table 10­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020 Flip-chip FBGA Altera Corporation
Altera
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78 ball fbga thermal resistance FBGA1020 FBGA 152 68 ball fbga thermal resistance FBGA PACKAGE thermal resistance FBGA-484 SII52010-4 EP2SGX30 EP2SGX60 EP2SGX90 EP2SGX130 508-P

EP4CE15

Abstract: MS 034 reference, package acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead , ) Ceramic Dual In-Line Package (CerDIP) FineLine BGA (FBGA) Hybrid FineLine BGA (HBGA , , Flip Chip (EP2AGX45) 572 780 572 Lidless: FBGA, Flip Chip (EP2AGX95) 780 1152 Lidless: FBGA, Flip Chip (EP2AGX125) 572 Lidless: FBGA, Flip Chip (EP2AGX125) 780 Lidless: FBGA, Flip Chip (EP2AGX125) EP2AGX260 Lidless: FBGA, Flip Chip, (EP2AGX65) Lidless: FBGA, Flip Chip
Altera
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DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark QFN "100 pin" PACKAGE thermal resistance SOIC 20 pin package datasheet

BT 1610

Abstract: FBGA 152 , respectively, are available in FineLine BGA® (FBGA) packages. Table 16­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020
Altera
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BT 1610 FBGA-484 datasheet

EP4CE6 package

Abstract: EP4CE40 code reference, package acronym, leadframe material, lead finish (plating), JEDEC outline reference , ) FineLine BGA (FBGA) Hybrid FineLine BGA (HBGA) Micro FineLine BGA (MBGA) Plastic Dual , Lidless: UBGA, Flip Chip (EP2AGX65) EP2AGX65 Lidless: FBGA, Flip Chip (EP2AGX45) Lidless: FBGA, Flip Chip (EP2AGX45) EP2AGX45 358 358 Lidless: FBGA, Flip Chip, (EP2AGX65) 572 Lidless: FBGA, Flip Chip (EP2AGX65) EP2AGZ300 (1) 572 Lidless: FBGA, Flip Chip (EP2AGX125) 780 1152
Altera
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EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z

BT 1610

Abstract: 672-FBGA ® (FBGA) packages. Table 16­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020 Flip-chip FBGA Altera Corporation
Altera
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672-FBGA FBGA 12x12 heat sink JEDEC FBGA

240 pin rqfp drawing

Abstract: BGA sumitomo FineLine BGA 484 Thermally Enhanced BGA Cavity Down 356 Non-Thermally Enhanced FBGA , Cavity Up 652 Non-Thermally Enhanced FBGA EP20K300E 652 Non-Thermally Enhanced FBGA 672 , Thermally Enhanced FBGA EP20K1000E Thermally Enhanced BGA Cavity Down Thermally Enhanced FBGA 1,020 , 24.7 22.1 17.8 256 FBGA 8.8 28.7 24.5 22.3 20.5 240 PQFP 4.0 26.0 23.4 20.8 17.1 256 FBGA 6.6 24.3 20.2 18.1 16.4 324 FBGA
Altera
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EP1C12 BGA sumitomo 724p 192 BGA PACKAGE thermal resistance epm7032 plcc FBGA672 7000B 7000AE EP1C20 DS-PKG-11 EP1SGX10D

MS-034 1152 BGA

Abstract: FBGA-484 datasheet pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 484-Pin FBGA , , respectively, are available in FineLine BGA® (FBGA) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2008 1152 Flip-chip FBGA
Altera
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AGX52014-1 MS-034 84 FBGA thermal 1152 MS 034 aaj FBGA1152 bt 146 EP1AGX90 EP1AGX60 152-P

FBGA-484 datasheet

Abstract: AGX52014-1 JEDEC Publication No. 95. 484-Pin FBGA - Flip Chip All dimensions and tolerances conform to , Altera Arria GX devices, respectively, are available in FineLine BGA® (FBGA) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2007 1152
Altera
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arria

FBGA-484 datasheet

Abstract: MS-034 1152 BGA Altera Arria GX devices, respectively, are available in FineLine BGA® (FBGA) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2008 1152 Flip-chip FBGA EP1AGX90 780 Flip-chip FBGA EP1AGX60 Flip-chip FBGA 1152 Flip-chip FBGA
Altera
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484-pin BGA moisture sensitivity

FBGA-484 datasheet

Abstract: asme y14.5m , respectively, are available in FineLine BGA® (FBGA) packages. Table 14­1. Arria GX Devices in FBGA Packages Device Package Pins EP1AGX20 Flip-chip FBGA 484 Flip-chip FBGA 780 EP1AGX35 Flip-chip FBGA 484 Flip-chip FBGA 780 EP1AGX50 Flip-chip FBGA 484 Flip-chip FBGA Altera Corporation May 2007 Flip-chip FBGA 484 780 Flip-chip FBGA EP1AGX90 1152 Flip-chip FBGA EP1AGX60 780 Flip-chip FBGA 1152 Flip-chip FBGA 1152 14­1 Package
Altera
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asme y14.5m 84 FBGA outline altera cross reference

THGBM2G7D4FBAI9

Abstract: THGBM2G6D2FBAI9 NAND 20101 64 JEDEC 32nm 32 NAND 16 , JEDEC/MMCA Version 4.43 NAND eMMCTM4 64 2 6 , 17 NAND 16 500m 1 NAND 2009 12 2 NAND 200912 3 JEDEC/MMCA(MultiMediaCard Association) NAND embedded MMC 4 embedded MultiMediaCard JEDEC/MMCA JEDEC 64GB THGBM2G9DBFBAI2 4 6 4 E D E C / M M C A J Ver. 4.4 14 x18 x1
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20101Q 20102Q THGBM2G7D4FBAI9 THGBM2G6D2FBAI9 THGBM2G8D8FBAIB THGBM THGBM2G6D thgbm2g9dbfbai2 TLP173A 20103Q 3750V

THGBM1G5D2EBAI7

Abstract: THGBM1G8D8EBAI2 2GB 43 32 THGBM1G3D1EBAI8 8 e SD JEDEC/MMCA Ver. 4.32SDA Ver , 20084Q 20084Q 20084Q 20084Q 20091Q 20091Q 20091Q 169Ball FBGA 12x18x1.4mm 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.3mm 169Ball FBGA 12x16x1.3mm 169Ball FBGA 12x16x1.3mm 153Ball FBGA 11.5x13x1.2mm 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.4mm 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.3mm 169Ball FBGA 12x18x1.3mm 169Ball FBGA 12x18x1.3mm 153Ball FBGA
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THGBM1G5D2EBAI7 THGBM1G8D8EBAI2 THGBM1G4D1EBAI7 THGVS4G8D8EBAI2 THGVS4G5D2EBAI4 169ball TLP105/TLP108 TPCA8A04-H TPC8A04-H 595TYP
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